ZXMP S330 SDH Based Multi-Service Node Equipment Hardware Descriptions Version 1.3 ZTE CORPORATION ZTE Plaza, Keji Road South, Hi-Tech Industrial Park, Nanshan District, Shenzhen, P. R. China 518057 Tel: (86) 755 26771900 800-9830-9830 Fax: (86) 755 26772236 URL: http://support.zte.com.cn E-mail: doc@zte.com.cn
LEGAL INFORMATION Copyright © 2006 ZTE CORPORATION. The contents of this document are protected by copyright laws and international treaties. Any reproduction or distribution of this document or any portion of this document, in any form by any means, without the prior written consent of ZTE CORPORATION is prohibited. Additionally, the contents of this document are protected by contractual confidentiality obligations. All company, brand and product names are trade or service marks, or registered trade or service marks, of ZTE CORPORATION or of their respective owners. This document is provided “as is”, and all express, implied, or statutory warranties, representations or conditions are disclaimed, including without limitation any implied warranty of merchantability, fitness for a particular purpose, title or non-infringement. ZTE CORPORATION and its licensors shall not be liable for damages resulting from the use of or reliance on the information contained herein. ZTE CORPORATION or its licensors may have current or pending intellectual property rights or applications covering the subject matter of this document. Except as expressly provided in any written license between ZTE CORPORATION and its licensee, the user of this document shall not acquire any license to the subject matter herein. The contents of this document and all policies of ZTE CORPORATION, including without limitation policies related to support or training are subject to change without notice. Revision History Date Revision No. Serial No. Reason for Revision 2006/10/25 R1.0 sjzl20061996 First edition
ZTE CORPORATION Values Your Comments & Suggestions! Your opinion is of great value and will help us improve the quality of our product documentation and offer better services to our customers. Please fax to: (86) 755-26772236; or mail to Documentation R&D Department, ZTE CORPORATION, ZTE Plaza, A Wing, Keji Road South, Hi-Tech Industrial Park, Shenzhen, P. R. China 518057. Thank you for your cooperation! Document Name ZXMP S330 (V1.3) SDH Based Multi-Service Node Equipment Hardware Descriptions Product Version V1.3 Document Revision Number R1.0 Equipment Installation Date Presentation: (Introductions, Procedures, Illustrations, Completeness, Level of Detail, Organization, Appearance) Good Fair Average Poor Bad N/A Accessibility: (Contents, Index, Headings, Numbering, Glossary) Good Fair Average Poor Bad N/A Your evaluation of this documentation Intelligibility: (Language, Vocabulary, Readability & Clarity, Technical Accuracy, Content) Good Fair Average Poor Bad N/A Your suggestions for improvement of this documentation Please check the suggestions which you feel can improve this documentation: Improve the overview/introduction Make it more concise/brief Improve the Contents Add more step-by-step procedures/tutorials Improve the organization Add more troubleshooting information Include more figures Make it less technical Add more examples Add more/better quick reference aids Add more detail Improve the index Other suggestions __________________________________________________________________________ __________________________________________________________________________ __________________________________________________________________________ __________________________________________________________________________ __________________________________________________________________________ # Please feel free to write any comments on an attached sheet. If you wish to be contacted regarding your comments, please complete the following: Name Company Postcode Address Telephone E-mail
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Contents About this Manual ............................................................. i Purpose ................................................................................i Intended Audience .................................................................i Prerequisite Skill and Knowledge ..............................................i What is in This Manual ............................................................i Related Manuals ................................................................... ii Conventions ......................................................................... ii How to Get in Touch ............................................................. iii Chapter 1....................................................................... 1 Cabinet ............................................................................. 1 Cabinet Structure............................................................1 Basic Cabinet Fittings ......................................................3 Cabinet Configuration ......................................................6 Chapter 2....................................................................... 9 Structural Parts................................................................ 9 Overview .......................................................................9 Subrack ....................................................................... 11 Fan Plug-in Box ............................................................ 13 Fan Box............................................................................. 13 Dustproof Unit .............................................................. 16 Power Distribution Box................................................... 17 Chapter 3..................................................................... 21 Boards ............................................................................ 21 Overview ..................................................................... 21 Subsystem Overview ........................................................... 21
Board Overview ..................................................................22 Board Slots ........................................................................24 Functional/Service Interface Board ........................................25 Functional/Service Board ......................................................26 Motherboard ................................................................ 28 NCP Unit ...................................................................... 31 Overview ...........................................................................31 NCP Board..........................................................................32 NCPI Board ........................................................................37 SC Unit........................................................................ 40 Overview ...........................................................................40 SC Board ...........................................................................41 SCI Board ..........................................................................43 CS Board ..................................................................... 46 OL16x1 Board .............................................................. 50 OL1/4x4 Board ............................................................. 54 OL1/4 Subsystem ......................................................... 58 Overview ...........................................................................58 LP1x1/LP1x2 Boards ............................................................61 LP4x1/LP4x2 Boards ............................................................63 OIS1x1/OIS1x2/OIS4x1/OIS4x2 Boards .................................66 ESS1x2 Board.....................................................................68 BIS1 Board.........................................................................69 Subsystem Configuration Example .........................................70 OA Board ..................................................................... 71 EP1 Subsystem............................................................. 75 Overview ...........................................................................75 EPE1x21/EPT1x21/EPE1B Boards ...........................................76 ESE1x21 Board ...................................................................79 BIE1x21 Board....................................................................81 Subsystem Configuration Example .........................................82 EP3 Subsystem............................................................. 83 Overview ...........................................................................83 EPE3x3/EPT3x3/EP3x3 Boards ..............................................84 ESE3x3 Board.....................................................................87 BIE3x3 Board .....................................................................88 Subsystem Configuration Example .........................................89 EOS Subsystem ............................................................ 90
Overview ........................................................................... 90 SFEx6 Board ...................................................................... 91 EIFEx4 Board ..................................................................... 95 BIFE Board ........................................................................ 96 OIS1x4 Board..................................................................... 96 Subsystem Configuration Example......................................... 98 ATM Subsystem ............................................................ 99 Overview ........................................................................... 99 AP1x4 Board ...................................................................... 99 Subsystem Configuration Example....................................... 102 RPR Subsystem .......................................................... 103 Overview ......................................................................... 103 RSEB Board ..................................................................... 104 Subsystem Configuration Example....................................... 107 PWR Board................................................................. 108 Appendix A................................................................111 Terminologies ..............................................................111 Appendix B................................................................115 Abbreviations ...............................................................115 Figures..........................................................................119 Tables ...........................................................................123
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Confidential and Proprietary Information of ZTE CORPORATION i About this Manual Purpose This manual describes cabinet structure, equipment composition, and boards of ZXMP S330 (V1.3). Intended Audience This document is intended for engineers and technicians who perform system operation activities on ZXMP S330 SDH Based Multi-Service Node Equipment. Prerequisite Skill and Knowledge Users must have SDH basic technology to use this document effectively. Familiarity with the following is helpful: ZXMP S330 system and its various components Equipment structure Boards What is in This Manual This manual contains the following chapters: T ABLE 1. CHAPTER S UMMARY Chapter Summary Chapter 1 Cabinet Describes the structure, basic fittings, and configuration of the ZXMP S330 cabinet Chapter 2 Equipment Composition Describes the components of the ZXMP S330 equipment Chapter 3 Boards Describes the boards of the ZXMP S330 Appendix A Terminologies Explains some terminologies mentioned in the manual.
ZXMP S330 (V1.3) Hardware Descriptions ii Confidential and Proprietary Information of ZTE CORPORATION Chapter Summary Appendix B Abbreviations Lists the full names of abbreviations mentioned in the manual. Related Manuals The following manuals are related to this manual: ZXMP S330 (V1.3) SDH Based Multi-Service Node Equipment System Descriptions ZXMP S330 (V1.3) SDH Based Multi-Service Node Equipment Product Descriptions ZXMP S330 (V1.3) SDH Based Multi-Service Node Equipment Installation Manual ZXMP S330 (V1.3) SDH Based Multi-Service Node Equipment Maintenance Manual ZXMP S330 (V1.3) SDH Based Multi-Service Node Equipment Operation Instructions Conventions ZTE documents employ the following typographical conventions. T ABLE 2. TYPOGRAPHICAL C ONVENTIONS Typeface Meaning Italics References to other Manuals and documents. “Quotes” Links on screens. Bold Menus, menu options, function names, input fields, radio button names, check boxes, dropdown lists, dialog box names, window names. CAPS Keys on the keyboard and buttons on screens and company name. Constant width Text that you type, program code, files and directory names, and function names. [ ] Optional parameters. { } Mandatory parameters. | Select one of the parameters that are delimited by it. Note: Provides additional information about a certain topic. Checkpoint: Indicates that a particular step needs to be checked before proceeding further. Typographical Conventions
About this Manual Confidential and Proprietary Information of ZTE CORPORATION iii Typeface Meaning Tip: Indicates a suggestion or hint to make things easier or more productive for the reader. T ABLE 3. MOUSE OPERATION C ONVENTIONS Typeface Meaning Click Refers to clicking the primary mouse button (usually the left mouse button) once. Double-click Refers to quickly clicking the primary mouse button (usually the left mouse button) twice. Right-click Refers to clicking the secondary mouse button (usually the right mouse button) once. Drag Refers to pressing and holding a mouse button and moving the mouse. How to Get in Touch The following sections provide information on how to obtain support for the documentation and the software. If you have problems, questions, comments, or suggestions regarding your product, contact us by e-mail at support@zte.com.cn. You can also call our customer support center at (86) 755 26771900 and (86) 800-9830-9830. ZTE welcomes your comments and suggestions on the quality and usefulness of this document. For further questions, comments, or suggestions on the documentation, you can contact us by e-mail at doc@zte.com.cn; or you can fax your comments and suggestions to (86) 755 26772236. You can also browse our website at http://support.zte.com.cn, which contains various interesting subjects like documentation, knowledge base, forum and service request. Mouse Operation Conventions Customer Support Documentation Support
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Confidential and Proprietary Information of ZTE CORPORATION 1 Chapter 1 Cabinet Cabinet Structure ZXMP S330 cabinet employs the “IEC 19-inch cabinet + subrack” structure. The cabinet and subracks satisfy the requirements of operation and maintenance from the front. ZXMP S330 cabinet comprises metal materials, featuring excellent electromagnetic shielding performance and heat dissipation performance. The three cabinet heights for ZXMP S330 are: 2000 mm, 2200 mm, and 2600 mm. Table 4 lists the cabinet dimensions and weights. T ABLE 4. CABINET DIMENSIONS AND WEIGHTS Dimensions (Height × Width × Depth) (Unit: mm) Weight (Unit: kg) 2000 × 600 × 300 70 2000 × 600 × 300 80 2600 × 600 × 300 90 Note: The weights are those of empty cabinets. ZTE can provide the cabinet 600 mm deep as per user requirement. The cabinet front door, rear door, and side panels are always detached in the figures shown in this manual in order to show the equipment inner structure clearly. In practice, the front door is open from the left, and the side panels cannot be detached. Description Dimensions and Weights
ZXMP S330 (V1.3) Hardware Descriptions 2 Confidential and Proprietary Information of ZTE CORPORATION Figure 1 illustrates the cabinet outline dimensions. FIGURE 1. ZXMP S330 CABINET OUTLINES Unit: mm Outline Diagram
Chapter 1 - Cabinet Confidential and Proprietary Information of ZTE CORPORATION 3 Basic Cabinet Fittings Figure 2 illustrates the basic fittings of a 2200 mm high cabinet. Table 5 briefly describes these fittings. FIGURE 2. BASIC FITTINGS OF A 2200 MM HIGH ZXMP S330 CABINET 1. Cable securing plate 2. Cable wiring clip 3. Cabinet cabling area 4. Ring trip switch 5. Ring trip reset button 6. Grounding copper busbar 7. Mounting bracket 8. Small cabling door 9. Power cable outlet 10. Top outlet 11. Alarm indicator board 12. Hook for antistatic wrist strap 13. Socket for antistatic wrist strap 14. Door lock 15. Front door 16. Bottom outlet Overview
ZXMP S330 (V1.3) Hardware Descriptions 4 Confidential and Proprietary Information of ZTE CORPORATION T ABLE 5. ZXMP S330 BASIC FITTING DESCRIPTIONS Name Location Description Alarm indicator board In the upper part of the front door Equipped with indicators to indicate the working states of subracks and power distribution box. Power cable outlet At the bottom and top of the cabinet It is used to lead external power cable out of the cabinet. A small movable door is designed on the outlet hole to close the cabinet after cabling. Cable outlet At the bottom and top of the cabinet It is used to lead the service cables and fiber pigtails other than external power cable out of the cabinet. Cabinet cabling area Area inside the cabinet and close to the side panel The cabling area has an openable and detachable small door and a cable fixing plate. Cabling clips can be installed on the fixing plate for the proper cabling of 2 M cables. The number of cabling clips can be configured flexibly according to the quantity of the cables. Ring trip switch In the middle inside the cabinet cabling area Controls ring trip status. Ring trip reset button In the middle inside the cabinet cabling area Resets ring trip status. Grounding copper busbar At the back in the cabinet It connects to the grounding terminals to the cabinet side panel, front door, subrack, power alarm box, and other components via the grounding cables to implement perfect electrical connections of the entire cabinet shell. (The grounding terminals of the subrack, power alarm box, and other components are located on the corresponding components. Figure 3 shows the locations of the grounding terminals on the side panel and the cabinet front door.) Mounting bracket Fixed in any place in the cabinet framework Supports subracks, power alarm box, and other components Socket for antistatic wrist strap In the middle inside the cabinet cabling area For installing the antistatic wrist strap Installation hole At the bottom and top of the cabinet For fixing the cabinet Heat dissipation holes On the front door, back, top, and the bottom of the cabinet For good heat-dissipation performance of the cabinet
Chapter 1 - Cabinet Confidential and Proprietary Information of ZTE CORPORATION 5 ZXMP S330 cabinet is set with the grounding copper busbar inside the cabinet and the grounding terminals on the cabinet front door and side panel, as shown in Figure 3. FIGURE 3. GROUNDING TERMINALS AND GROUNDING C OPPER BUSBAR OF ZXMP S330 CABINET 1. Grounding copper busbar 2. Grounding terminal on side panel 3. Grounding terminal on front door Grounding Terminals
ZXMP S330 (V1.3) Hardware Descriptions 6 Confidential and Proprietary Information of ZTE CORPORATION Cabinet Configuration Following points explain about integrated equipment configuration of ZXMP S330: The basic configurations of cabinets of different heights are similar. ZXMP S330 basic configuration comprises cabinet, subracks, power distribution box, and dustproof unit. User can configure one to three subracks in a 2000 mm or 2200 mm high cabinet (with fan plug-in box). User can configure one to four subracks (with fan plug-in box) in a 2600 mm high cabinet. Figure 4 illustrates the integrated equipment configuration of the ZXMP S330.Table 6 lists the configuration of the ZXMP S330 in a single cabinet. FIGURE 4. BASIC C ONFIGURATION OF ZXMP S330 E QUIPMENT 1. Power distribution box 2. Subrack 1 3. Boards 4. Fan plug-in box 5. Subrack 2 6. Subrack 3 7. Rack 8. Subrack 4 Configuration Description
Chapter 1 - Cabinet Confidential and Proprietary Information of ZTE CORPORATION 7 T ABLE 6. C ONFIGURATION OF ZXMP S330 IN A SINGLE CABINET Cabinet Height (Unit: mm) Cabinet Effective Height Number of Power Distribution Box (Height: 3U) Number of Subracks (Height: 5U) 2000 42U 1 3 2200 47U 1 3 2600 56U 1 4 Note: 1. 1 U = 44.45 mm 2. The capacity of 2 Mbps service and cablings in full configuration has been taken into account. 3. The power distribution box is the unified one of ZTE transmission equipment with the height of 3U. The ZXMP S330 equipment can cooperate with other ZTE SDH equipment flexibly, such as ZXMP S360, ZXMP S320, ZXMP S330, ZXMP S390, ZXMP S380, and ZXMP S385. Table 7 lists the configuration of ZXMP S330 cooperating with other ZTE SDH equipments in a single cabinet. T ABLE 7. ZXMP S330 C ONFIGURATION WITH OTHER ZTE SDH E QUIPMENT IN A SINGLE CABINET Cabinet Height (Unit: mm) Cabinet Effective Height Number of Power Distribution Box (Height: 4U) Subracks 2000 42U 1 ZXMP S330 (10U) and ZXMP S380 (23U) 2200 47U 1 ZXMP S330 (10U) and ZXMP S380 (23U) 2600 56U 1 ZXMP S330 (10U) and ZXMP S380 (23U) Note: 1. 1 U = 44.45 mm 2. The power distribution box configured is the dedicated one for ZXMP S380 equipment. 3. The ZXMP S380 subrack is the highest subrack of ZTE SDH equipments. Other SDH equipments (ZXMP S360, ZXMP S320, ZXMP S390, or ZXMP S385) can also be configured at the position of ZXMP S380. Cooperation with Other ZTE SDH Equipment
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Confidential and Proprietary Information of ZTE CORPORATION 9 Chapter 2 Structural Parts Overview Figure 5 illustrates the structural parts of ZXMP S330 equipment. FIGURE 5. STRUCTURAL P ARTS OF ZXMP S330 The dimensions and weights of the structural parts are listed in Table 8. T ABLE 8. DIMENSIONS AND WEIGHTS OF ZXMP S330 STRUCTURAL P ARTS Structural Part Dimensions (mm) Weight (kg) 2000 (H) × 600 (W) × 300 (D) 70 Cabinet 2200 (H) × 600 (W) × 300 (D) 80 2600 (H) × 600 (W) × 300 (D) 90 Subrack 443.7 (H) × 482.6 (W) × 270 (D) 15 Power distribution box 132.5 (H) × 482.6 (W) × 269.5 (D) 5
ZXMP S330 (V1.3) Hardware Descriptions 10 Confidential and Proprietary Information of ZTE CORPORATION Structural Part Dimensions (mm) Weight (kg) Fan plug-in Box 43.6 (H) × 436 (W) × 245 (D) - Dustproof unit 10.5 (H) × 436 (W) × 240 (D) - Functional/service interface boards PCB: 160 (H) × 80 (D) × 2 (W) Front panel: None - Functional/service boards PCB: 160 (H) × 210 (D) × 2 (W) Front panel: 25.4 (W) - Note: 1. The weight of power distribution box is that of an empty power distribution box. 2. H refers to height, W refers to width, D refers to depth.
Chapter 2 - Structural Parts Confidential and Proprietary Information of ZTE CORPORATION 11 Subrack Following points gives an overview of subrack: Comprises side panels, beams and metal guide rails, with heat dissipation and electromagnetic shielding functions. User can fix subrack in the cabinet from the front without obstructing cable layout. The installation mode can meet the requirements of maintenance from the equipment front, cabinet installation against wall, and back-to-back installation. Figure 6 illustrates the subrack structure. FIGURE 6. S UBRACK STRUCTURE 1. Top cabling area 2. Plaque 3. Board area 4. Bottom cabling area 5. Fan plug-in box 6. Dustproof unit 7. Mounting lug Overview Subrack Structure
ZXMP S330 (V1.3) Hardware Descriptions 12 Confidential and Proprietary Information of ZTE CORPORATION Table 9 briefly describes different subrack parts. T ABLE 9. BRIEF DESCRIPTIONS OF DIFFERENT S UBRACK P ARTS S.N. Name Position in the Subrack Brief Description 1 Top cabling area On the top of the subrack For leading out service cables and fiber pigtails when the upward cabling mode is employed 2 Plaque In the subrack upper-layer board area For the purposes of decoration, ventilation, and shielding. It is detachable. 3 Board area In the middle of the subrack ZXMP S330 boards are plugged in the board area. It consists of the upper layer and the lower layer. There are 17 slots at each layer, with a space of 25.4 mm between adjacent slots. Functional/service interface boards are plugged in the upper layer, while functional/service boards are plugged in the lower layer. 4 Bottom cabling area At the bottom of the subrack For leading out service cables and fiber pigtails when the downward cabling mode is employed 5 Fan plug-in box Under the subrack board area It provides forced air cooling for the equipment to dissipate the heat. The fan plug-in box accommodates three independent fan boxes, all of which are connected to the fan motherboard (FMB) for the convenience of maintenance. 6 Dustproof unit At the bottom of the subrack Prevents dust from accumulating, thus ensuring heat dissipation performance 7 Mounting lug At the back of the subrack (one each on the left and the right) For fixing a subrack in the cabinet Subrack Parts
Chapter 2 - Structural Parts Confidential and Proprietary Information of ZTE CORPORATION 13 Fan Plug-in Box Fan plug-in box dissipates heat and cools the ZXMP S330 equipment. A fan plug-in box consists of one fan motherboard (FMB) and three independent fan boxes arranged side by side. Each subrack is configured with one fan plug-in box. Figure 7 shows the structure of a fan plug-in box. FIGURE 7. STRUCTURE OF F AN PLUG -IN BO X 1. Mounting bracket 2. Fan box Fan Box Fan box has electrical connection to the fan motherboard (FMB) through the socket at the box rear side. Fan box has independent locking function, with running and alarm indicators on its front panel. A fan box consists of a box, a fan, and a fan board. Function Composition Structure Overview Composition
ZXMP S330 (V1.3) Hardware Descriptions 14 Confidential and Proprietary Information of ZTE CORPORATION Figure 8 shows the structure of a fan box. FIGURE 8. STRUCTURE OF F AN B O X 1. Fan box 2. Fan 3. Indicator 4. Button switch Controlled by the NCP board, the FAN board provides three levels of wind speed, i.e., fast, slow and stop. It provides the NCP board with the “running blocked” signal for monitoring. If a FAN board fails to communicate with the NCP board, it will control the fan to run at the fast level. Connections between fan board and other parts are as follows: FAN board and fan are connected through a 3-pin connector via the fan component conductor that comes with the fan. FAN board and FMB are connected through a 24-pin PCB crimping connector. Fan motherboard (FMB) is connected with subrack motherboard through a 12-pin socket and a 3-pin socket with fan cable and fan power backup cable, respectively. Note: For detailed description of cables, refer to Unitrans ZXMP S330 (V1.3) SDH Based Multi-Service Node Equipment Installation Manual. Fan Board Functions Fan Board Connection Relations
Chapter 2 - Structural Parts Confidential and Proprietary Information of ZTE CORPORATION 15 The location of the FAN board in the system is shown in Figure 9. FIGURE 9. FAN B OARD LOCATION IN ZXMP S330 SYSTEM Fan Motherboard (FMB) Fan Board Subrack Motherboard (MB) NCP Fan Board Fan Board
ZXMP S330 (V1.3) Hardware Descriptions 16 Confidential and Proprietary Information of ZTE CORPORATION Dustproof Unit A brand-new dustproof design adapts to ZXMP S330 to abandon the separate dustproof plug-in box. The pull-push operation mode makes periodic cleaning convenient. Cleaning label appears on the front panel in addition. Figure 10 illustrates the dustproof unit structure. FIGURE 10. STRUCTURE OF DUSTPROOF UNIT 1. Air filter 2. Front panel 3. Cleaning label The dustproof unit is installed under the fan plug-in box. It filters air and prevents dusts from entering the subrack, to ensure subrack’s electrical performance. Overview Structure Position in Cabinet
Chapter 2 - Structural Parts Confidential and Proprietary Information of ZTE CORPORATION 17 Power Distribution Box Power distribution box receives external input of active/standby power supply. Power distribution box can allocate at most six pairs of active/standby power supplies after filtering and lightning protection for the external power supply, to the subracks. A standard power distribution box can allocate four pairs of active/standby power supplies to the subracks. The power distribution box dimensions are: 132.5 mm(Height) × 482.6 mm(Width) × 269.5 mm(Depth) and its weight is 5 kg Figure 11 illustrates the power distribution box structure. FIGURE 11. STRUCTURE OF P OWER DISTRIBUTION B O X 1. Mounting lug 2. Captive fastener 3. Subrack active power supply area 4. Connection terminal of external power input 5. Subrack standby power supply area 6. Alarm indicator board (LED) 7. Front panel Power distribution box provides two groups of connection terminals to directly access -48 V external power supply. Each group comprises three connection terminals: -48 V, -48 V GND, and PGND. By default, the left group is for the active power input and the right group is for the standby power input. Power distribution box provides at most six pairs of active/standby power supplies. Overview Structure Connection Terminals Power Areas
ZXMP S330 (V1.3) Hardware Descriptions 18 Confidential and Proprietary Information of ZTE CORPORATION Each power supply includes a -48 V, a -48 V GND, and a PGND power supply, which are controlled by an air switch. Each pair of active/standby power supply provides 1+1 power supply protection for the subrack in a cabinet. The alarm indicator board (LED) displays the equipment cabinet alarms. Its alarm indicators are synchronous with those on the alarm indicator board of the equipment cabinet. There are green, yellow, and red indicators, which respectively indicate normal power supply, minor alarms, and critical/major alarms of the equipment. There are six DB9 (female) sockets on the LED board which drive alarm indicators or alarm ring, as shown in Figure 12. These sockets can be connected to totally six subracks (either of ZXMP S330 or of other SDH equipment) at the same time. Table 10 lists jacks and their signal definitions of a DB9 socket. FIGURE 12. J ACKS OF DB9 (FEMALE) S OCKET 5 1 9 6 T ABLE 10. SIGNAL DEFINITIONS OF DB9 (FEMALE) S OCKET Jack No. Signal Definition 1 RING: Alarm ring signal 2 RED: Critical or major alarm signal 3 YELLOW: Minor alarm signal 4 GREEN (-48 V): -48 V power indicator (green light) 6/7 GND: Working ground 8 -48 VGND: -48 V ground The front panel is fixed with captive fasteners at the power distribution box front side. Alarm Indicator Board (LED) Front Panel
Chapter 2 - Structural Parts Confidential and Proprietary Information of ZTE CORPORATION 19 The spaces for air switches of subrack active/standby power supplies are reserved on both the left side and the right side, with power supply ID and sequence number marked. The space for alarm indicators are reserved at the front panel middle. By default, the six air switches marked as -48V_In1 1 to 6 indicate active power supplies and those marked as - 48V_In2 1 to 6 indicate standby power supplies. The power distribution box rear part is equipped with one left and one right mounting lugs with captive fasteners. They are used to fix the power distribution box in the equipment cabinet. Power distribution box is installed on the top in the ZXMP S330 cabinet. Mounting lug Position in Cabinet
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Confidential and Proprietary Information of ZTE CORPORATION 21 Chapter 3 Boards Overview This chapter describes boards based on units and subsystems, since the boards of ZXMP S330 are designed according to the units and subsystems. Each unit or subsystem performs a certain function. The positions and connection relations of all the boards in a unit or subsystem are described in the unit/subsystem overview. The functions, functional blocks, front panel, interfaces, and indicators of a board are described in the section of this board. Subsystem Overview The boards of ZXMP S330 are designed based on units and subsystems. Each unit or subsystem performs a certain function. Table 11 lists all the units and subsystems of ZXMP S330. T ABLE 11. UNITS AND S UBSYSTEMS OF ZXMP S330 Unit ID Full Name Boards Involved SCU Synchronous clock unit SC, SCI NCPU NE control and processing unit NCP, NCPI EP1 E1/T1 electrical tributary subsystem EPE1x21, EPT1x21, EPE1B, ESE1x21, BIE1x21 EP3 E3/T3 electrical tributary subsystem EPE3x3, EPT3x3, EP3x3, ESE3x3, BIE3x3 OL1/4 STM-1/STM-4 optical line subsystem LP1x1, LP1x2, LP4x1, LP4x2, OIS1x1, OIS1x2, OIS4x1, OIS4x2, ESS1x2, BIS1
ZXMP S330 (V1.3) Hardware Descriptions 22 Confidential and Proprietary Information of ZTE CORPORATION Unit ID Full Name Boards Involved EOS Ethernet over SDH subsystem SFEx6, EIFEx4, OIS1x4, BIFE ATM ATM processing subsystem AP1x4, OIS1x4 RPR RPR processing subsystem RSEB, OIS1x4, EIFEx4 Board Overview Table 12 lists all the boards of ZXMP S330. T ABLE 12. B OARDS OF ZXMP S330 Board ID Board Name Remarks MB Motherboard - CSA Type A cross-connect board - CSB Type B cross-connect board SC Synchronous clock board - SCI (75) 75 Ω synchronous clock interface board - NCP NE control processor With orderwire function NCPI NE control processor interface board - PWR Power board - OL16x1 1-channel STM-16 optical line board - OL1/4x4 4-channel STM-1/4 optical line board The rate of optical interface can be configured as STM-1 or STM-4. LP1x1 1-channel STM-1 line processor - LP1x2 2-channel STM-1 line processor - LP4x1 1-channel STM-4 line processor - LP4x2 2-channel STM-4 line processor - OIS1x1 1-channel STM-1 optical interface board - OIS1x2 2-channel STM-1 optical interface board - OIS1x4 4-channel STM-1 optical interface board OIS4x1 1-channel STM-4 optical interface board - Board List
Chapter 3 - Boards Confidential and Proprietary Information of ZTE CORPORATION 23 Board ID Board Name Remarks OIS4x2 2-channel STM-4 optical interface board - BIS1 Bridge interface board of STM-1e Used only when protection is needed ESS1x2 Electrical switching board of STM-1ex2 - EPE1x21 (75) 21-channel E1 electrical processor (75 Ω) The interface resistance is 75 Ω EPE1x21 (120) 21-channel E1 electrical processor (120 Ω) The interface resistance is 120 Ω EPT1x21 (100) 21-channel T1 electrical processor (100 Ω) The interface resistance is 100 Ω EPE1B 21-channel E1/T1 electrical processor Supports the framing method BIE1x21 Bridge interface board of E1/T1x21 Used only when protection is needed and plugged into the interface board slot corresponding to the E1/T1 protection board ESE1x21 (75) Electrical switching board of E1x21 (75 Ω) The interface resistance is 75 Ω ESE1x21 (120) Electrical switching board of E1/T1x21 (120 Ω/100 Ω) The interface resistance is 120 Ω/100 Ω EPE3x3 3-channel E3 electrical processor - EPT3x3 3-channel T3 electrical processor - EP3x3 3-channel E3/T3 electrical processor - BIE3x3 Bridge interface board of E3/T3x3 Used only when protection is needed and plugged into the interface board slot corresponding to the E3/T3 protection board ESE3x3 Electrical switching board of E3/T3x3 - SFEx6 6-channel smart fast Ethernet board There are two types of SFEx6 board according to different encapsulation methods: SFEx6 (PPP) and SFEx6 (GFP) EIFEx4 4-channel electrical interface board of Fast Ethernet - BIFE Bridge interface board of fast Ethernet Used only when protection is needed and plugged into the interface board slot corresponding to the SFEx6 protection board AP1x4 4-channel ATM processor -
ZXMP S330 (V1.3) Hardware Descriptions 24 Confidential and Proprietary Information of ZTE CORPORATION Board ID Board Name Remarks OA Optical amplifier - RSEB Ethernet processor with RPR function - FAN Fan board - FMB Fan motherboard - These boards fall into two categories: Functional/service boards, including: MB, CSA, CSB, SC, NCP, PWR, OL16x1, OL1/4x4, LP1x1, LP1x2, LP4x1, LP4x2, EPE1x21 (75), EPE1x21 (120), EPT1x21 (100), EPE1B, EPE3x3, EPT3x3, EP3x3, SFEx6, AP1x4, OA, RSEB, FAN, FMB Functional/service interface boards, including: SCI (75), NCPI, OIS1x1, OIS1x2, OIS1x4, OIS4x1, OIS4x2, BIS1, ESS1x2, BIE1x21, ESE1x21 (75), ESE1x21 (120), BIE3x3, ESE3x3, BIFE, EIFEx4 Board Slots The board slots of ZXMP S330 subrack are arranged as in Figure 13. FIGURE 13. BOARD SLOTS OF ZXMP S330 S UBRACK Service interface board Service interface board Service interface board Service interface board Service interface board Service interface board PWR Service interface board Service interface board Service interface board Service interface board Service interface board SCI PWR Service interface board NCPI Service board CS Service board Service board Service board Service board Service board CS Service board Service board Service board Service board Service board SC SC Service board NCP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Functional/service interface boards shall be plugged in the upper layer of ZXMP S330 subrack. Except for the PWR board, functional/service boards shall be plugged in the lower layer of ZXMP S330 subrack. Categories
Chapter 3 - Boards Confidential and Proprietary Information of ZTE CORPORATION 25 Note: Service board slots 1, 2, 15, 16 only support two AU-4 buses. Service board slots 3, 4, 13, 14 support four AU-4 buses. Service board slots 5, 6, 11, 12 support sixteen AU-4 buses. Functional/Service Interface Board Except for the SCI (75) board and the NCPI board, the functional/service interface boards fall into two categories: Electrical interface/switching boards, including: BIS1, ESS1x2, BIE1x21, ESE1x21 (75), ESE1x21 (120), BIE3x3, ESE3x3, BIFE, EIFEx4 Optical interface boards, including: OIS1x1, OIS1x2, OIS1x4, OIS4x1, OIS4x2 A functional/service interface board has no front panel. It has plastic levers with self-lock function. Its PCB dimensions are: 160 mm (Height) × 80 mm (Depth) × 2 mm (Width). Categories Description
ZXMP S330 (V1.3) Hardware Descriptions 26 Confidential and Proprietary Information of ZTE CORPORATION Figure 14 (a) illustrate the typical structure of electrical interface/switching board, and Figure 14 (b) illustrate the typical structure of optical interface board. FIGURE 14. TYPICAL STRUCTURES OF ELECTRICAL I NTERFACE/S WITCHING B OARD AND OPTICAL I NTERFACE B OARD (a) Electrical interface/switching board (b) Optical interface board 1. Board label 2. Upper lever 3. Board PCB 4. Electrical or optical interface 5. Lower lever Note: The structures of all the electrical interface/switching boards are similar but not exactly the same. The structures of all optical interface boards are similar but not exactly the same. Functional/Service Board Functional/service board has a front panel. Its levers are made of aluminum alloy, and have the functions of shielding and self-lock. The front panel dimensions are: 181.5 mm (Height) × 25.4 mm (Width). Structure Description
Chapter 3 - Boards Confidential and Proprietary Information of ZTE CORPORATION 27 The PCB dimensions are: 160 mm (Height) × 210 mm (Depth) × 2 mm (Width). The structures of various functional/service boards are similar but not exactly the same. Figure 15 takes the OL16x1 board as an example and illustrates the structure of a typical functional/service board. FIGURE 15. TYPICAL STRUCTURES OF F UNCTIONAL /SERVICE B OARD 1. Lever 2. Front panel 3. Interface 4. Conductive fabric 5. Board PCB Structure
ZXMP S330 (V1.3) Hardware Descriptions 28 Confidential and Proprietary Information of ZTE CORPORATION Motherboard Motherboard is the carrier that connects various boards together. Motherboard also functions as an interface that connects ZXMP S330 with external signals. There are the service bus, overhead bus, clock bus, and board-in-position bus on the motherboard. Motherboard communicates with the ZXMP S330 equipment, boards, and external signals via interfaces and sockets. There are tin bands serving as ground cables in the front and rear of the motherboard where the motherboard contacts the subrack, to ensure electrical connection between the subrack and motherboard. The sockets and interfaces of motherboard can be divided into the upper layer and the lower layer. Functional/service interface boards are connected to the upper layer sockets. Functional/service boards are connected to the lower layer sockets. Figure 16 illustrates the distribution of the sockets and interfaces on the motherboard. And these sockets and interfaces are described in Table 13, Table 14, and Table 15. FIGURE 16. MOTHERBOARD DIAGRAM 1. Service interface board socket 2. Service board socket 3. SC board socket 4. CS board socket 5. NCP board socket 6. NCPI board socket 7. 15 A black connector post 8. Indicator board alarm interface 9. Power supply interface 10. Power alarm interface 11. SCI board socket Functions Composition Sockets and Interfaces
Chapter 3 - Boards Confidential and Proprietary Information of ZTE CORPORATION 29 T ABLE 13. DESCRIPTION OF I NTERFACES ON THE MOTHERBOARD Interface Description Power supply interface DC power input for the subrack is input through it. Uses the 3-jack D-type socket, with the jacks of -48 V GND, PGND, and -48 V from top to bottom. It is connected with the power board if the power board is used. 15 A black connector post It is the system protection ground and uses a pre-insulation terminal. It is connected to the busbar via subrack protection ground cable Indicator board alarm interface Used for subrack alarm output; Connected to the alarmindicator/ring-drive socket on the alarm indicator board of the power distribution box via the indicator board alarm cable or the indicator board alarm ring-trip cable Adopts the DB15 socket (female) as shown in Figure 17. The signal definitions of jacks are described in Table 14. Power alarm interface Used for subrack power alarm output. If no power board inserted, the power alarm cable is connected to the first power alarm interface on the left. If the power board is inserted, it is connected to the power board. Adopts the DB15 socket (female) as shown in Figure 17. The signal definitions of jacks are described in Table 15. Note: For detailed description of cables, refer to Unitrans ZXMP S330 (V1.3) SDH Based Multi-Service Node Equipment Installation Manual. FIGURE 17. I NDICATOR B OARD ALARM I NTERFACE 8 1 15 9 T ABLE 14. SIGNAL DEFINITIONS OF ALARM OUTPUT I NTERFACE J ACKS Jack No. Signal Definition 4 -48 V GND: -48 V power indication (green light) 5 GREEN (-48 V): -48 V power indication (green light) 12 RING: Alarm ring signal 13 RED: Critical or major alarm signal 14 YELLOW: Minor alarm signal 15 GND: Working ground
ZXMP S330 (V1.3) Hardware Descriptions 30 Confidential and Proprietary Information of ZTE CORPORATION T ABLE 15. SIGNAL DEFINITIONS OF P OWER ALARM I NTERFACE J ACKS Jack No. Signal Definition 1/9 -48 V ready1 +/-: The first line of power supply is in position. 2/10 LOWOUT1+/-: The first line of power supply is undervoltage 3/11 HIGHOUT1+/-: The first line of power supply is overvoltage. 6/13 -48 V ready2 +/-: The second line of power supply is in position. 7/14 LOWOUT2+/-: The second line of power supply is undervoltage. 8/15 HIGHOUT2+/-: The second line of power supply is overvoltage. Dimensions of the ZXMP S330 motherboard are: 432 mm (Height) × 322 mm (Width) × 4 mm (Depth) Motherboard is fixed at the rear part of a subrack. Dimensions Position in Subrack
Chapter 3 - Boards Confidential and Proprietary Information of ZTE CORPORATION 31 NCP Unit Overview NCP unit is the network element control and processing unit. It comprises an NCP board and an NCPI board. The grey part in Figure 18 illustrates the positions of NCP and NCPI boards in ZXMP S330 subrack. FIGURE 18. POSITIONS OF NCP AND NCPI B OARDS IN ZXMP S330 S UBRACK Service interface board Service interface board Service interface board Service interface board Service interface board Service interface board PWR Service interface board Service interface board Service interface board Service interface board Service interface board SCI PWR Service interface board NCPI Service board CS Service board Service board Service board Service board Service board CS Service board Service board Service board Service board Service board SC SC Service board NCP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Figure 19 illustrates the NCP unit position in the system and its connection relations with other boards. FIGURE 19. CONNECTIONS BETWEEN NCP UNIT AND OTHER B OARDS NCP board NCPI board External alarm input/output SC board Service board Reference clock input NCP Unit Description Position in Subrack Connection Relations
ZXMP S330 (V1.3) Hardware Descriptions 32 Confidential and Proprietary Information of ZTE CORPORATION NCP Board Sends the configuration commands to other boards and collects their performance data and alarms Exchanges EMS information between NEs through ECC channel. Through the Qx interface, NCP board reports to the SMCC the alarms and performance messages of this NE and of the subnet to which the NE belongs, and receives the commands and configurations sent by the SMCC to the NE and to the subnet to which the NE belongs. Detects the fan running status, and reports alarm once the fan stops running. Shuts down or starts the fan according to the EMS command. Provides a four-digit DIP switch to set the software state: f NCP software state may be "Download" or "Running". f The Download state: Set the DIP switch to all ON. It is used to download applications and NCP parameter configuration. f The Running state: Set the DIP switch to not all ON and not all OFF. It is used to start the NCP board application and makes the NCP board to enter the normal running state. Following points explain about OW functions of NCP board: f Implements orderwire interworking between NEs via the E1 and E2 bytes f Provides two voice channels that are independent with each other. The system can support up to 16 orderwire directions. f Achieves calls based on point-to-point, point-tomultipoint, point-to-group, and point-to-the entire line. Dual tone signaling is adopted for point-to-point calls. The contact signaling acts as the man-machine interface through the keys on the telephone set, which must be a dual-tone type. f Represents the received dialing and E1/E2 DTMF signaling, decides the channel status according to the signaling, and controls the phone connection. Following five phone connection states are available: i. Phone connected to E1 channel Functions
Chapter 3 - Boards Confidential and Proprietary Information of ZTE CORPORATION 33 ii. Phone connected to E2 channel iii. Phone connected to "dial tone & busy tone generating circuit" iv Phone connected to the ring current signal v. Free (off-hook and without being called) f Sets orderwire numbers via the EMS f Prevents the orderwire from being looped through EMS settings f The orderwire software can be downloaded online by the EMS Figure 20 shows the NCP board functional blocks. FIGURE 20. F UNCTIONAL BLOCK DIAGRAM OF NCP B OARD Control unit Real-time clock Qx interface ECC interface Board-in-position detection Board reset control NE alarm output External alarm input Fan and subrack power monitoring Table 16 describes the functional blocks of NCP board. T ABLE 16. DESCRIPTION OF NCP B OARD F UNCTIONAL BLOCKS Functional Block Function Real-time clock It serves to confirm the exact time of alarm generation and disappearance during NE monitoring. To ensure the accurate timing after poweroff, the standby chargeable battery will supply power instead when a power failure is detected. Functional Blocks
ZXMP S330 (V1.3) Hardware Descriptions 34 Confidential and Proprietary Information of ZTE CORPORATION Functional Block Function QX interface Qx interface is a communication interface between the NE and the Subnet Management Control Center (SMCC). With the Qx interface, NCP can report to SMCC the alarm and performance information of the current NE and of the subnet, and can receive the commands and configurations sent from SMCC to the NE and the subnet. ECC interface The NCP board provides the ECC bus for each line board. The EMS manages the whole subnet via the interconnection between the ECC of the access NE’s NCP and that of the other NEs’ NCPs in the subnet. Control unit Controls the work of other functional blocks. Board-in-position detection Detects the board in-position information External alarm input, NE alarm output Monitors external alarms and outputs alarms in the NE Board reset control Conducts hard reset of all the boards in the NE Fan and subrack power monitoring unit Detects the fan running status, and reports alarm once the fan stops running. Shuts down or starts the fan according to the EMS command. Detects the over/under-voltage of the subrack power.
Chapter 3 - Boards Confidential and Proprietary Information of ZTE CORPORATION 35 Figure 21 shows the NCP board front panel. FIGURE 21. NCP B OARD F RONT P ANEL 1. Indicators (RUN, OW, and ALM) 2. f Interface 3. Qx interface 4. Orderwire interface (OW) 5. Ring trip button (BELL-OFF) 6. Reset button (RESET) 7. Antistatic wrist strap socket (ESD GROUND) Table 17 describes the indicators on the NCP board front panel. T ABLE 17. I NDICATORS ON NCP B OARD F RONT P ANEL Indicator Name Description RUN Indicator of NCP board working status (green). Refer to Table 18 for details. OW Orderwire ringing indicator (red/green). If the NCP board is working normally, the green indicator flickers periodically. When there is an incoming orderwire call, the red indicator is on. ALM Alarm indicator (red). Refer to Table 18 for details. Front Panel Indicators
ZXMP S330 (V1.3) Hardware Descriptions 36 Confidential and Proprietary Information of ZTE CORPORATION Table 18 lists possible states of the RUN and ALM indicators. T ABLE 18 DESCRIPTIONS OF RUN AND ALM I NDICATORS RUN Indicator ALM Indicator Meaning Flickers at 1 Hz periodically Constantly off Board is running normally Flickers at 1 Hz periodically Constantly on Flickers at 1 Hz periodically Flickers at 1 Hz periodically Constantly on Flickers at 5 Hz periodically Constantly on Flickers at 1 Hz periodically Flickers at 5 Hz periodically Flickers at 5 Hz periodically Flickers at 5 Hz periodically Flickers at 1 Hz periodically Flickers at 5 Hz periodically Constantly on Fault or alarm occurs to the board during running. Table 19 describes the interfaces and buttons on the NCP board front panel. T ABLE 19. I NTERFACES AND BUTTONS ON NCP B OARD F RONT P ANEL Name Description f interface Interface between an NE and portable equipment. Adopts the RJ45 socket QX interface Communication interface between SMCC and the NE. Adopts the RJ45 socket. Orderwire interface (OW) Orderwire interface. Adopts the RJ11 socket. Ring trip button (BELLOFF) Controls ring alarms. Press this button to stop a ring alarm if ring is ringing upon board alarm. When a new alarm arises, the ring will ring again. When the NCP board is being reset, press this button for a while, the NCP board will enter the Download status. Reset button (RESET) Resets the NCP board by pressing this button. Antistatic wrist strap socket (ESD GROUND) Connects the antistatic wrist strap Refer to the Overview section of NCP unit. Interfaces and Buttons Position in Subrack
Chapter 3 - Boards Confidential and Proprietary Information of ZTE CORPORATION 37 NCPI Board The NCPI board provides the user loop trunk interface, alarm output interface of column head cabinet, and F1 interface/external alarm input interface. Figure 22 shows the functional blocks of NCPI board. FIGURE 22. F UNCTIONAL BLOCK DIAGRAM OF NCPI BOARD Motherboard Loop trunk interface unit Alarm input/output control unit User loop trunk interface Alarm output interface to column head cabinet Codirectional interface unit F1 interface/ External alarm input interface Table 20 describes the functional blocks. T ABLE 20. DESCRIPTION OF NCPI B OARD F UNCTIONAL BLOCKS Functional Block Function Description Loop trunk interface unit Receives and sends orderwire interconnection signals. Alarm input/output control unit Sends the equipment alarm signal to the alarm output interface of column head cabinet. Sends the external alarm signals received from the F1 interface/external alarm input interface to the motherboard for processing. Codirectional interface unit Receives and sends 64 K codirectional data signals. None None Functions Functional Blocks Front Panel Indicator
ZXMP S330 (V1.3) Hardware Descriptions 38 Confidential and Proprietary Information of ZTE CORPORATION Figure 23 shows the interfaces on NCPI board. Table 21, Table 22, and Table 23 describe the interfaces of NCPI board. FIGURE 23. NCPI B OARD I NTERFACES 1. User loop trunk interface (TRK) 2. Alarm output interface to column head cabinet 3. F1 interface/External alarm input interface T ABLE 21. F UNCTIONS OF NCPI B OARD I NTERFACES Interface Name Functions User loop trunk interface (TRK) Connects orderwire calls between two subnets. Uses the RJ11 socket. Alarm output interface of column head cabinet Outputs the equipment alarms (minor alarms, major alarms, critical alarms, and audio alarms) to the column head cabinet. Uses the DB9 socket (female). Signal definitions of the jacks are listed in Table 22. F1 interface/ External alarm input interface Inputs external alarms (smog, water, entrance control, fire, temperature, etc.), and connects the 64 K codirectional interface equipment. Uses the DB15 socket (female). Signal definitions of the jacks are listed in Table 23. T ABLE 22. SIGNAL DEFINITIONS OF J ACKS ON ALARM OUTPUT I NTERFACE TO C OLUMN HEAD CABINET Jack No. Signal Definition 1/6 RING+/-: Alarm ringing signal, 0.5 A contact 2/7 RED+/-: Critical/major alarm signal, 0.5 A contact Interfaces