Semiconductor For You February 2026 Issue

Magazine | News | Industries EDITION #9 | FEBRUARY 2026EXPLORING INDIA’S SEMICONDUCTOR AMBITIONSTECH INSIGHTSemiconductorForu.comTECH TRENDS 2026TOPINDIA IN THE FAST LANE OF AUTOMOTIVE INNOVATIONSILICON WINGS OVER CITIESEDGE PROCESSING PAVES THE WAY FOR FASTER, MORE ACCURATE MILLIMETER WAVE SCANNING

E D I T I O NA N N I V E R S A RCATALOG Y

Table ofContentsTechnology Updates 0648546066101622283238Tech SpotlightTrending NowIndia in the fast lane of automotive innovationTop Tech Trends 2016Edge processing paves the way for faster, More accurate millimeter wave scanningEngineering & Design\"Making India a value-creation engine for software-led mobility.\" \"Pramid Nanjundaswamy, Vice President & Head of Delivery ALTEN India.\"Industry Dialogs48V Power Systems powering the next generation of intelligent Robots.Blog BeatSilicon wings over citiesBlog BeatEmbedded intelligence in Refrigeration: A semiconductor perspectiveBlog BeatInside India's push to scale PCB ManufacturingViksit Bharat Meity WorkshopIndustry BulletinEvent SpotlightBusiness Unboxed44Choosing the right silicon for AI: CPUs, GPUs, & FPGAs explainedBlog Beat

For more Information, contact:Pranali AgarwalT : +91 22 4255 4772 | E:[email protected] | productronica-india.comHost stateIndia's POWERPLAYin ElectronicsWhy Attend?Meet leading suppliersNetwork with industry leaders and government representativesGain insights through industry conferences and curated events2026 20268-9-10 April 2026 | India Expo Mart, Greater Noida4,000+ Products ondisplay400+ Exhibitors20+ParticipatingcountriesVISITScan to Pre-Register for Express Entry.

06 | www.semiconductorforu.comTECHNOLOGY UPDATESVishay Intertechnology has introduced new 1200 V silicon carbide (SiC) MOSFET power modules in the industry-standard SOT-227 package to improve power efficiency in high-performance applications. The modules support current ratings from 50 A to 200 A and feature integrated soft body diodes that help reduce switching losses. Designed for use in solar inverters, EV charging systems, SMPS, DC-DC converters and UPS, the devices enable higher switching frequencies and improved thermal performance. The SOT-227 form factor allows easy drop-in replacement without PCB redesign, supporting compact, efficient and reliable power system designs across industrial and automotive sectors.Vishay Launches 1200 V SiC MOSFET Power Modules in SOT-227 Package 2NEC Corporation has developed a compact, high-efficiency power amplifier module for sub-6 GHz 5G base station radio units. Using gallium nitride (GaN) technology, advanced load modulation and high-density mounting, the module achieves around 50% power-added efficiency while significantly reducing size. As power amplifiers account for a major share of radio unit power consumption, the new design helps lower overall energy use and operating costs. The module measures just 10 mm × 6 mm, supporting more compact radio units. NEC plans to integrate the technology into next-generation 5G base stations from fiscal 2026, targeting global deployment.3 NEC Develops Compact High-Efficiency Power Amplifier for 5GInertial Labs, a VIAVI Solutions company, has introduced IRINS, a Low Earth Orbit (LEO)-aided inertial navigation system designed for reliable positioning, navigation and timing in GNSS-denied or degraded environments. The system integrates an inertial navigation system, altitude and heading reference system, and a LEO-based PNT receiver into a single platform. By combining tactical-grade MEMS sensors with LEO satellite signals, IRINS ensures accurate position, velocity and timing even under jamming or spoofing conditions. The rugged, compact solution targets land, air and maritime applications requiring resilient navigation for defense, aerospace and critical infrastructure operations.1 VIAVI Launches IRINS LEO-Aided Navigation System

TECHNOLOGY UPDATESwww.semiconductorforu.com | 07Samtec has made its Generate® high-speed 0.80 mm pitch edge card sockets (HSEC8 series) available for immediate delivery, including through its free sample program. These sockets use Samtec’s Edge Rate® contact system optimized for high-speed, high-cycle applications with improved signal integrity and longer contact life thanks to a milled smooth mating surface that reduces wear. The connectors support modular designs where cards can be easily swapped and deliver shorter signal paths by eliminating one connector in the chain. The HSEC8 series comes in vertical, right-angle and edge-mount orientations, with options like side latches, board locks and weld tabs for enhanced mechanical strength. Emerson has expanded access to its modular NI PXI test platform by introducing new cost-effective automation hardware, making scalable automated test systems more attainable for engineering teams. The additions include high-resolution oscilloscopes, multifunction I/O modules, embedded controllers and a hybrid chassis, all designed to preserve precision, reliability and high channel density while lowering cost barriers. These new PXI components integrate with NI software like LabVIEW, InstrumentStudio and TestStand to streamline automated test development, simplify system integration and support future-ready applications. By reducing costs, Emerson aims to enable broader adoption of modular test solutions.Samtec’s High-Speed 0.80 mm Pitch Edge Card Sockets Now AvailableEmerson Broadens Access to Modular Test Platform56Microchip Technology has expanded its maXTouch M1 family of touchscreen controllers to support a wider range of automotive display sizes, from compact 2–5 inch panels up to free-form widescreens of about 42 inches. The additions — ATMXT3072M1-HC for large displays and ATMXT288M1 for smaller screens — work with OLED and microLED technologies and use Microchip’s Smart Mutual touch acquisition scheme to improve touch signal-to-noise ratio by up to 15 dB versus previous generations, enabling4 Microchip Expands maXTouch M1 Touchscreen Controller Seriesreliable detection even with high capacitive loads and noise. The larger controller can span combined cluster and center displays, simplifying hardware design, while the smaller device’s compact package reduces PCB area for space-constrained applications.

08 | www.semiconductorforu.comTECHNOLOGY UPDATESAnritsu Corporation showcased a broad suite of next-generation 6G and wireless test solutions at MWC 2026 in Barcelona (Hall 5 Stand D41), underscoring its vision for trustworthy, sustainable, high-performance connectivity. The exhibits include software-centric tools for early 6G standardization and validation, an AI-powered 6G measurement and test system, and a unified RF multiband and non-terrestrial network (NTN) validation platform. Additional 8 Anritsu Unveils 6G Test & AI-Driven Solutions at MWC 2026TDK Corporation has extended its high-performance MEMS inertial sensor lineup with the Tronics AXO315®T1, a high-temperature MEMS accelerometer for energy market applications such as measurement while drilling (MWD) in oil and gas. The AXO315T1 operates up to +175 °C, surpassing its predecessor’s +150 °C capability, and offers a ±14 g input range with a digital interface for harsh downhole environments. Using TDK’s closed-loop architecture, it delivers significantly improved vibration rectification and reduced size, weight and power (SWaP) compared to traditional quartz accelerometers. With a lifetime exceeding 1000 hours at high temperatures, the sen7 TDK Expands High-Temperature MEMS Accelerometer Portfolio sor supports accurate inclination measurement and paves the way for advanced drilling tools in extreme conditions.innovations include field simulation testing for digital twin development, cloud-based automotive validation for ADAS and software-defined vehicles, and sustainable IoT power consumption evaluation. Arrow Electronics is supporting Romanian startup .lumen in scaling production of its intelligent guide glasses designed for visually impaired users. The wearable device uses artificial intelligence, multiple integrated cameras and real-time haptic feedback to help users navigate safely by detecting obstacles and providing directional guidance. All processing is performed locally, ensuring low-latency and reliable operation without cloud dependence. The smart glasses, recognized at CES 2026 for innovation in accessibility, aim to improve independent mobility and quality of life for people with visual impairments.9 Arrow Electronics Supports Scaling of Smart Glasses for the Blind

TECHNOLOGY UPDATESwww.semiconductorforu.com | 09VIAVI Solutions has integrated a new augmented reality (AR) solution called RF Viewer into its OneAdvisor 800 Wireless test platform to make radio frequency (RF) analysis more intuitive and accessible. RF Viewer overlays real-time RF signal strength and distribution data onto a live video feed, enabling technicians and engineers to visually locate and assess RF emissions in physical environments. Developed in collaboration with Verizon Wireless, the tool supports tasks such as network deployment, smart building design and RF safety evaluation by helping identify signal intensity, location and spread more clearly. Emerson has expanded access to its modular NI PXI test platform by introducing new cost-effective automation hardware, making scalable automated test systems more attainable for engineering teams. The additions include high-resolution oscilloscopes, multifunction I/O modules, embedded controllers and a hybrid chassis, all designed to preserve precision, reliability and high channel density while lowering cost barriers. These new PXI components integrate with NI softwareVIAVI Introduces AR RF Signal Visualization ToolIntel Unveils Next-Gen “Panther Lake” AI PC Chip at CES 20261011like LabVIEW, InstrumentStudio and TestStand to streamline automated test development, simplify system integration and support future-ready applications. By reducing costs, Emerson aims to enable broader adoption of modular test solutions.

10 | www.semiconductorforu.com TECH SPOTLIGHT Automobiles are rapidly transforming into intelligent, software-driven platforms powered by advanced electronics. Simplified vehicle architectures, high-performance safety processors, and accelerating electrification are redefining design priorities. With India emerging as a key hub for electric mobility and semiconductor engineering, silicon is becoming central to how future vehicles are built, connected, and continuously enhanced.INDIAIN THE FAST LANE OFAUTOMOTIVE INNOVATION

www.semiconductorforu.com | 11TECH SPOTLIGHTAutomobiles are transforming into intelligent, software-defined platforms shaped by advanced electronics. Simplified electrical architectures, high-performance ADAS processors, and rapid electrification—especially across India—are redefining vehicle design and manufacturing. As semiconductors move to the core of mobility innovation, the future vehicle is being engineered around compute, connectivity, and efficiency rather than mechanics alone.

12 | www.semiconductorforu.com TECH SPOTLIGHT THE SILENT TRANSFORMATION OF THE AUTOMOBILEINTELLIGENCE DRIVING THE SAFETY REVOLUTIONThe automotive industry is in the midst of a transformation more profound than the shift from carburetors to fuel injection. Today’s vehicles are evolving into intelligent machines—defined less by metal and mechanics, and more by electronics, software, and silicon. From entry-level electric scooters to premium connected cars, electronics have become the backbone of performance, safety, efficiency, and user experience.This change is not driven by a single innovation, but by the convergence of several powerful trends: restructured electrical systems, intelligent driver assistance, electrification, and a strategic rethink of semiconductors as longterm enablers rather than simple components. Together, these forces are reshaping how vehicles are designed, built, and continuously improved over their lifetimes.Among the most visible outcomes of advanced automotive electronics is the rapid spread of intelligent safety features. Technologies that help drivers avoid collisions, stay within lanes, and remain alert are quickly becoming standard expectations rather than premium add-ons. Behind these features lies a new generation of automotive processors designed to interpret massive volumes of REIMAGINING THE VEHICLE'S ELECTRONIC BACKBONEFor years, automotive electronics evolved by addition. Every new feature—be it power windows, airbags, or infotainment—brought another dedicated control unit. Over time, this approach led to growing complexity, heavier wiring harnesses, higher costs, and integration challenges.What’s trending today is consolidation. Vehicle electronics are being reorganized around fewer, more powerful computing nodes that manage entire sections of the vehicle. Instead of dozens of isolated modules, intelligence is grouped and coordinated, reducing redundancy and enabling faster communication.This architectural evolution is critical for modern vehicles, particularly electric and connected ones. Fewer control units mean lower weight, improved energy efficiency, and a cleaner foundation for software updates and future features. As Hitesh Garg, Vice President and India Managing Director, NXP Semiconductors, explains:“When vehicle systems become extremely complex, the only way to scale is to simplify the architecture. Consolidated compute allows automakers to innovate faster while maintaining reliability and safety.”This shift also enables a key industry goal: vehicles that improve over time. With centralized and regional computing platforms, manufacturers can introduce new features, performance enhancements, and safety upgrades through software—long after the vehicle has left the factory.

www.semiconductorforu.com | 13TECH SPOTLIGHTof sensor data in real time. Cameras, radar, ultrasonic sensors, and driver-monitoring systems continuously feed information into dedicated safety processors capable of instant decision-making.What defines today’s trend is not just better sensors, but smarter processing. Instead of treating each safety function in isolation, modern vehicles fuse data across multiple sensors, improving accuracy and responsiveness. This integrated intelligence is essential as the industry moves toward higher levels of driving automation.Such systems demand automotive-grade semiconductors with exceptional reliability, functional safety compliance, and long lifecycle support—making chip selection a strategic decision for automakers.SOFTWARE TAKES THE DRIVER'S SEATELECTRIFICATION AMPLIFIES THE ROLE OF ELECTRONICSAnother defining shift in automotive electronics is the rise of the software-defined vehicle. Increasingly, vehicle capabilities are shaped by code rather than fixed hardware logic. From infotainment interfaces to energy management and safety algorithms, software has become a primary differentiator.This transition allows vehicles to receive over-the-air updates, unlock new features, and adapt to changing regulations or user expectations. For consumers, it means vehicles that stay current. For manufacturers, it creates opportunities for continuous engagement and new business models.However, this also places enormous responsibility on the underlying electronics. Semiconductors must support long-term software evolution, strong cybersecurity, and real-time performance. Chips are no longer static components; they are platforms designed to remain relevant for a decade or more.Electrification has accelerated the importance of automotive electronics like never before. Electric vehicles require significantly more semiconductor content than conventional vehicles, spanning battery management, power conversion, motor control, thermal systems, and charging interfaces.Efficient power electronics directly influence driving range, charging speed, and overall vehicle reliability. Advanced control algorithms, combined with high-performance power semiconductors, are enabling smaller, lighter, and more efficient EV platforms.At the same time, electronics are playing a crucial role in making EVs more affordable. Integrated designs, reduced component counts, and smarter architectures are helping manufacturers optimize costs while improving performance—a key requirement for mass adoption.

14 | www.semiconductorforu.com TECH SPOTLIGHT INDIA'S MOMENTUM IN THE ELECTRONICS-DRIVEN MOBILITY ERA CONNECTIVITY, SECURITY, AND THE DATA-DRIVEN VEHICLECHALLENGES ON THE ROAD AHEADIndia’s mobility landscape is changing rapidly. Electric two-wheelers, passenger cars, and commercial EVs are gaining traction, supported by policy incentives, urban demand, and growing environmental awareness. With this growth comes a sharp increase in demand for automotive electronics.What’s particularly significant is India’s evolving role beyond consumption. The country is strengthening its position in semiconductor design, embedded software, validation, and system engineering—critical layers of the global automotive value chain.Global semiconductor companies are expanding engineering operations in India, collaborating with local talent on solutions designed for both domestic and international markets. Vehicles developed with Indian use cases in mind are increasingly influencing global platforms. As Hitesh Garg of NXP Semiconductors observes:“India is no longer just a fast-growing market for automotive electronics. It is becoming a place where future vehicle platforms are architected, designed, and taken global.”Modern vehicles are no longer standalone machines. They are connected nodes within a larger mobility ecosystem, interacting with infrastructure, cloud platforms, and other vehicles. This connectivity enables predictive maintenance, smarter navigation, fleet optimization, and enhanced user experiences.However, increased connectivity also introduces new challenges. Cybersecurity and data protection are now fundamental design requirements. Automotive electronics must incorporate security at the hardware level, ensuring trust across millions of lines of code and years of operation.This has elevated demand for secure processing, hardware-based encryption, and robust authentication mechanisms—making security as critical as performance.Despite strong momentum, the journey is not without obstacles. Semiconductor supply resilience, long qualification cycles, and the need for specialized talent remain pressing challenges. Automotive electronics demand exceptional quality and reliability, leaving little room for compromise.Bridging skill gaps across electronics, software, and system integration will be essential, particularly as vehicles continue to merge digital and physical domains.

www.semiconductorforu.com | 15TECH SPOTLIGHTCONCLUSION: MOBILITY DEFINED BY SILICONQUOTESThe future of mobility will be shaped less by engines and more by electronics. Vehicles are becoming intelligent platforms—capable of sensing, learning, and evolving over time. Simplified architectures, intelligent safety processing, electrification, and software-centric design are redefining what a vehicle can be.For India and the global automotive industry alike, semiconductors are no longer behind the scenes—they are at the center of innovation. As the industry moves forward, silicon will not just support mobility; it will define it.“Future vehicles demand a tightly integrated approach where compute, connectivity, and control electronics work as a single system rather than isolated functions.”MALINI NARAYANAMOORTHIVice President & Country Head, Renesas Electronics IndiaHITESH GARGVice President & India Managing Director, NXP SemiconductorsGANESH MOORTHYPresident & Managing Director, Microchip Technology India“The modern vehicle is no longer built around mechanical systems; it is engineered around compute, software, and intelligence at every level.”“India’s automotive electronics journey is moving beyond assembly and adoption. The real shift is toward designing intelligent, scalable platforms that can serve both local and global mobility needs.”

16 | www.semiconductorforu.com TOPTECH TRENDS2026TRENDING NOW

www.semiconductorforu.com | 17SEVEN TRENDS IN THE SEMICONDUCTORSECTOR FOR 2026TRENDING NOW

In 2026, a new class of intelligent machines will emerge. Several of the trends we’ve identified are natural extensions of those we highlighted at the start of 2025 with the new year’s advancements driven by the widespread deployment of existing technologies. Industrial sectors, robotics, automotive, consumer electronics and smart homes will all benefit from increased autonomy, underpinned by the specialized silicon platforms and advanced processing that will make this a reality.The foundation will continue to be semiconductor material innovation. Silicon carbide (SiC), gallium nitride (GaN) and silicon photonics will support increasing demands for efficient power conversion, thermal management, and data transmission. Architectural advances in neural processors, imaging sensors, microcontrollers and microprocessors will enhance the capabilities of autonomous and intelligent systems. Security of these systems will remain in sharp focus. In summary, our view for 2026 is: smarter machines will be built on faster and more secure semiconductor technologies.Figure 1: Specialized silicon platforms underpin autonomy in robotics, automotive, consumer electronics and smart homes18 | www.semiconductorforu.com Edge AI innovation continues to be the lynchpin connecting these trends. In 2025, we saw the momentum of more AI finding its way to the edge. For 2026, this momentum accelerates, as embedded AI finds its way into almost every category of device and sensor. These edge AI and TinyML-enabled devices will benefit from enhanced awareness and analytical capabilities, in turn enabling them to act more autonomously. We will also see the emergence of more domain- and application-specific AI chips, optimized for workloads in different environments and sectors. The next evolution of robotics (see below), industrial systems, automobiles, smart home technology, consumer devices and more will be supported by powerful and energy-efficient AI at the edge. In turn, these will become more active participants and partners in every aspect of our lives.Large language models (LLMs) – AI trained on massive text datasets – have been dominant in the AI discussion of recent years. As highlighted last year, these advancements, along with those in neural pro1. Edge AI: Everything, everywhere, all at once2. Robots start speaking a different languageTRENDING NOW

www.semiconductorforu.com | 19Last year we predicted how the ability to use traditional semiconductor technologies would help advance the development of quantum computing. This has been the case, and the coming year will see quantum computers based on FD-SOI processes move from the lab to deployment. However, in 2026, the quantum-related priority for all organizations will relate to one topic: cybersecurity. Cybercriminals are already preparing to add quantum computing to their armory through cryptographically-relevant quantum computers (CRQCs). They are harvesting encrypted data today, confident that quantum computing will provide the power to access it in the future – which poses a real and immediate risk to every organization. Post-quantum cryptography (PQC) provides a solution; PQC algorithm standards being established and made available to preemptively secure devices and software. The time to act is now. Self-driving taxis provide the highest profile examples of the progress of autonomous vehicles, underpinned by advances in LiDAR, AI-enabled cameras, and integration with infrastructure. The number of cities around the world allowing the use or trial of so-called “robotaxis”, notably in the US and Asia, grew significantly in 2025, suggesting positive momentum. Challenges remain, with Level 4 autonomy remaining restricted to controlled environments (Level 5 being complete autonomy in any environment) and major manufacturers scaling back timelines to full autonomy. Consumer confidence is also a barrier to adoption, though studies have shown that acceptance is far 3. Quantum progress becomes a cyber priority4. A tipping point for autonomous vehicles?TRENDING NOWFigure 2: Large Action Models (LAMS) will enable “embodied AI”, robots that can interpret surroundings, making decisions and perform tasks in the physical world.cessing, allowed machines to “think” better. A new type of model will help turn thinking into action in 2026. New large action models (LAMs), sometimes called vision-language-action (VLA) models, are enabling robots to interpret their surroundings, make decisions, and perform tasks in the physical world, what some are calling “embodied AI”.LAMs supporting robotic inference will drive the widespread emergence of edge AI-powered cobots working alongside humans, deployments of humanoid robots, and autonomous industrial systems that act independently with advanced sensing and motor control. The combination of enhanced intelligence and dexterity will pave the way for robotics to move from factories into retail, hospitality, and the home.

20 | www.semiconductorforu.com higher following use. With the opportunities increasing for consumers to experience the benefits, along with technological enhancements and efficiencies, 2026 should see progress accelerate.In 2026, several trends will converge to transform domestic technology. Edge AI, advances in connectivity protocols such as Matter and Thread, and approaches to security adopted from the commercial environment will make our homes smarter, better connected, and more secure.Improving the collection and sharing of data between domestic devices along with increased intelligence at the edge will act as a force multiplier, delivering what analyst Gartner has defined a “ambient intelligence”. Among other benefits, this will allow for the creation of domestic digital twins, a concept we touched on in 2025 as an opportunity in every sector, optimizing the efficiency of our homes.As smart homes become more intelligent and connected, cybersecurity will be an increasing concern. We expect to see principles crossing over from commercial environments to the home, and in particular best practice such as a Zero Trust approach to security in smart home technologies.As we predicted in 2025, there has been no slowdown in the desire to launch more satellites into space, and particularly those low Earth orbit (LEO) satellites forming part of the communications mega-constellations. 2026 will see advancements in how these satellites are used to provide truly global connectivity. For communications network operators, the decision between traditional terrestrial networks and the growing mega-constellations of low Earth orbit (LEO) satellite networks is no longer “either/or”, but “both”. Mobile network operators are already integrating LEO networks as backhaul, filling coverage gaps in earth-based networks or to improve connection speeds.This integrated use of networks will continue in 2026, creating a unified “network of networks”, managed by AI and advancing towards goals for seamless global connectivity. The economic and educational benefits to previously unconnected parts of the globe will be huge, with significant additional enhancements to connectivity across worldwide consumer, commercial and industrial sectors.Imaging technology provides the foundation for many of the innovations that allow devices to operate more effectively and efficiently. Yet the central concept of lenses as stacks of curved glass to refract light has remained unchanged for centuries. Metasurface technology shifts this paradigm by recreating optical functions on perfectly flat, ultra-thin layers patterned with nanostructures. Imaging becomes smaller, less costly, and more flexible wherever it is embedded. Imaging improvements will impact every area of life, work, and industry, from more spatially-aware robotics and automobiles, to more secure devices, from enhanced photography to applications that vastly improve power efficiency.5. Homes become even smarter, better connected and more secure6. The integration of satellite and terrestrial networks7. A revolution in imagingTRENDING NOW

www.semiconductorforu.com | 21Technology rarely moves in straight lines, but the direction is becoming clearer. The trends emerging for 2026 indicate a world shaped by greater autonomy, deeper intelligence, strong intelligence and more, all shaped by advances in semiconductor technologies. The opportunity for organizations that understand these trajectories early enough is to simply react but to shape what comes next. The systems designed today will define how people live, work and connect with each other in the years to come.The future is already taking form, it’s a matter of how boldly we choose to build it.2026 wrappedTRENDING NOW

Edge Processing Paves the Way for Faster, More Accurate Millimeter Wave ScanningBarley Li, Applications Engineering Manager – Technical Content, APAC, DigiKeyENGINEERING & DESIGN 22 | www.semiconductorforu.com

ENGINEERING & DESIGNwww.semiconductorforu.com | 23Millimeter wave (mmWave) imaging systems are becoming increasingly common in security operations at public buildings, stadia, and airports. These systems can detect both metallic and non-metallic threats and report their location within the scan area, allowing security professionals to locate and identify suspicious items more quickly. This article will discuss the basics of mmWave imaging, explain how components work together in a mmWave solution designed by Analog Devices, Inc. (ADI), and highlight the role of edge processing in more nimble iterations of the technology.In an mmWave system, an array of transmitters and receivers is connected to a spatially dispersed antenna array. At a given point in time, one antenna in the array is transmitting a low-power, single-frequency, omnidirectional radio frequency (RF) signal that reflects off the target (Figure 1). This reflection generates backscattered signals Figure 1: In mmWave systems, transmitting antennas sequentially broadcast low-power, single-frequency, omnidirectional signals. Receiving antennas then measure backscatter. (Image source: Analog Devices, Inc.)1. mmWave 101

ENGINEERING & DESIGN 24 | www.semiconductorforu.com that are received by all the antennas in the array. Integrated circuits (ICs) attached to the antennas measure the phase and amplitude of the received backscatter signals. Identical signals are sent from each transmitting antenna sequentially, and the measurement process is repeated for each transmission. Repeating the entire procedure over multiple frequencies between 10 GHz and 40 GHz ensures that the system captures varying RF-signal penetration depth and signal reflections as frequency changes.Resolution depends on the number of transmit and receive channels. Airport scanners, for instance, have many channels to support the resolution needed to detect small objects like razor blades. A lower channel count in situations where weapons and explosives are the main concerns lowers cost and scanning time.Processors combine the backscatter information into a matrix of vectors. When the vectors are correlated with frequency and spatial location, the resulting multidimensional array can be used to create an image that can identify both metallic and non-metallic objects that are concealed between and underneath layers of clothing.The speed of the scan depends on how quickly the system can process backscatter data, switch from transmitter to transmitter, and cycle through the desired frequencies. For example, a system with 500 elements that covers the 10 GHz to 40 GHz range in 50 MHz increments must make 300,000 switches. Fast switching allows today’s deployed mmWave systems to create a useful image when the person being scanned has posed for just a few seconds. With still faster switching times, mmWave systems could detect threats while subjects walk through detectors without pausing.To detect potential threats, achieve the desired resolution, and facilitate quick scanning, mmWave system designers must select hardware that works in tandem. ADI’s integrated mmWave system solution includes an ADF4368 microwave wideband synthesizer, multiple ADAR2001 transmitter ICs, multiple ADAR2004 receiver ICs, and AD9083 analog-to-digital converters (ADCs), each of which will be discussed in turn below (Figure 2).Figure 2: A complete mmWave system combines a synthesizer, transmitters, receivers, and ADCs with power management, switching, and logic components. (Image source: Analog Devices, Inc.)2. Building mmWave systems

ENGINEERING & DESIGNwww.semiconductorforu.com | 25The signal chain begins with the ADF4368 microwave wideband phase-locked loop (PLL) synthesizer with integrated voltage-controlled oscillator (VCO) (Figure 3). The ADF4368 generates frequency steps from 2.5 GHz to 10 GHz in 12.5 GHz increments, well within its 800 MHz to 12.8 GHz range. The continuous wave (CW), single-ended RF signals have jitter under 30 fsecRMS.The ADF4368 outputs signals with 9 dBm (7.94 mW) power. Because the transmitter ICs need much less power, ADF4368 outputs can be split seven times, driving up to 128 4-channel transmitter ICs or 512 channels.The ADAR2001 transmitter ICs (Figure 4) accept input from the ADF4368, then multiply, filter, attenuate, split, and amplify the signals to provide four antenna output channels per IC with frequencies between 10 GHz and 40 GHz.ADAR2001 ICs accept RF inputs with a minimum power of -20 dBm (0.01 mW). The signal then passes through a high-band, mid-band, or low-band 4x frequency multiplier and filter. Next, a programmable attenuator provides approximately 15 dB of digital step attenuation range, increasing attenuation as frequency decreases to maintain a flat power output across the frequency range.The signal is then split into four streams, each going to its own power amplifier (PA). Each of the differential PAs has a nominal output of +5 dBm (3.2 mW), -20 dBc to -30 dBc of harmonic suppression, and a low-pass/notch filter enabled for output frequencies up to 20 GHz. PA outputs drive differential antenna structures such as dipole or spiral antennas. Figure 3: The ADF4368 microwave wideband synthesizer with integrated VCO supplies low jitter CW RF outputs over the 2.5-GHz-to-10-GHz frequency range. (Image source: Analog Devices, Inc.)Figure 4: The ADAR2001 transmitter IC multiplies, filters, attenuates, and amplifies RF signals that step through the 10 GHz to 40 GHz range and output through differential antennae. (Image source: Analog Devices, Inc.)

ENGINEERING & DESIGN 26 | www.semiconductorforu.com Advanced sequencers, also called state machines, are preprogrammed with multiplier and filter-block settings to optimize each frequency step. The system then goes through the states in response to pulses to the device’s MADV (advance) pin rather than waiting for instructions from an external controller. This local control allows the system to switch between channels every 2 nsec.Signals that are broadcast omnidirectionally from the antennas and reflected off the subject are then picked up by an array of ADAR2004 receivers (Figure 5). These ICs combine quad mixers and ADC drivers with a digitally programmed gain amplifier (DGA).In the ADAR2004, each channel of the incoming signal passes through a quad low-noise amplifier (LNA). Then it is mixed with an offset local oscillator (LO) input between 2.4 GHz and 10.1 GHz that passes through a 4x multiplier to match the imaging frequency. The resulting output is at an intermediate frequency (IF) below 800 MHz. A variable gain amplifier (VGA) supplies 21 dB to 41 dB of gain to the IF output.Like the ADAR2001 transmitter, the ADAR2004 receiver has two on-chip state machines that can be preprogrammed to optimize amplifier and filter settings for each reflected frequency step. The system can quickly switch between states with a simple advance or reset command without waiting for external controller input.The AD9083 (Figure 6), a 16-channel ADC with a 2 GSPS sample rate and 100 MHz bandwidth, receives inputs directly from the ADAR2004 output. A shared common-mode voltage allows the two to connect directly without AC-coupling capacitors that can produce unwanted transients.Figure 5: The ADAR2004 4-channel receiver IC combines reflected 10 GHz to 40 GHz signals with an LO input to generate IF outputs up to 800 MHz. (Image source: Analog Devices, Inc.)Figure 6: The AD9083 16-channel ADC uses a continuous-time sigma-delta architecture and has an onboard digital downconverter and signal processing. (Image source: Analog Devices, Inc.)

ENGINEERING & DESIGNwww.semiconductorforu.com | 27In the AD9083, input from the ADAR2004 is filtered and converted to a digital signal using a continuous-time sigma-delta (CTSD) architecture. Filters can include cascaded integrator comb (CIC) filters; quadrature digital downconverters (DDCs) with multiple finite input response (FIR) decimation filters, also known as a decimate by J block; or up to three quadrature DDC channels with averaging decimation filters.The combination of CTSD conversion and the filters in the AD9083 produces a lower frequency, high-bit signal with fast settling time, a key characteristic in allowing data processing to keep up with the fast channel switching on the transmit side. The AD9083 provides edge processing by extracting the signal band of interest without external processing, and by synchronizing with other ICs using an on-chip clock and PLL.The chipset described above reduces screening time by synchronizing switching, eliminating unnecessary signal processing stages, and reducing switching time. Larger arrays of four-channel ADAR2001 transmitters with matching ADAR2004 receivers and AD9083 ADCs can further cut the required screening time.In such an array, an advanced sequencer is preprogrammed to cycle each channel through the required frequency steps. While one IC is transmitting, the next is entering ready mode to allow fast switching between ICs. With a channel-to-channel switching time of 2 nsec and a ready-state-to-transmission time of 10 nsec, the system can sweep from 10 GHz to 40 GHz in 0.1 GHz steps in about 20 msec.To further decrease scan time, the transmit ICs could be divided into three groups, each driven by its own PLL. Each group of ADAR2001s could transmit a different frequency, allowing three frequencies to be transmitted at once. The AD9083s on the receiving side can demodulate three frequencies at once, one for each of their three quadrature DDC channels, as long as all three frequencies are within the ADC’s 125 MHz analog input bandwidth. This approach reduces the overall scan time by a factor of three.ADI’s mmWave chipset described above integrates the ADF4368 microwave synthesizer, ADAR2001 quad transmitters, ADAR2004 quad receivers, and AD9083 16-channel ADCs. These ICs are designed to work in sync and reduce downstream processing by providing intelligent on-chip edge processing.On-chip processing supplies the central processor with data that is already demodulated and decimated and ready for AI or other higher-level processing. In addition, integration and intelligent edge coordination allows an entire scan to be completed in fractions of a second, paving the way for systems that allow those entering secured spaces to walk through the scanning area without stopping.3. Speedier screeningConclusion

INDUSTRY DIALOGS 28 | www.semiconductorforu.comMAKINGINDIAA VALUECREATIONENGINE FOR SOFTWARELED MOBILITY1. What does your role at ALTEN India involve, and how do you shape the company’s automotive business strategy?The automotive industry is undergoing its most profound transformation in decades -shifting from mechanically driven platforms to software-led, connected, and sustainable mobility. At ALTEN India, my role is centered on helping our customers navigate this shift with speed, scale, and confidence.As Vice President and Head of Delivery at ALTEN India, I lead delivery across industries, with automotive being a core strategic focus. ALTEN India plays a dual role – we are both a global engineering hub for the ALTEN Group and a trusted partner to local automotive customers, delivering advanced engineering and IT services across the automotive value chain.For our global business, we provide market, customer, technology, competitive and talent intelligence that helps shape long-term automotive growth strategies. We enable scalable onsite–offshore delivery models that combine cost efficiency with speed, resilience and access to specialized talent at scale. Our technology focus spans software-defined vehicles, electrification, ADAS and autonomous systems, connectivity, embedded software, cloud platforms, data engineering, and AI-driven engineering.For the local automotive ecosystem, we drive solutioning, thought leadership and future-ready talent development. Our teams bring strong global exposure in areas such as EV powertrains, battery management systems, vehicle electronics, cybersecurity, digital manufacturing, and PLM/ALM transformation, while remaining closely aligned with local regulatory and market needs.At a strategic level, our ambition is clear: to make ALTEN India a value-creation engine for automotive customers—helping them transition to software-led, connected, and sustainable mobility while positioning ALTEN as a long-term innovation partner.In this exclusive interview, Vaishali Umredkar, Editor of Semiconductor For You speaks with Pramod Nanjundaswamy, Vice President and Head of Delivery at ALTEN India, on how engineering, software, and AI are redefining the automotive landscape. The conversation explores ALTEN India’s role in enabling EVs, software-defined vehicles, and advanced automotive electronics, while addressing localization challenges, functional safety, and future-ready mobility platforms shaping India’s automotive transformation.\"\"

INDUSTRY DIALOGSwww.semiconductorforu.com | 29PRAMOD NANJUNDASWAMYVice President & Head of Delivery ALTEN India

INDUSTRY DIALOGS 30 | www.semiconductorforu.com 2. How would you define ALTEN’s automotive business in India amid rapid shifts toward EVs and software-defined vehicles?5. How is ALTEN leveraging AI to enhance automotive electronics development and system performance?3. Which automotive electronics trends will most strongly influence vehicle platforms in the coming years?ALTEN’s automotive business in India is shaped by two powerful and converging forces. First, the strong growth of the local automotive market is accelerating localization and technology adoption, creating significant opportunities for engineering-led innovation. We are working closely with almost all major OEMs as they transition toward electric vehicles, software-defined vehicles and autonomous and assisted driving—supporting them with faster localization, platform adaptation and customer-centric engineering tailored to Indian user expectations and operating conditions.Second, global OEMs are increasingly expanding their outsourcing footprint to India to accelerate the adoption of next-generation automotive technologies. India has become a strategic hub for software, electronics and AI led digital engineering, enabling faster innovation cycles, access to specialized talent and scalable delivery. Together, these dynamics position ALTEN India as a key enabler and a trusted partner for both local and global automotive transformation in the EV, SDV and Autonomous era.ALTEN applies AI across the automotive engineering to enhance user experience, improve Software-defined vehicles will be the most transformative force shaping future vehicle platforms. Electrified, safe and secure, sustainable, connected, and hyper-personalized vehicles will define the next generation of mobility, with software becoming the primary differentiator across the vehicle lifecycle.From an engineering perspective, AI-led automation, model-based systems engineering (MBSE), digital twins, and virtualization-driven validation are redefining how vehicles are architected, tested, and scaled, enabling faster development cycles and improved quality in increasingly complex systems. Architecturally, the transition to centralized and zonal compute platforms, supported by highspeed networks and standardized vehicle operating systems, is simplifying vehicle electronics and 4. Where is ALTEN seeing the highest demand across its automotive electronics and engineering portfolio?ALTEN is seeing the strongest demand in electric and software-defined vehicle programs, particularly for software-centric capabilities on the edge, such as model-based engineering, embedded software, hardware design, middleware, vehicle operating systems and AI-led automation across development and validation environments including MIL, SIL and HIL. This is complemented by growing demand for digital technologies such as cloud platforms, data analytics, visualization and virtualization, which are increasingly embedded across engineering, validation, and lifecycle operations. Alongside this, vehicle design, computer-aided engineering (CAE), and system integration and validation continue to see sustained demand, driven by ongoing model launches and platform refreshes across both global and local OEMs.In addition, localization-led value engineering, supply-chain–aligned programs, and digital manufacturing initiatives are gaining momentum as OEMs focus on cost competitiveness, faster industrialization and lifecycle efficiency.and enabling OTA-ready, scalable architectures.On the user experience and connectivity front, multi-modal HMI—incorporating AR/VR, voice, gesture, and gaze—along with 5G, emerging 6G, and V2X technologies are enabling immersive, context-aware and cooperative mobility experiences.Advances in sensors, next-generation power electronics, in-cabin intelligence, and edge AI—combined with cybersecurity-by-design and functional safety—are enhancing vehicle performance, safety and reliability. Finally, sustainability-driven engineering, supply-chain diversification, and data-centric vehicle platforms are shaping resilient, future-ready automotive ecosystems.

INDUSTRY DIALOGSwww.semiconductorforu.com | 316. How does ALTEN support OEMs and Tier-1 suppliers in functional safety, compliance, and complex system integration?7. What are the key challenges holding back India’s automotive electronics ecosystem, and how can engineering partners help overcome them?productivity, and accelerate time to market. At the vehicle edge, AI enables hyper-personalized user experiences through intelligent HMI, driver behaviour learning and context-aware features, while also supporting ADAS and autonomous vehicle development through edge-based computation.Across the engineering lifecycle, ALTEN applies AI to software development, model-based engineering and automated validation across MIL, SIL, and HIL environments, improving efficiency, quality, and development speed. AI is also used in project and delivery management to enhance planning accuracy, risk prediction, and execution predictability. Beyond development, ALTEN leverages AI in aftermarket and service engineering for intelligent diagnostics, predictive maintenance, automated documentation, and AI-driven customer support, as well as in manufacturing for vision-based inspection, process optimization, and intelligent factory operations.ALTEN is continuously embedding AI into its solutioning and delivery frameworks through reusable AI accelerators. In parallel, ALTEN’s strategic partnership with Mistral AI enables the deployment of secure, customized generative AI solutions for automotive and industrial use cases, supported by strengthened internal capabilities including dedicated training and a Prompt Engineering Academy.In addition, ALTEN’s expertise with global premium OEMs in vehicle-level and system-level integration of advanced technologies enables effective localization, end-to-end validation, and regional engineering support. We also support customers in building intelligent and precision manufacturing plants required for advanced vehicle technologies, including the design and integration of robotics, automated test equipment (ATEs), inspection and vision systems, PLCs and smart factory controls. Together, this helps customers manage complexity, accelerate deployment, and confidently bring next-generation vehicles to market.ALTEN supports OEMs and Tier-1 suppliers across the full lifecycle of functional safety–critical systems, including the design and certification of solutions up to the highest automotive safety integrity level, ASIL-D. Our functional safety experts bring deep experience across mechanical, hardware, software, and manufacturing domains, supported by rigorous validation and certification processes. We combine this with strong domain expertise in powertrain, chassis systems, cockpit electronics, and ADAS, enabling customers to design systems that are not only safe and secure, but also robust and production-ready. ALTEN’s subject matter experts closely track evolving global and regional regulatory requirements and work hand in hand with OEMs and Tier-1s to ensure compliant system design, development, and validation.India’s automotive electronics ecosystem faces several structural and technology-led challenges as vehicles become increasingly electrified, connected and software-driven. One of the primary challenges is building a resilient supply chain that enables the localization of advanced technologies, including automotive electronics, semiconductors, and critical materials such as rare earth metals. This is closely tied to the need for advanced manufacturing capabilities that can support the production of high-tech, highly integrated and precision-engineered vehicles at scale.Another major constraint is the availability of robust testing and validation infrastructure, particularly for connected and autonomous features such as V2X, which depend not only on vehicle readiness but also on supporting road and digital infrastructure. In addition, many ADAS and autonomy features developed for global markets do not directly translate to Indian driving conditions, requiring significant fine-tuning, filtering and customization to ensure safety, reliability, and broader adoption.Challenges also remain in access to high-performance compute environments, high-resolution and precision 3D map data, sufficient test and training data for AI models, and the widespread deployment of enabling technologies such as 5G—all of which are critical for next-generation vehicle platforms. Geopolitical uncertainties impacting global supply chains and export markets, along with the need to stay continuously aligned with evolving local and international regulatory and compliance requirements, further add to the complexity.

32 | www.semiconductorforu.com BLOG BEAT POWERING THE NEXT GENROB48V POWER

www.semiconductorforu.com | 33BLOG BEATNERATION OF INTELLIGENTBOTSR SYSTEMS

34 | www.semiconductorforu.com BLOG BEAT As robotics evolves toward higher autonomy, mobility, and intelligence, traditional low-voltage power architectures are reaching their limits. The 48V power system is emerging as a practical and efficient alternative, balancing safety with high power delivery. This article examines how 48V architectures are reshaping robotic design, enabling compact form factors, longer operating life, and scalable performance across diverse applications.Robotics innovation is often associated with artificial intelligence, advanced sensors, and sophisticated software. Yet, beneath these visible advancements lies a less glamorous—but equally critical—foundation: power architecture. As robots transition from stationary industrial machines to mobile, collaborative, and autonomous systems, the way they are powered is undergoing a fundamental change.For decades, 12V and 24V systems dominated industrial electronics. While proven and familiar, these voltage levels are increasingly inadequate for modern robots that integrate high-torque motors, advanced compute platforms, and power-hungry sensors. At the same time, high-voltage systems introduce safety concerns and regulatory complexity, particularly in human-centric environments. Positioned between these extremes, 48V power systems are rapidly gaining traction as the preferred backbone for next-generation robotic platforms.“In modern robotics, power architecture is no longer a secondary design choice—it is a strategic enabler of performance, safety, and scalability.”

www.semiconductorforu.com | 35BLOG BEATThe appeal of a 48V system lies in its ability to deliver higher power with significantly lower current. Compared to 12V or 24V architectures, a 48V system can reduce current by a factor of two to four for the same power level. This simple electrical relationship unlocks multiple system-level benefits.THE 48V ADVANTAGEToday’s robots perform tasks that demand far more energy and precision than their predecessors. Autonomous mobile robots (AMRs) navigate dynamic environments, robotic arms execute complex multi-axis movements, and humanoid robots balance agility with endurance. These capabilities place immense demands on power delivery.Operating at lower voltages means higher current for the same power output. High current leads to increased conduction losses, excessive heat generation, bulky cables, and reduced overall efficiency. For battery-powered robots, this directly impacts runtime and reliability. Moreover, thermal constraints limit how compact and lightweight robotic designs can become—an issue for applications where space and payload are critical.WHY TRADITIONAL POWER SYSTEMS ARE FALLING SHORTLower current translates into reduced resistive losses across cables, connectors, and power electronics. For robots operating continuously or in energy-constrained environments, even small efficiency gains can result in meaningful improvements in uptime and operating costs.Thinner cables, smaller connectors, and reduced thermal management requirements allow designers to shrink form factors and reduce weight. This is particularly valuable for mobile and collaborative robots, where agility, speed, and payload capacity are key differentiators.Robotic motion systems benefit directly from 48V operation. Higher voltage enables faster response, better torque control, and smoother motion without the need for heavy insulation or complex safety mechanisms associated with high-voltage designs.HIGHER EFFICIENCY, LOWER LOSSESCOMPACT AND LIGHTWEIGHT DESIGNIMPROVED MOTOR AND ACTUATOR PERFORMANCE123One of the most compelling aspects of 48V systems is their safety profile. Voltages below 60V DC are widely considered extra-low voltage, significantly reducing the risk of electric shock. This makes 48V especially suitable for robots designed to work alongside humans.SAFETY WITHOUT COMPROMISE

36 | www.semiconductorforu.com BLOG BEAT Modern robotic platforms are increasingly modular. Sensors, compute modules, actuators, and communication systems are often developed and upgraded independently. A 48V power backbone supports this modularity by enabling efficient power distribution across the system.Localized DC-DC converters can step down 48V to lower voltages such as 24V, 12V, or 5V close to the load. This approach improves fault isolation, reduces noise, and enhances system robustness. It also allows manufacturers to reuse power architectures across different robot models, accelerating development and reducing costs.Artificial intelligence is becoming central to robotics, enabling perception, learning, and autonomous decision-making. AI workloads require significant computational power, often delivered through GPUs, NPUs, or specialized accelerators. Supplying this power efficiently—without excessive heat—is a growing challenge.A 48V system supports high-power compute modules more effectively than traditional low-voltage rails. Reduced current lowers thermal stress on power delivery networks, enabling more powerful processing within compact enclosures. This capability is essential as robots take on increasingly complex tasks in unstructured environments.A MODULAR POWER BACKBONEENABLING AI-DRIVEN ROBOTICS“As robotics becomes AI-driven and software-defined, 48V power systems provide the electrical foundation needed to scale intelligence efficiently.”Collaborative robots, medical robots, and service robots in public spaces must meet strict safety requirements. A 48V architecture simplifies compliance while still supporting the power demands of advanced functionality. Unlike high-voltage systems, it avoids the need for extensive isolation, shielding, and safety enclosures.Battery technology is a key driver behind the adoption of 48V systems. Many lithium-ion battery configurations naturally align with a nominal 48V output, reducing the need for complex voltage conversion. Fewer conversion stages mean higher efficiency, lower losses, and improved reliability.For mobile robots, this alignment offers tangible benefits: longer operating hours, faster charging cycles, and improved battery lifespan. A well-designed 48V battery system also simplifies battery management and thermal control—critical factors for fleetscale deployments.BATTERY ALIGNMENT AND ENERGY STORAGE

www.semiconductorforu.com | 37BLOG BEATDespite its advantages, transitioning to 48V is not without challenges. Engineers must consider component availability, transient load handling, electromagnetic compatibility, and regenerative energy management. However, the ecosystem is maturing rapidly.Power semiconductor vendors are introducing 48V-optimized ICs, motor drivers, and reference designs tailored for robotics and automation. As adoption grows, economies of scale are driving down costs and accelerating innovation across the supply chain.The shift to 48V power systems represents more than an incremental improvement—it signals a broader rethinking of robotic system design. As robots become more autonomous, connected, and intelligent, their power architectures must evolve accordingly.By balancing safety, efficiency, and scalability, 48V systems are well positioned to become the standard power backbone for next-generation robots. For designers and manufacturers, embracing this architecture today offers a clear path toward future-ready platforms.Power may not capture headlines like AI or autonomy, but it remains the backbone of robotic innovation. The rise of 48V power systems reflects a deeper understanding that performance, safety, and efficiency are inseparable at the system level. As robotics continues to expand into new domains, 48V architectures will play a defining role in enabling machines that are not only smarter—but also more practical, reliable, and ready for real-world deployment.DESIGN CHALLENGES AND ECOSYSTEM MATURITYLOOKING AHEADCONCLUSIONThe momentum behind 48V systems is evident across a wide range of robotic applications:These applications share a common requirement: delivering more power without compromising safety, efficiency, or design flexibility.Autonomous Mobile Robots (AMRs): Extended runtime & improved efficiency for logistics & warehousingIndustrial Robotics: Higher power density for compact, high-performance robotic armsHumanoid and Legged Robots: Lightweight wiring and dynamic motion supportMedical Robotics: Safe, reliable power for patient-facing systemsService Robotics: Efficient energy use in public and commercial environmentsAPPLICATIONS DRIVING ADOPTION

38 | www.semiconductorforu.com BLOG BEAT

www.semiconductorforu.com | 39BLOG BEATWINGS OVER CITIESSILICONHow Semiconductors Are Powering the Rise of Flying Taxis

40 | www.semiconductorforu.com BLOG BEATUrban transportation is approaching a breaking point. Chronic congestion, rising emissions, and limited space for new roads are forcing cities to think vertically rather than horizontally. In this context, heli-taxis and electric vertical take-off and landing (eVTOL) aircraft are rapidly shifting from futuristic concepts to near-term mobility solutions. While sleek aircraft designs and vertiports capture public imagination, the real transformation is happening inside these vehicles—powered by advanced semiconductor technolBLOG BEAT Electric vertical take-off and landing (eVTOL) aircraft, popularly known as flying taxis, are redefining urban mobility by offering fast, low-emission, and congestion-free transport. Behind this revolution lies advanced semiconductor technology, enabling electric propulsion, intelligent flight control, autonomy, and safety. As cities prepare for urban air mobility, silicon—not rotors alone—will determine how high and how safely this new transport paradigm flies.ogies that make urban air mobility (UAM) viable, safe, and scalable.Flying taxis represent not just a new vehicle category, but a new transportation system. Their success depends on precision electronics, intelligent power management, real-time sensing, & AI-driven autonomy. In many ways, eVTOLs are the ultimate expression of “Transportation 5.0,” where electrification, connectivity, autonomy, & sustainability converge in the air.\"Urban air mobility will not be defined by how fast an aircraft can fly, but by how intelligently its electronics can think, sense, and respond.\"

BLOG BEATwww.semiconductorforu.com | 41Traditional helicopters have existed for decades, yet they never became a mass-market urban transport option. High noise levels, mechanical complexity, operational costs, and emissions limited their use to niche applications such as emergency services or VIP travel. eVTOL aircraft aim to overcome these constraints by rethinking propulsion, control, and energy use from the ground up.Unlike helicopters, eVTOLs use multiple electric motors distributed across the airframe. This distributed electric propulsion architecture enables quieter operation, higher redundancy, and simpler mechanical systems. Fewer moving parts reduce maintenance needs, while electric power eliminates tailpipe emissions during operation. As battery energy density improves and production scales up, the cost per passenger mile is expected to fall sharply, opening the door to mass-market adoption.This transition from mechanical to electrical systems mirrors what the automotive industry experienced over the past decade—only now, it is happening in three dimensions.BLOG BEATFrom Helicopters to eVTOLs:A Structural ShiftA growing ecosystem of companies is racing to define the future of urban air mobility. Some focus on piloted eVTOLs designed for early certification, while others are pushing fully autonomous aerial vehicles from day one.Manufacturers are prioritizing scalable production, certification readiness, and partnerships with city authorities. Autonomous-focused players are leveraging sensor fusion, AI accelerators, and communication chips to enable pilotless operations, particularly in tightly controlled urban environments.Despite differences in design philosophy, all major players share a common dependency: high-performance, safety-certified semiconductor components. Without them, none of these aircraft can meet the stringent requirements of commercial aviation.Industry Players Shaping the SkiesTargeting the Mass Market, Not Just the EliteEarly perceptions of flying taxis positioned them as luxury services for executives and high-net-worth individuals. That narrative is changing rapidly. Leading eVTOL developers are now designing aircraft, routes, and business models aimed at daily commuting and short intercity travel.Planned commercial operations in regions such as Southern California, parts of the Middle East, and Asia—including India—signal a shift toward practical use cases. Typical routes include airport-to-city transfers and high-traffic urban corridors where ground travel times are unpredictable. By cutting a 90-minute drive down to a 10–15 minute flight, eVTOLs promise compelling value for time-sensitive commuters.Crucially, affordability is tied directly to automation and electronics. Reducing pilot workload—or eventually removing the pilot altogether—depends on advanced semiconductors capable of handling perception, decision-making, and flight control with aviation-grade reliability.Vertiports and Regulation: Building the EcosystemAircraft alone cannot create an air mobility revolution. Ground infrastructure—particularly vertiports—is essential. These purpose-built hubs integrate landing pads, charging systems, passenger handling, and digital connectivity with existing transport networks.Regulatory bodies are moving cautiously but steadily. Aviation authorities have begun issuing certifications for air taxis carrying passengers, focusing on safety, redundancy, and operational procedures. Unlike traditional aviation, UAM must integrate seamlessly with dense urban environments, requiring real-time coordination between aircraft, ground systems, and air traffic management platforms.Here again, semiconductors play a foundational role. Secure communication chips, high-precision timing devices, and resilient power electronics ensure that aircraft remain connected, synchronized, and compliant within complex airspace.

42 | www.semiconductorforu.com BLOG BEAT At the heart of every eVTOL aircraft lies a dense network of chips that function as its nervous system. These semiconductors manage everything from propulsion and navigation to safety monitoring and passenger comfort. Flight Control and AvionicseVTOL flight control is significantly more complex than that of conventional aircraft. Multiple rotors must be synchronized precisely to maintain stability during vertical take-off, transition, and forward flight. Advanced microcontrollers, processors, and inertial sensors continuously process data from across the aircraft, making split-second adjustments.High-resolution radar, lidar, and vision sensors enable obstacle detection and situational awareness—critical for low-altitude urban operations. These systems rely on real-time data processing, placing enormous demands on compute performance and reliability.Power Electronics and ReliabilityElectric propulsion depends on efficient power conversion and motor control. Wide bandgap semiconductors, such as silicon carbide and gallium nitride, are increasingly used to handle high voltages and currents with minimal losses. These devices improve efficiency, reduce weight, and enhance thermal performance—key factors in aviation.Equally important is reliability. Aerospace-grade semiconductors must operate flawlessly under vibration, temperature extremes, and long service lifetimes. Lessons learned from automotive electrification are being adapted and extended to meet aviation safety standards.Semiconductors:The Invisible PilotsWhile early commercial eVTOL services may use pilots, the long-term vision is autonomous flight. Autonomy is not just a technological ambition; it is an economic necessity. Pilot availability, training, and cost represent significant barriers to scaling.Achieving autonomy requires powerful AI chips capable of processing massive data streams from cameras, radars, and other sensors. These processors must perform perception, path planning, and decision-making in real time, with deterministic behavior and fail-safe mechanisms.Unlike consumer AI systems, aviation autonomy demands explainability, redundancy, and certification. Semiconductor architectures are being designed with functional safety, partitioning, and secure execution environments to meet these requirements.Autonomy and AI: Reducing Cost, Increasing AccessJust as modern cars communicate with infrastructure and other vehicles, eVTOLs rely on Vehicle-to-Everything (V2X) communication—adapted for airspace. Aircraft must exchange data with traffic management systems, vertiports, weather services, and nearby vehicles.Low-latency, high-reliability communication chips enable real-time coordination, conflict avoidance, and dynamic route optimization. This digital layer is essential to prevent airspace congestion as the number of flying taxis grows.Secure semiconductors also protect these communication links from interference or cyber threats, ensuring trust in an increasingly connected aerial ecosystem.The promise of eVTOLs extends beyond novelty. In megacities plagued by congestion, they offer a practical alternative for specific high-demand routes. Cities such as Los Angeles and Mexico City, where geography and density limit road expansion, stand to benefit significantly.V2X in the Sky: Connected Air MobilityRedefining Urban Mobility\"In flying taxis, safety is not an option or a feature-it is designed into every transistor, every sensor, and every line of code.\"

www.semiconductorforu.com | 43BLOG BEATThe future of flying taxis will not be determined solely by aircraft design or regulatory approvals. It will hinge on the evolution of semiconductor technology—more efficient power devices, safer processors, smarter sensors, and certified AI platforms.As cities rise vertically, transportation must follow. eVTOLs offer a compelling vision of cleaner, faster, and more efficient urban travel. Yet it is the invisible layer of silicon that will ultimately decide whether this vision remains experimental or becomes everyday reality.In the race toward urban air mobility, wings may lift the aircraft—but semiconductors will carry the industry forward.The global eVTOL ecosystem is being shaped by a mix of aerospace innovators, technology-driven startups, and strategic industry partnerships. While design philosophies differ—from piloted aircraft to fully autonomous platforms—all leading players rely heavily on advanced electronics, power semiconductors, and software-defined flight systems. The following companies are widely regarded as front-runners in the eVTOL aircraft market: 1. Joby AviationA U.S.-based leader in piloted eVTOL aircraft, Joby focuses on certification-ready designs and scalable manufacturing. Its aircraft emphasize long range, low noise, and airline-style operational reliability.2. Archer AviationArcher is developing urban-focused eVTOL aircraft designed for short-range commuter routes, particularly airport-to-city travel. The company is strongly aligned with commercial airline partnerships and mass deployment strategies. 3. LiliumBased in Germany, Lilium is known for its distinctive ducted-fan eVTOL jet architecture. Its vision extends beyond city hops to regional air mobility, aiming to connect cities with faster, electric air travel.4. VolocopterA pioneer in multirotor eVTOL design, Volocopter has conducted extensive urban test flights and demonstrations. Its approach prioritizes simplicity, safety redundancy, and integration with city infrastructure.5. EHangEHang is a global leader in autonomous aerial vehicles, focusing on pilotless passenger drones. The company is advancing regulatory testing for autonomous urban air mobility, particularly in controlled city environments.6. Vertical AerospaceHeadquartered in the UK, Vertical Aerospace is developing eVTOL aircraft built to meet stringent commercial aviation standards. Its focus is on airline-grade safety, certification, and scalable global operations.7. Beta TechnologiesBeta Technologies is developing both passenger and cargo electric VTOL aircraft. The company also invests heavily in charging infrastructure, recognizing that energy ecosystems are as critical as aircraft design.8. Wisk AeroBacked by major aerospace players, Wisk is dedicated exclusively to autonomous eVTOL flight. Its long-term strategy centers on removing the pilot entirely to enable safe, scalable, and cost-efficient urban air mobility.9. AutoFlightAutoFlight is an emerging player with a strong focus on both cargo and passenger eVTOL platforms. Its designs emphasize range optimization, electric propulsion efficiency, and rapid commercialization.10. Sarla AviationRepresenting India’s growing presence in advanced aerospace, Sarla Aviation is developing eVTOL aircraft tailored for dense urban environments. The company highlights affordability, localized manufacturing, and regional mobility use cases.Looking Ahead:Silicon as the Deciding FactorTop 10 Companies Driving the Global eVTOL Aircraft RevolutionWith cruising speeds approaching 150 miles per hour and direct point-to-point routes, flying taxis can reclaim hours of lost productivity. At the same time, electric propulsion supports sustainability goals by reducing local emissions and noise pollution.Over time, integration with public transport could position eVTOLs as part of a multimodal urban mobility network rather than a standalone service.

44 | www.semiconductorforu.com BLOG BEAT CHOOSING THE RIGHT SILICON FOR AI: CPUS, GPUS, & FPGASEXPLAINEDArtificial intelligence workloads demand vastly different compute characteristics depending on application, scale, latency, and power constraints. Selecting the right hardware platform is therefore a critical design decision. This article examines the strengths, limitations, and trade-offs of CPUs, GPUs, and FPGAs in AI applications, helping system designers align algorithms with the most efficient silicon architecture.WHY AI HARDWARE CHOICES MATTERArtificial intelligence has transitioned from experimental research to large-scale deployment across data centres, edge devices, industrial automation, automotive systems, and consumer electronics. While AI models are often discussed from a software or algorithmic perspective, their real-world performance, efficiency, and scalability are tightly coupled to the underlying hardware.Not all AI workloads are created equal. Training deep neural networks, running real-time inference, processing streaming sensor data, or executing adaptive edge intelligence place very different demands on compute platforms. As a result, CPUs, GPUs, and FPGAs have each carved out distinct roles within the AI compute ecosystem.Understanding how these architectures differ—and where each fits best—is essential for engineers, architects, and technology decision-makers.

www.semiconductorforu.com | 45BLOG BEATCPUS: VERSATILITY AT THE CORECentral Processing Units remain the backbone of almost every computing system. Designed for general-purpose processing, CPUs excel at sequential tasks, complex control logic, and workloads requiring flexibility.In AI systems, CPUs are typically responsible for orchestration tasks such as data preprocessing, scheduling, memory management, and running lightweight inference workloads. Modern CPUs include vector extensions and specialised instruction sets that accelerate mathematical operations common in machine learning.However, CPUs are not inherently optimised for the massive parallelism required by deep learning. Training large neural networks on CPUs alone often results in long execution times and higher energy consumption compared to more specialised hardware.Despite this, CPUs remain indispensable due to their programmability, mature software ecosystem, and ability to handle diverse workloads alongside AI tasks.GPUS: PARALLEL PROCESSING POWERHOUSESGraphics Processing Units were originally designed to accelerate image rendering, but their architecture—built around thousands of small, parallel cores—proved ideal for AI workloads. Deep learning relies heavily on matrix multiplications and vector operations, tasks that GPUs handle exceptionally well.GPUs dominate AI training environments, particularly in data centres, where performance scalability is a priority. Their ability to process vast datasets simultaneously enables faster model convergence and shorter development cycles.For inference, GPUs are effective in scenarios where throughput is more important than latency, such as batch processing or cloud-based services. However, GPUs tend to consume significant power and may be overkill for smaller, latency-sensitive edge applications.“GPUs deliver unmatched parallel compute density, making them the preferred choice for large-scale AI training and high-throughput inference workloads.”FPGAS: CUSTOMISABLE INTELLIGENCEField-Programmable Gate Arrays occupy a unique position in the AI hardware landscape. Unlike CPUs and GPUs, FPGAs can be reconfigured at the hardware level, allowing designers to tailor data paths, memory access, and processing pipelines to specific AI models. This configurability enables highly efficient execution with lower latency and reduced power consumption. FPGAs are particularly well-suited for edge AI, realtime inference, and applications where deterministic performance is critical, such as industrial control or network analytics.However, FPGA development requires specialised expertise. Programming hardware logic is more complex than writing software, and design cycles can be longer. While high-level synthesis tools have improved accessibility, FPGAs still demand careful optimisation to unlock their full potential.PERFORMANCE VS. EFFICIENCY TRADE-OFFSChoosing AI hardware often involves balancing raw performance against power efficiency and latency. GPUs typically lead in peak computational throughput, making them ideal for training. CPUs offer flexibility and ease of integration but lag in performance for compute-heavy AI tasks.FPGAs strike a balance by delivering application-specific acceleration with high efficiency. Theymay not match GPU peak performance in raw numbers, but they often outperform GPUs in performance-per-watt metrics, especially in constrained environments.These trade-offs become especially important in edge deployments, where thermal limits, power budgets, and real-time responsiveness are critical.

46 | www.semiconductorforu.comBLOG BEATSOFTWARE ECOSYSTEM AND DEVELOPMENT COMPLEXITY AI AT THE EDGE VS. THE CLOUDCOST AND LIFECYCLE CONSIDERATIONSFUTURE TRENDS IN AI HARDWAREUSE CASES: MATCHING HARDWARE TO AI APPLICATION NEEDSHardware selection is not just about silicon—it is also about software maturity. CPUs benefit from decades of compiler and operating system optimisation. GPUs are supported by robust AI frameworks and development tools that abstract much of the hardware complexity. FPGAs, while improving rapidly, still require a more hands-on approach. Developers must consider hardThe deployment location of AI workloads heavily influences hardware decisions. Cloud environments favour GPUs and high-performance CPUs due to their scalability and centralised power availability. In contrast, edge environments prioritise low latency, power efficiency, and compact form factors.FPGAs and embedded CPUs are increasingly used in edge AI systems, enabling local decision-makingBeyond technical performance, cost plays a decisive role. GPUs can be expensive, both in acquisition and operational costs. CPUs benefit from economies of scale, while FPGA costs vary depending on complexity and volume.As AI continues to evolve, the boundaries between CPUs, GPUs, and FPGAs are becoming increasingly blurred. CPUs are integrating AI accelerators, GPUs are improving efficiency, and FPGAs are becoming easier to program.In practical terms, the choice of AI hardware often depends on the application domain: Cloud Training and High-Volume Inference:Deep learning training and high-concurrency inference typically prioritise GPU clusters due to their raw throughput and robust ecosystem.Edge AI and Real-Time Systems:Autonomous machines, industrial automation, andware architecture alongside algorithm design, making co-design a key requirement. This complexity can be justified in applications where efficiency gains translate directly into operational advantages.“Selecting AI hardware is as much a software decision as it is a silicon choice, shaped by tools, expertise, and long-term maintainability.”without reliance on cloud connectivity. This approach reduces bandwidth requirements, enhances data privacy, and improves response times.Hybrid architectures are also emerging, where CPUs manage control logic, GPUs handle intensive computation, and FPGAs accelerate specific functions within the same system.Lifecycle flexibility is another factor. FPGAs offer post-deployment reconfigurability, allowing systems to adapt to evolving AI models without hardware replacement. This can be particularly valuable in long-lived industrial or infrastructure deployments.The future of AI computing is likely to be heterogeneous, combining multiple processing architectures within a single system. This approach allows designers to match each task to the most suitable hardware, maximising performance and efficiency.safety-critical systems benefit from FPGA low-latency execution and deterministic performance.Mobile and Embedded Devices:Compact devices favour CPU+NPU combinations or lightweight accelerators that provide acceptable performance at minimal power draw.

www.semiconductorforu.com | 47BLOG BEATCONCLUSIONThere is no single “best” hardware platform for AI. CPUs, GPUs, and FPGAs each offer unique advantages depending on workload requirements, deployment environment, and system constraints. Understanding these differences enables informed design choices that optimise performance, power, and cost.As AI adoption accelerates across industries, the ability to align algorithms with the right silicon will remain a critical success factor in building intelligent, scalable systems.

BLOG BEAT48 | www.semiconductorforu.comEmbedded Intelligencein Refrigeration:AI-enabled silicon platforms are transforming refriger- ation through sensorless diagnostics, predictive mainte- nance, secure access, and asset intelligence. Refrigeration systems are undergoing a quiet but significant transformation. Once hardware-driven and reactive, they are now evolving into software-defined platforms powered by advanced semiconductors and embedded AI. By enabling sensorless anomaly detection, predictive maintenance, asset tracking, and secure access, semiconductor solutions are redefining efficiency, reliability, and intelligence in modern refrigeration systems.A Semiconductor Perspective

BLOG BEATwww.semiconductorforu.com | 49From Electromechanical Control to Software IntelligenceSensorless Anomaly Detection: Intelligence at the EdgeConventional refrigeration systems have historically relied on fixed control logic and discrete sensors to manage temperature and compressor operation. While effective, these architectures are inherently reactive, addressing issues only after faults occur or thresholds are breached.The shift toward software-based refrigeration represents a fundamental architectural change. Semiconductor companies are embedding intelligence directly into microcontrollers, digital signal processors, and edge AI accelerators, enabling refrigeration systems to continuously analyse operational behaviour and make informed decisions in real time.This transition mirrors broader trends across industrial electronics, where software, analytics, and connectivity increasingly define system value, rather than hardware alone.One of the most impactful semiconductor-driven innovations in refrigeration is sensorless anomaly detection. Instead of adding multiple physical sensors, AI models infer system health using indirect electrical and operational parameters such as motor current, voltage fluctuations, compressor duty cycles, and timing characteristics.Embedded AI algorithms learn normal operating signatures during steady-state operation. Once trained, these models can detect subtle deviations that indicate early-stage faults—often before traditional sensors would register a problem. This includes identifying: • Compressor inefficiencies• Refrigerant leakage trends• Fan or motor degradation• Abnormal defrost behaviourBy running these models on embedded processors at the edge, refrigeration systems gain real-time fault awareness without increasing system complexity.“Sensorless AI allows refrigeration platforms to detect abnormal behaviour early by learning operational patterns, reducing both hardware dependency and response time.”This approach improves reliability while optimising cost and scalability, particularly in high-volume commercial deployments.

BLOG BEAT50 | www.semiconductorforu.comPredictive Maintenance: Data-Driven ReliabilityAsset Tracking and Fleet IntelligenceIn distributed refrigeration environments—such as supermarkets, pharmaceutical cold chains, and food logistics—visibility across assets is critical. Semiconductor platforms now integrate connectivity, edge processing, and AI to enable intelligent asset tracking.Rather than treating refrigerators as isolated units, software-defined systems create digital profiles for each asset. These profiles aggregate:• Location and deployment data• Operational history• Energy consumption metrics• Usage and access patterns Maintenance has long been one of the most expensive and disruptive aspects of refrigeration operations, especially in cold-chain, retail, and industrial environments. Semiconductor-enabled predictive maintenance (PdM) shifts the paradigm from scheduled servicing to condition-based intervention.Using embedded analytics, refrigeration systems continuously monitor performance indicators such as:• Temperature stability and recovery time• Compressor start-stop frequency • Power consumption trends • Operating hours and load cyclesMachine learning models correlate these parameters with historical failure data to estimate remaining useful life of components. This enables maintenance teams to act before failures occur, preventing product loss and unplanned downtime.“Predictive maintenance transforms refrigeration from a reactive system into a data-driven asset, improving uptime while lowering service and energy costs.”For semiconductor vendors, the challenge lies in delivering PdM within constrained power and memory budgets—driving innovation in low-power AI acceleration and optimised firmware architectures.