BLOG BEATwww.semiconductorforu.com | 51AI models analyse this data to identify underperforming units, optimise deployment strategies, and support lifecycle planning. For fleet operators, this translates into better utilisation, reduced losses, and improved compliance with storage standards.Semiconductor advances in low-power wireless communication and embedded processing make this intelligence feasible without compromising reliability.Secure Access and Trusted OperationEnergy Optimisation Through AI ControlAs refrigeration systems become connected to enterprise networks and cloud platforms, security becomes a system-level requirement rather than an afterthought. Semiconductor companies address this by embedding security at the hardware level.Secure elements and trusted execution environments enable:• Device authentication• Secure boot and firmware validation• Encrypted data communication• Controlled service accessThese mechanisms ensure that only authorised personnel and software can interact with refrigeration systems, protecting both operational integrity and sensitive data. In regulated industries such as healthcare and food storage, this hardware-rooted trust is essential.Energy efficiency remains one of the most compelling drivers for intelligent refrigeration. AI-enabled control algorithms continuously adapt cooling behaviour based on real-world conditions rather than static rules.By analysing usage patterns and environmental factors, software-defined refrigerators can:• Modulate compressor speed dynamically• Optimise defrost cycles• Reduce overcooling during low-demand periods• Balance performance across multiple zonesThese optimisations reduce energy consumption, extend component life, and support sustainability objectives—particularly important as energy costs and environmental regulations tighten globally.Semiconductor innovation plays a key role here, enabling precise control and real-time analytics within strict power constraints.
BLOG BEAT52 | www.semiconductorforu.comEdge AI: Local Intelligence, Global ImpactLooking Ahead: Toward Autonomous Refrigeration SystemsConclusionAs AI models mature and semiconductor capabilities advance, refrigeration systems are expected to become increasingly autonomous. Future platforms may:• Self-optimise performance based on inventory and usage• Coordinate multiple units for site-wide efficiency• Integrate seamlessly with smart buildings and supply-chain systems The long-term trajectory points toward refrigeration systems that not only preserve temperature but actively contribute to operational intelligence and sustainability goals.Software-defined refrigeration represents a clear example of how semiconductor innovation is reshaping traditional industries. By enabling sensorless anomaly detection, predictive maintenance, asset intelligence, and secure access, AI-enabled silicon platforms are transforming refrigeration into a smart, connected, and efficient system.For semiconductor companies, this evolution highlights the growing importance of edge AI, security, and system-level integration. As these technologies continue to mature, intelligent refrigeration will become a critical building block in connected industrial and consumer ecosystems.A defining characteristic of modern refrigeration platforms is the shift toward edge AI. Instead of relying solely on cloud-based analytics, intelligence is increasingly executed directly within the appliance.Edge AI delivers:• Immediate response to anomalies• Reduced dependence on connectivity• Lower data transmission costs• Enhanced system resilienceSemiconductor vendors are responding with MCUs and processors optimised for AI inference, offering dedicated accelerators and memory architectures tailored for embedded workloads. This ensures that refrigeration systems remain intelligent even in bandwidth-limited or disconnected environments.
BLOG BEATwww.semiconductorforu.com | 55HANNOVER MESSE 202620 – 24 April 2026 Hannover, Germanyhannovermesse.comTHINK TECH FORWARDThe global meeting place for industrial transformationwhere innovative technology and responsibility convergeto shape the future of manufacturing.
54 | www.semiconductorforu.com BUSINESS BUSINESS UNBOXED UNBOXED Printed circuit boards (PCBs) are the silent enablers of the digital economy. Every elec- tronic device—from smartphones and electric vehicles to telecom infrastructure and defense systems—relies on PCBs to connect, control and power electronic components. Despite being one of the world’s fastest-growing electronics markets, India has historically depended heavily on imported PCBs, limiting value addition within the country. Today, that equation is beginning to change.India stands at a critical inflection point in PCB manufacturing. Strong domestic electron- ics demand, coupled with supportive govern- ment policies and rising private investment, is pushing the industry toward scale. While challenges remain in technology depth, ma- terial sourcing and cost competitiveness, the momentum toward building a robust PCB ecosystem is unmistakable.Scaling PCB Manufacturing in India: Building the Backbone of Electronics GrowthInside India's Push to ScalePCB ManufacturingIndia’s electronics ambitions hinge on a strong printed circuit board manufacturing base. As domestic demand surges across consumer electronics, automotive, telecom and industrial systems, PCB production is emerging as a strategic priority. This article examines India’s PCB market opportunity, key challenges, policy support, investment momentum and the roadmap required to scale from import dependence to global competitiveness. “As chips become the oil of the 21st century, securing the rare earths behind them is mission critical.”
www.semiconductorforu.com | 55BUSINESS UNBOXEDIndia’s electronics market is expanding rap- idly, driven by consumer devices, automotive electronics, industrial automation, renewable energy systems and 5G infrastructure. Each of these segments requires increasingly com- plex PCBs—multi-layer, high-reliability and, in some cases, high-frequency boards. Electric vehicles, for instance, use multiple PCBs across battery management systems, motor controllers, infotainment and safety electronics. Similarly, telecom equipment for 5G networks depends on precision-engiWhile the opportunity is clear, scaling PCB manufacturing in India is not without obsta- cles.One of the most persistent challenges is dependence on imported raw materials. Key inputs such as copper-clad laminates, spe- cialty substrates, chemicals and surface-finish materials are largely sourced from overseas neered boards capable of handling high data rates and thermal stress. As electronics manufacturing scales under India’s broader industrial push, PCB demand is expected to rise in parallel. Despite this demand, domestic PCB pro- duction currently meets only a fraction of national requirements. Imports continue to dominate, especially in advanced board cat- egories. This gap between demand and local supply represents both a vulnerability and a significant growth opportunity.overseas suppliers. This exposes manufactur- ers to supply disruptions, currency volatility and cost fluctuations.Technology capability is another constraint. Most domestic manufacturers are strong in single-sided, double-sided and basic multi- layer boards, but advanced segments such as high-density interconnect (HDI), rigid-flex Rising Demand Fuels the Case for Local PCBsStructural Challenges Slowing Scale
56 | www.semiconductorforu.com BUSINESS UNBOXED and high-frequency PCBs are still limited in scale. These boards demand precision manu- facturing, advanced automation and stringent quality controls—areas where global players have decades of experience.Capital intensity further complicates expansion. PCB fabrication requires significantup- front investment in equipment, clean-room environments and effluent treatment systems. Environmental compliance, particularly re- lated to chemical handling and wastewater management, adds to both cost and com- plexity.Recognizing PCBs as a strategic component of electronics manufacturing, the Indian gov- ernment has introduced multiple policy in- terventions aimed at strengthening domestic capability.Production-linked incentive frameworks have made PCB investments more financially via- ble by rewarding incremental output. Com- ponent-focused schemes have also attracted interest from both large electronics manufac- turers and specialized PCB players, encour- aging capacity expansion and technology upgrades.The private sector is responding decisive- ly. Electronics manufacturing services (EMS) companies are expanding vertically into PCB fabrication to reduce dependency on im- ports and improve supply-chain control. New greenfield facilities, capacity expansions and technology upgrades are being announced across multiple states.Trade measures, including duties on select imports, are helping reduce unfair price pres- sure on domestic producers. At the same time, state governments are com- peting to attract electronics and component manufacturing through infrastructure support, land availability and faster approvals. Together, these measures are creating a more supportive environment for PCB manu- facturing, though execution and consistency remain key to sustaining momentum.Large investments in multi-layer PCB plants signal growing confidence in long-term de- mand, particularly from automotive electron- ics, industrial systems and defense applica- tions. Strategic acquisitions and partnerships are also helping companies accelerate ca- pability building, access new customers and achieve economies of scale.Policy Support Reshaping the LandscapePrivate Investment and Industry Momentum“Policy stability and long-term visibility are critical—PCB investments are capital-heavy, and confidence in the ecosystem determines how fast scale can be achieved.”
www.semiconductorforu.com | 57BUSINESS UNBOXEDFor India to emerge as a globally competi- tive PCB manufacturing hub, several strategic priorities must align.First, upstream material manufacturing must be strengthened. Domestic production of cop- per-clad laminates and specialty substrates would significantly reduce import depen- dence and cost volatility. Second, technology and skill development must keep pace with market needs. Invest- ments in advanced fabrication equipment, design tools and automation should be com- plemented by focused workforce training inScaling PCB manufacturing is not just an in- dustrial objective—it is a strategic necessity for India’s electronics ambitions. Strong local PCB capability strengthens supply chains, enhances value addition, creates skilled jobs and reduces exposure to global disruptions. While challenges in technology, materials1. AT&S India Pvt. Ltd.A leading producer of high-end multilayer and HDI PCBs, serving automotive, industrial and medical electronics. 2. Circuit Systems India Ltd. (PCB Power)Offers end-to-end PCB fabrication and assembly, with strong capabilities in design support and quick-turn manufacturing. 3. Genus Electrotech Ltd.A major domestic PCB manufacturer with strengths in automotive-grade, metal-core and multilayer PCBs.process engineering and quality control.Third, cost competitiveness must improve through scale, yield optimization and oper- ational excellence. Collaboration between large EMS firms and specialized PCB manu- facturers can help drive shared learning and faster adoption of best practices.Finally, export orientation will be crucial. As global companies seek supply-chain diversifi- cation, India has an opportunity to position it- self as a reliable PCB sourcing destination—provided quality, consistency and delivery performance meet international expectations.and cost remain, the direction is clear. With coordinated policy support, sustained private investment and a focus on advanced capa- bilities, India can transform its PCB industry from an import-dependent segment into a globally relevant manufacturing base. The circuits powering India’s electronics future are already being laid.This growing investment activity suggests a shift in mindset—from viewing PCBs as a low-margin commodity to recognizing themas a strategic, value-creating component of the electronics ecosystem.What India Needs to Scale SustainablyConclusion: A Strategic Building Block for Electronics LeadershipTop 10 PCB Manufacturers in India
58 | www.semiconductorforu.comBUSINESS UNBOXED4. Shogini Technoarts Pvt. Ltd.Specializes in RF, microwave and custom PCB solutions, with a strong presence in prototyp- ing and low-volume production.5. Ascent Circuits Pvt. Ltd.Focused on high-reliability rigid, flex and rigid-flex PCBs for aerospace, defense and industrial applications. 6. Epitome Components Ltd.One of India’s higher-capacity PCB manufac- turers, supplying multilayer boards for con- sumer and industrial electronics.7. Meena Circuits Pvt. Ltd.Known for RF, microwave and multilayer PCBsused in telecom, industrial and specialized applications. 8. CIPSA Tech India Pvt. Ltd.Manufactures multilayer, metal-clad and HDI PCBs, with emphasis on quality certifications and export markets.9. Anand ElectronicsProduces controlled-impedance and mid-tohigh-layer PCBs for industrial and telecom electronics.10. India Circuits Ltd. (Garg Electronics)An established player offering a broad port- folio ranging from single-sided to multilayer PCBs.
60 | www.semiconductorforu.comEVENT SPOTLIGHTVIKSIT BMeitY Wo
BHARATorkshopwww.semiconductorforu.com | 61EVENT SPOTLIGHT
62 | www.semiconductorforu.comEVENT SPOTLIGHTInfineonMeitY Workshop Highlights Semiconductors as Pillar of Viksit Bharat 2047Infineon Technologies, in collaboration with the Ministry of Electronics and Information Technology (MeitY), organised a twoday workshop titled “Semiconductors – A Key Enabler for Viksit Bharat 2047: From Vision to Reality” on 12–13 January 2026in New Delhi. The event brought together senior government officials, industry leaders, academic institutions and ecosystem stakeholders to discuss India’s semiconductor roadmap, policy priorities and talent development strategies.The workshop was inaugurated by Shri S. Krishnan, Secretary, MeitY, who underscored the strategic importance of semiconductors in achieving India’s long-term development goals. He highlighted the role of semiconductors in enabling digital infrastructure, advanced manufacturing, electric mobility, artificial intelligence and emerging technologies, and stressed the need for sustained collaboration between government, industry and academia to build a globally competitive ecosystem.Delivering the welcome address, Mr C.S. Chua, President and Managing Director, Infineon Tech- nologies Asia Pacific Pte Ltd, outlined India’s growing significance in the global semiconductor landscape and Infineon’s long-term engagement with the country.Mr Chua said semiconductor innovation requires aligned ecosystems, strong public–private partnerships and a long-term approach. He noted that India’s talent base, expanding market and entrepreneurial ecosystem present opportunities not only in manufacturing, but also in re- search, design and application-driven innovation addressing global challenges such as decar- bonisation and digitalisation.India’s Expanding Role in the Global Semiconductor Value Chain
www.semiconductorforu.com | 63EVENT SPOTLIGHTHe acknowledged the policy support and vision provided by the Government of India in strengthening domestic capabilities and attracting investment. According to him, discussions during the first day of the workshop—covering technology trends, policy frameworks and commercial considerations—highlighted the importance of ecosystem-wide alignment to accel- erate industry growth.Mr Chua emphasised Infineon’s focus on human capital development as a key component of its India strategy. He highlighted the company’s collaboration with the National Institute of Elec- tronics and Information Technology (NIELIT) as a cornerstone of this effort.Infineon recently hosted a Train-the-Trainer programme in Singapore in partnership with NIEL- IT, aimed at strengthening faculty capabilities and scaling semiconductor education in India. The initiative is expected to support curriculum development, guest lectures, faculty training, student projects and structured talent pathways into the semiconductor industry.“Our aim is to reach close to 10,000 students annually through structured and industry-aligned skilling programmes,” Mr Chua said, adding that increasing female participation in technolo- gy roles remains a priority for building a resilient and inclusive workforce.Focus on Talent Development and SkillingExpanding on the partnership, Prof. Madan Mohan Tripathi, Director General, NIELIT and Vice Chancellor, NIELIT Deemed to be University, described the collaboration as a strategic step to- ward building India’s capabilities in critical and emerging technologies.Prof. Tripathi highlighted NIELIT’s Digital Industry Platform, an AI-powered, cloud-native learnInfineon–NIELIT Collaboration Strengthens Workforce Readiness
64 | www.semiconductorforu.comEVENT SPOTLIGHTing ecosystem that offers more than 100 industry-aligned programmes across electronics, IoT, automotive electronics, embedded systems, power electronics, cybersecurity, artificial intelli- gence, and advanced communication technologies.As part of the partnership, Infineon’s tools, reference designs and real-world use cases will be integrated into the platform, enabling learners to gain hands-on, industry-relevant exposure. The platform also supports virtual labs, industry mentorship and employer-recognised mi- cro-credentials, facilitating flexible and scalable skilling.He noted that the collaboration aligns with national priorities under India’s semiconductor and electronics missions and will contribute to developing a future-ready workforce capable of supporting the country’s expanding semiconductor ecosystem.Over the two days, the workshop featured sessions on global and domestic semiconductor trends, advanced materials, front-end fabrication, advanced packaging, quantum technolo- gies, export controls, investment frameworks and human resource strategies. Participants discussed the need for balanced growth across manufacturing, design, R&D and system integration, highlighting the importance of leveraging global best practices while strengthening domestic capabilities. The sessions also examined policy and regulatory mea- sures required to enhance India’s position in global semiconductor supply chains.A key segment of the workshop was the panel discussion titled “Women in Tech: Powering the Journey to Viksit Bharat 2047”, which focused on gender diversity, leadership and inclusion in technology-driven sectors.Policy, Technology and Ecosystem Discussions Panel Discussion Highlights Role of Women in Technology
www.semiconductorforu.com | 65EVENT SPOTLIGHTThe panel, moderated by Ms Clarice Loh, Director – Strategy, Mergers & Acquisitions (Asia Pa- cific), Infineon Technologies, featured speakers from government, industry and national missions, including Ms Tulika Pandey, Scientist-G and Group Coordinator, MeitY; Ms Preeti Khemani, Senior Director, Connected Secure Systems – Systems, Research & Innovation; Ms Mamatha Venkatesh, Vice President and Head, Startup India; and Ms Shagun Kansal, Assistant Manager, Invest India.Panellists shared perspectives on navigating career challenges, building confidence and le- veraging policy initiatives to enhance women’s participation in advanced technology domains. The discussion highlighted the role of national programmes such as the India Semiconductor Mission, Startup India and emerging technology missions in creating opportunities across re- search, manufacturing, entrepreneurship and policy.Speakers emphasised mentorship, preparation and collaboration as key enablers for women entering and advancing in the technology workforce. The panel concluded that inclusive eco- systems are critical for sustaining innovation and achieving long-term national development goals.The first day concluded with a networking dinner, providing participants an opportunity to engage informally and explore collaboration opportunities. According to organisers, the in- teractions reinforced the importance of relationship-building in strengthening public–private partnerships.By the conclusion of the workshop, stakeholders broadly agreed on the need for continued dialogue, coordinated action and sustained investment in talent and technology to support India’s semiconductor ambitions.The Infineon–MeitY workshop marked a significant step in aligning policy, industry and ac- ademia around a shared vision of semiconductors as a foundational pillar of Viksit Bharat 2047, with a strong emphasis on ecosystem development, workforce readiness and inclusive growth. Strengthening Partnerships for Long-Term Impact
66 | www.semiconductorforu.comINDUSTRY BULLETININDUSTRYBULLETINFoxconn–HCL JV Named India Chip Pvt Ltd for OSAT PushFoxconn and HCL Group have named their semiconductor joint venture India Chip Private Limited, advancing India’s push in OSAT (Outsourced Semiconductor Assembly and Test) services. Foxconn holds a 40 % stake after investing around ₹312 crore, with plans to scale operations at a facility in Yamuna Expressway Industrial Development Authority (YEIDA), Uttar Pradesh. The venture aims to serve domestic and global customers, strengthen India’s semiconductor ecosystem, and reduce reliance on overseas packaging and test services.India’s Budget 2026 Boosts Chip Ambitions with ISM 2.0India’s Union Budget 2026 has given a significant fillip to its semiconductor strategy by launching the India Semiconductor Mission (ISM) 2.0, expanding support beyond fabs to include chip design, equipment, materials, and supply chain development. The government also increased the Electronics Component Manufacturing Scheme outlay to ₹40,000 crore, underlining its goal to build a full-stack domestic semiconductor and electronics ecosystem and reduce import dependence.
Kaynes Semicon–SiMa.ai Partner to Advance Physical AI in IndiaKaynes Semicon has partnered with US-based SiMa.ai to strengthen India’s Physical AI and semiconductor ecosystem. The collaboration combines SiMa.ai’s integrated AI hardware-software platform with Kaynes’ OSAT and electronics manufacturing capabilities to develop Made-in-India edge AI systems. The partnership will target applications across industrial automation, robotics, automotive, aerospace, and defence, enabling faster deployment of mission-critical AI solutions while supporting India’s growing semiconductor and advanced manufacturing ambitions.www.semiconductorforu.com | 67INDUSTRY BULLETINSTMicroelectronics Named a Top 100 Global Innovator for 2026STMicroelectronics has been recognised as one of the Top 100 Global Innovators 2026 by Clarivate, marking the company’s fifth consecutive year and eighth overall on the prestigious list that benchmarks organisations leading in high-impact invention and technological leadership. The accolade reflects ST’s sustained commitment to innovation across sensing, power and energy, connectivity, data communications, compute, and edge AI solutions, driven by strong R&D investment and global collaboration.Applied Materials Inaugurates 8.06 Lakh Sq Ft Facility in BengaluruApplied Materials has inaugurated an 8.06 lakh sq ft state-of-the-art workplace at ITPL, Bengaluru, reinforcing its commitment to India’s semiconductor and display ecosystem. The facility will drive engineering, R&D, and customer programs across a range of advanced materials and equipment technologies. The new workplace aims to foster innovation, collaboration, and talent development in the region. This expansion underscores Applied Materials’ long-term focus on strengthening capabilities and supporting local and global customers from India.
68 | www.semiconductorforu.comINDUSTRY BULLETINDigi-Key Sponsors Formula Bharat 2026 Engineering CompetitionDigi-Key Electronics has signed on as an official sponsor of Formula Bharat 2026, India’s annual student engineering competition focused on designing and building formula-style race cars. The sponsorship aims to support hands-on engineering, innovation, and prototype development, giving students access to electronic components, technical resources, and mentorship. By backing the event, Digi-Key reinforces its commitment to fostering the next generation of engineers and promoting practical learning in electronics and embedded systems.GlobalFoundries Appoints Ganesh Moorthy to Board of DirectorsGlobalFoundries has appointed Ganesh Moorthy to its Board of Directors, bringing extensive leadership experience in technology, strategy, and semiconductor operations. Moorthy’s appointment reflects the company’s focus on strengthening governance and strategic direction as it expands global manufacturing capabilities and innovation initiatives. His leadership background is expected to support GlobalFoundries’ growth in advanced nodes, specialty technologies, and customer-centric solutions within the semiconductor industry.
www.semiconductorforu.com | 69INDUSTRY BULLETINInfineon–MeitY Workshop Spotlights Semiconductors for Viksit Bharat 2047Infineon Technologies and India’s Ministry of Electronics and Information Technology (MeitY) jointly hosted a twoday workshop titled “Semiconductors – A Key Enabler for Viksit Bharat 2047: From Vision to Reality” in New Delhi, bringing together government officials, industry leaders, and academic stakeholders to discuss India’s semiconductor roadmap, policy priorities, and talent development strategies. The event spotlighted semiconductors’ role in digital infrastructure, AI, advanced manufacturing, and emphasized skills and ecosystem alignment to build a globally competitive industry.Cadence Launches Partner Ecosystem to Speed Up Chiplet DevelopmentCadence has launched a new partner ecosystem aimed at accelerating chiplet design and time to market for advanced applications such as Physical AI, data centers, automotive, and high-performance computing. The initiative brings together leading IP, silicon, and analytics partners to deliver pre-validated, interoperable chiplet solutions from specification to packaging. By reducing design complexity and integration risk, the ecosystem helps system and semiconductor companies adopt chiplet architectures faster and more efficiently.
64 | www.semiconductorforu.comINDUSTRY BULLETIN70 | www.semiconductorforu.comINDUSTRY BULLETINCorning, Meta Ink Up to $6B Deal to Supply AI Data Center FiberBroadcom Deepens AI Role with OpenAI DealCorning and Meta Platforms have signed a multiyear supply agreement worth up to $6 billion for optical fiber, cable, and connectivity products to support Meta’s rapidly expanding AI data center infrastructure through 2030. Under the deal, Corning will expand manufacturing in North Carolina, with Meta as the anchor customer at its Hickory facility. The partnership is expected to boost domestic production capacity, create jobs, and accelerate deployment of high-performance fiber solutions for AI workloads.Broadcom has strengthened its position in the AI semiconductor market through a multi-year agreement to supply OpenAI with custom AI accelerator ASICs totaling the equivalent of 10 gigawatts of compute capacity over four years, sharpening its focus on tailored silicon for hyperscale AI workloads. The deal deepens Broadcom’s role as a key partner for major cloud and AI platforms and aligns its chip strategy with rising demand for purpose-built AI infrastructure beyond traditional GPUs.
www.semiconductorforu.com | 67INDUSTRY BULLETINCadence Launches Partner Ecosystem to Speed Up Chiplet Developmentwww.semiconductorforu.com | 71INDUSTRY BULLETINBlaize and Nokia Forge Hybrid AI Collaboration in Asia PacificBlaize and Nokia have signed a Memorandum of Understanding to jointly explore and develop hybrid AI inference solutions across the Asia Pacific region, combining Blaize’s energy-efficient AI inference platform with Nokia’s networking, automation, and cloud expertise. The partnership will focus on edge and hybrid AI use cases, reference architectures, validation pilots, and go-to-market initiatives to enable production-ready AI deployments that span edge, cloud, and industrial environments.Microsoft Unveils Maia 200 AI Inference ChipMicrosoft has launched its Maia 200 AI inference accelerator built on TSMC’s 3-nanometer process to boost performance and efficiency for large-scale model workloads including GPT-5.2 and Microsoft Copilot. The chip features 216 GB of HBM3e memory, FP8/FP4 tensor cores and delivers over 10 petaflops at 4-bit precision with a 30 % performance-per-dollar improvement over prior hardware. Initial deployments are underway in Azure data centers with expanded rollout and an SDK for developers.Micron Plans $24 Billion NAND Memory Fab in SingaporeU.S. memory maker Micron Technology has announced plans to build a $24 billion advanced wafer fabrication facility in Singapore to expand NAND flash memory production and meet growing global demand, particularly from AI and data-intensive applications. The new fab, within Micron’s existing NAND complex, will span about 700,000 sq ft of cleanroom space, withwafer output expected in the second half of 2028. The project underscores long-term commitment to global memory capacity expansion and supply-chain resilience.
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