INTRODUCTIONTO IC 2 0 2 3 JABATAN KEJURUTERAAN ELEKTRIK
IC Introduction to Mohd Nadzmi Sofwan Siti Hawa AUTHOR:
Copyright © 2021 www.polimas.edu.my POLITEKNIK SULTAN ABDUL HALIM MU'ADZAM SHAH BANDAR DARULAMAN 06000 JITRA KEDAH MOHD NADZMI SOFWAN SITI HAWA All rights reserved. No part of this publication may be reproduced, distributed, or transmitted in any form or by any means, including photocopying, recording, or other electronic or mechanical methods, without the prior written permission of the publisher, except in the case of brief quotations embodied in critical reviews and certain other noncommercial uses permitted by copyright law. [email protected] [email protected] [email protected] e ISBN 978-967-0055-27-5
PREFACE This e-book aims at providing the students with the understanding of the Introduction of IC. This e-book written based on the polytechnic syllabus for the CMOS IC Design and Fabrication course taken by Electrical and Electronic Engineering students. The Introduction of IC are explained in this e-book to enable students to gain a good understanding of Integrated Circuit and their applications. The first chapter discusses the integrated circuit. The second chapter discusses about the evolution of integrated circuits and the last chapter discusses the classification of integrated circuit. Tutorials are provided for all chapters to help students master the concepts covered by each topic. Answers are included at the end of the e-book.
1 - 17 TABLE OF CONTENTS Remember of integrated circuit The Evolution of Integrated Circuits The Classification of Integrated Circuits Tutorial 18-27 28-45 46-54
What is IC? 1
Definition Integrated Circuit 2 A complex set of tiny components and their interconnections that are etched or imprinted onto a tiny slice of semiconductor material (e.g silicon).
Application of IC Computer / Server / workstation TV / Radio / Video Cell Phones Digital Clock Robotic Systems Telecommunication System Automotive Medical Equipment Aerospace Children's Toys Military Field Missile System etc. Most electronic equipment today use integrated circuit, for example: 3
Different Between…. Integrated Circuit (also referred to as IC, chip, or microchip) is a semiconductor wafer on which thousands or millions of tiny resistors, capacitors, and transistors are fabrication. Electronic components are discrete devices or discrete components (is a separate component,mounted separately from other components in a circuit making the circuit size larger.) 4
Extremely small size—thousands times smaller than discrete circuit. It is because of fabrication of various circuit elements in a single chip of semi-conductor material Very small weight owing to miniaturized circuit Very low cost because of simultaneous production of hundreds of similar circuits on a small semiconductor wafer. Owing to mass production an IC costs as much as an individual transistor More reliable/High Reliability because of elimination of soldered joints and need for fewer inter-connections Low power consumption because of their smaller size Easy replacement as it is more economical to replace them than to repair them Increased operating speeds because of absence of parasitic capacitance effect Close matching of components and temperature coefficients because of bulk production in batches Advantages of IC 5
Improved functional performance as more complex circuits can be fabricated for achieving better characteristics Greater ability of operating at extreme temperatures Suitable for small signal operation because of no chance of stray electrical pickup as various components of an IC are located very close to each other on a silicon wafer No component project above the chip surface in an IC as all the components are formed within the chip Advantages of IC 6
Isolation weakness Limited range of passive component Circuit design is not flexible Disadvantages of IC 7
Inside of an ordinary IC package (dual in-line package) 8
Inside of an ordinary IC package (dual in-line package) 9
Functions of Integrated Circuit packages Easy to use and connect at the printed circuit board (PCB) Physical safety to the IC internal structure such as gold wire bond, silicon chip and damages or scratches circuit Safety on the humidity, gases and chemical waste Protection from the environment and handling damage. To dissipate heat generated by IC chips Easy to market To provide mechanical support and robustness to the fragile IC 10
2. Ceramic – Better heat transfer characteristics – Generally more reliable – More likely an off‐the‐shelf part can be used – Good for research and prototyping IC packaging material 1. Plastic – Low cost – Typically requires a custom‐designed package 11
Plastic Packaging 12
Ceramic Packaging 13
Differentiate between Pin Package 1) Through Hole Classic approach Holes drilled and plated with copper Soldering – Chips placed inside holes – Bottom of board passed through a molten solder “wave” 14
More wiring room inside PC board Reduced space between package leads Chips on both sides of board Stronger PC board 2) Surface Mount Technology (SMT) Soldering – Solder paste applied – Heat supplied by intense infrared light, heated air,… Differentiate between Pin Package 15
Differences between Through hole Packages (THP) and Surface mount Packages (SMP) 16
Lead (Pb) Mercury (Hg) Cadmium (Cd) Hexavalent chromium (Cr6+) Polybrominated biphenyls (PBB) Polybrominated diphenyl ether (PBDE) Building a totally environmentally friendly integrated circuit (IC) is an elusive goal as long as semiconductor die are doped with arsenic and phosphorus. However, lead-free and halide-free packages for these die go a long way toward supporting current goals for environmentally safe electronics. It’s actually a European directive aimed toward the “Restriction of Hazardous Substances.” The idea is that the product has only trace amounts (or no amount at all) of six poisonous substances: Green IC Packaging 17
THE EVOLUTION OF INTEGRATED CIRCUITS An electric circuit is made from different electrical components such as transistors, resistors, capacitors and diodes, that are connected to each other in different ways. Which one is the most important? INTRODUCTION TO IC 18
INTRODUCTION TO IC 19 INTRODUCTION TO ELECTRONICS: The word electronics, actually, this originated from the word electron. Electronics is a branch of science dealing with theory and use of devices in which electrons travel through vacuum gas or a semiconductor medium. So these are the different mediums in which the electrons are traveling. The electronics is the field of science which deals with the motion of electrons under the influence of applied electric or magnetic field. Electronics has evolved around three components basically: Vacuum tubes Integrated circuits Transistor
INTRODUCTION TO IC 20 TRANSISTOR EVOLUTION Generates a lot of heat and has a tendency to burn out. Slow, big and bulky. Transistor is the most important one for the development of modern computers. Before, engineers had to use vacuum tubes. The replacement due to: The first digital computer ENIAC was a huge monster that weighedover thirty tons, and consumed 200 kilowatts of electrical power. Ithad around 18,000 vacuum tubes that constantly burned out,making it very unreliable.
INTRODUCTION TO IC 21 TRANSISTORS ERA: Then came the transistor era in 1948 three scientists John Bardeen, Walter Brattain and, William Shockley they developed transistor at the bay level and then they were given Nobel Prize for their creation in 1956. These are the three scientists and the transistor which was first developed was shown in the figure. You can see it in the figure, now transistor again, it is a determinant device base, emitter, and collector. These are the three terminals of the transistor and this is just a crude model they have developed and then actually modern transistor is a junction transistor was developed in a same semiconductor piece.
INTRODUCTION TO IC 22 INTEGRATED CIRCUITS ERA: Then after this transistor was new then in 1958 Jack Kilby he came out with an idea of making the IC. So integrated circuit here he tried to put several components on a single chip. He was the first, proposed this idea of the integrated circuits but then ICs now they are a capable of a several thousand components on a single chip. So, accordingly they are classified as small scale integration, medium scale integration, and large scale integration ICs. Here in the figure is the actual circuit which was developed by Kilby the first integrated circuit and here you see the silicon wafers which contain number of integrated circuit or chips on a single wafer.
INTRODUCTION TO IC 23 MICROELECTRONICS EVOLUTION Evolution of transistors in 1948 Brattain Bardeen invented point contact transistor. In 1948 Shockley he came up with the junction transistor and then the commercial production of transistor had started in 1950 as shown some of the ancestors. This is a power transistor 2N3055 and there are also some other transistors shown in the diagram which are three terminal devices. The trend further carried forward with the JFETS and MOSFETs that were developed during 1951 to 1958 by improving the device designing process and by making more reliable and powerful transistors.
INTRODUCTION TO IC 24 EVOLUTION OF INTEGRATED CIRCUITS: In 1950s single transistor was incorporated in a single chip then in 1960’s wide scale integration less than hundred components per chip that was possible we can see here the sixteen transistors were put on a single chip in the form of this square gate that is the transistor transistor logic gates, AND gate and NAND gate. All these ICs they are the ideal ICs and they are having around sixteen transistors in single chip. Then in 1966 they came with the medium scale integration so the components per chip that is increased from a 100 to 1000 and then in 1969 they came up with the large scale integration Then later on in 1975 they came up with the very large scale integration VLSI, it is greater than 10,000 components per chip. So in the 1980s he came up with 275000 transistors on a single chip so it was a 32-bit microprocessor. In 1990s he came up with 3100000 transistors. Now they have gone beyond the VLSI he called it ULSI ultra large scale integration.
INTRODUCTION TO IC 25 MOORE’S LAW MOORE'S LAW STATES THAT THE NUMBER OF TRANSISTORS ON A CHIP DOUBLES ABOUT EVERY TWO YEARS. In 1975, he updated his prediction to once every 18-24 months.
MOORE’S LAW INTRODUCTION TO IC 26 Moore's Law means more Performance and decreasing costs.. Processing power, in (MIPS), has risen because of increased transistor counts. Real-time natural language translation. Imagine being able to speak to someone in a foreign country and having your conversation translated real-time. Auto chauffeur. Imagine a car that takes a verbal command for a destination, and can drive you there via the least congested route in the safest possible manner. As Moore's Law continues, imagine the possibilities:
INTRODUCTION TO IC 27 MOORE’S LAW "It can't continue forever. The nature of exponentials is that you push them out and eventually disaster happens." He also noted that transistors eventually would reach the limits of miniaturization at atomic levels: Gordon Moore (april 2005)
Classification ICs Based on Fabrication Method Hybrid Film Monolithic INTRODUCTION TO IC 28
The word ‘monolithic’ is derived from the Greek word monos, meaning ’single’ and lithos, meaning ‘stone’. Thus monolithic circuit is built into a single stone or single crystal i.e. in monolithic ICs, all circuit components, (both active and passive) and their interconnections are formed into or on the top of a single chip of silicon. This type of technology is ideal for manufacturing identical ICs in large quantities and, therefore, provides lowest per unit cost and highest order of reliability. Monolithic INTRODUCTION TO IC 29
Monolithic ICs are by far the most common type of ICs used in practice, because of mass production , lower cost and higher reliability. Commercially available ICs of this type can be used as amplifiers, voltage regulators, AM receivers, TV circuits, and computer circuits. INTRODUCTION TO IC 30
Monolithic IC INTRODUCTION TO IC 31
Advantages & Disadvantages of monolithic IC Advantages Disadvantages Most popular because of low cost. High reliability. 1. 2. Low power rating Poorer isolation between components Limited range of values of passive components. Lack of flexibility in circuit design as for making any variation in the circuit, a new set of masks is required. 1. 2. 3. 4. INTRODUCTION TO IC 32
Film components are made of either conductive or nonconductive material that is deposited in desired patterns on a ceramic or glass substrate. Film can only be used as passive circuit components, such as resistors and capacitors. Transistors and/or diodes are added to the substrate to complete the circuit. Film INTRODUCTION TO IC 33
These devices are larger than monolithic ICs but smaller than discrete circuits. These ICs can be used when power requirement is comparatively higher. With a thin-or thick-film IC, the passive components like resistors and capacitors are integrated, but the transistors and diodes are connected as discrete components to form a complete circuit. Therefore, commercially available thin- and thick film circuits are combination of integrated and discrete components. INTRODUCTION TO IC 34 Film
INTRODUCTION TO IC 35 Film IC
Advantages of Film IC Better tolerances Better isolation between their 1. 2. components 3. Greater flexibility in circuit design 4. Providing better high-frequency performance than monolithic Ics Disadvantages of Film IC Larger physical size, comparatively higher cost incapability of fabrication of active components. 1. 2. 3. INTRODUCTION TO IC 36
Hybrid IC or Multi-Chip IC Hybrid integrated circuit technology is the combination of monolithic circuits and film technology. The active components are monolithic transistors or diodes. The passive components may be group of monolithic resistors or capacitors on a single chip, or they may be thinfilm components. Wiring or a metallized pattern provides connections between chips INTRODUCTION TO IC 37
Hybrid IC Hybrids ICs are widely used for high power audio amplifier applications from 5 W to more than 50 W. INTRODUCTION TO IC 38
Hybrid ICs usually have better performance than monolithic ICs. However, the process is too expensive for mass production. Thus, multi-chip techniques are quite economical for small quantity production and are more often used as prototypes for monolithic ICs. INTRODUCTION TO IC 39
Fabrication Method Comparison INTRODUCTION TO IC 40
Classification of IC based on transistor type INTRODUCTION TO IC 41
A logic family of monolithic digital integrated circuit devices is a group of electronic logic gates constructed using one of several different designs. The most popular BJT digital logic families are: Transistor-Transistor Logic (TTL) Emitter-Coupled Logic (ECL) Integrated Injection Logic (IIL @ I2L) Bipolar IC INTRODUCTION TO IC 42
MOS IC MOS transistor is known as MOSFET (metal oxide semiconductor field-effect transistor). MOSFET is widely used nowadays in electronic equipment, e.g. mobile phone, computer, medical electronic equipment, etc. Examples of MOS technology are: i. PMOS ii. NMOS iii. CMOS (Complementary Metal Oxide Semiconductor) iv. VMOS (Vertical Metal Oxide Semiconductor). INTRODUCTION TO IC 43
Linear / Analog Integrated circuits that operate with analogue signal at the input and output -continuous sine wave signal Examples: Op-Amp Power Amplifier Classification Based on Circuits Function Integrated Circuit Digital Integrated circuits that operate with digital signal at the input and output. Discrete square wave signal Examples: Logic gates Flip-flop Counter Calculator chips Memory Microprocessor Multiplier Comparator Voltage Regulator INTRODUCTION TO IC 44
Classification Based on Circuits Function Integrated Circuit Mixed-signal A mixed-signal integrated circuit is any integrated circuit that has both analog circuits and digital circuits on a single semiconductor die. Examples: Cell -phone DVD INTRODUCTION TO IC 45