SIMTech AMF 2017 Programme Booklet

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Innovating with Flexible Hybrid Electronics

This year’s SIMTech Annual Manufacturing Forum 2017 (AMF’17) features Flexible Hybrid
Electronics (FHE), along with a large array of innovations and business opportunities being
presented.

FHE is converging macro- and microelectronics to redefine the future of electronics in portable
and wearable devices. Roll-to-roll printing and in-mould integration of discrete components with
electronic and semiconductor inks on flexible and formable polymer substrates complement
conventional electronic manufacturing technologies to produce bendable and stretchable
products for fast growing markets in Internet-of-Things (IoT), wearable applications, flexible
displays and many innovative products. FHE will be one of the key enablers to connect people
and products seamlessly in a sentient environment. Currently, a new manufacturing ecosystem
is evolving to support FHE manufacturing. It is forecasted that the market for FHE applications is
nearly US$ 30 billion in a combined industry and consumer sector.

With the theme, Innovating with Flexible Hybrid Electronics, SIMTech AMF’17 in its 12th edition
brings together technology leaders and experts in FHE to share global industry trends and
developments that drive the industry.

The sessions include:

AM Session: Featuring Annual Manufacturing Lecture (AML) on the latest FHE technology - design,
integration and applications, and keynotes on the 3 major trends in structural electronics, wearable
electronics & IoTs.

PM Session: Featuring keynotes on printed sensors technologies, applications and insights from
FHE manufacturers.

A panel discussion, comprising of FHE experts from the industry and research community, has
beenv organised to address your queries.

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Programme

8.30 am Registration

9.00 am Welcome Address
by Dr Stephen Wong
Director, Manufacturing Process Division
Singapore Institute of Manufacturing Technology (SIMTech)

9.10 am Annual Manufacturing Lecture: Flexible Printed Hybrid Electronics from
Technology towards Applications and Products
by Dr Harri Kopola
Professor in Knowledge Intensive Products and Services (KIPS) Business Area
VTT Technical Research Centre of Finland Ltd

9.55 am Tea Break

10.40 am Keynote Lecture: Three Major Technology Trends in Flexible (Printed)
Hybrid Electronics
by Dr Khasha Ghaffarzadeh
Research Director
IDTechEx, UK

11.25 am SIMTech Flexible and Printed Electronics
by Dr Wei Jun
Programme Manager, Large Area Processing
SIMTech

11.45 am Panel Discussion

12.15 pm Lunch, Tour of Exhibits and Parallel Technical Sessions Registration

Track I: Printing Materials and Track II: Printed Devices and
Processes Applications

1.30 pm Session Keynote: Printed Session Keynote: Flexible
Sensors Technology: Design, Hybrid Electronics Architecture
Manufacturing Process Opportunities and Challenges in
and Applications IoT Ecosystems
by Dr Soren Fricke by Mr Girish Wable
Section Head Manager, Strategic Capabilities
CSEM Switzerland Jabil, USA

2.00 pm Advanced Materials for Flexible Printed Electronics Technology
Hybrid Electronics Platforms at CDT and
by Dr Zhou Chaohui their Applications
Technology Director by Dr Richard Wilson
Henkel Electronics Materials LLC Director, Innovation
CDT Ltd, UK

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2.30 pm Durable Conductive Materials for Applications of Pressure Sensing Mats
3.00 pm Wearable Electronics by Dr Xia Qinghua
3.30 pm by Mr Leonard Allison Executive Director
4.00 pm Business Manager, Electronic Materials Yoggzee Corporation Pte Ltd
4.30 pm Engineered Materials Systems, Inc

5.00 pm Tea Break

Open Innovation in Packaging Application of Printed Light Technology
by Dr Allan Lim by Mr Jared Chew
Group manager Managing Director
Nestlé R&D Center Pte Ltd Worldbizz Engineering Pte Ltd

From Adding to Creating Value Wearable Electronics
by Mr Pascal Delloue by Mr Daryl Lim
General Manager Operation Manager
Central Midori International GM Nameplate Asia Pte Ltd

Process, Material and Capability Application Development of Flexible
Development for Flexible Hybrid Hybrid Printed Electronics
Printed Electronics by Mr Lok Boon Keng
by Dr Shan Xue Chuan Applications Team Lead,
Process Team Lead, Large Area Processing
Large Area Processing SIMTech
SIMTech

End

*Programme may change without prior notice

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Speaker for Annual Manufacturing Lecture

Flexible Printed Hybrid Electronics from
Technology towards Applications and Products

Dr Harri Kopola
Professor in Knowledge Intensive Products and
Services (KIPS) Business Area
VTT Technical Research Centre of Finland Ltd

Abstract

The Annual Manufacturing Lecture will feature state-of-the-art flexible hybrid electronics
development, challenges, opportunities, impact on industry and a vision of FHE outcomes.
Flexible printed hybrid electronics is an enabling technology and is of high interest to
industries asking for flex-enabled, large area or wearable products and solutions.VTT’s FHE
technology is based on roll-to-roll manufacturing technologies covering printing processes,
pick and place processes to integrate chips on web and further injection molding/
overmolding processes to finish flexible or 3D shaped encapsulation. PrintoCent Roll-to-
Roll Printing and Hybrid Integration Pilot-factory is used for scaling-up manufacturing
capabilities and producing flexible electronic, optoelectronic diagnostic product and
system demonstrators.These technologies will be predominantly applied for IoT, industrial
internet solutions, systems and future hyper-connected digital world services. Several
examples demonstrating such products and solutions will be introduced.

Biography

Dr Harri Kopola is a Professor in Knowledge Intensive Products and Services Business
Area (KIPS) at VTT Technical Research Centre of Finland Ltd. He is now concentrating his
efforts in printed intelligence industrialisation and commercialisation, digital naked world
and Hilla – Hightech ICT leverage initiatives. As the former Vice-President of Research in
KIPS, he was responsible for research strategy and the research portfolio of technology
areas covering microsystems, printed and hybrid functionalities, intelligent sensor systems,
metrology, digital systems and services, communication systems and health.

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Three Major Technology Trends in
Flexible (Printed) Hybrid Electronics

Dr Khasha Ghaffarzaden
Research Director
IDTechEx, UK

Abstract

This talk focuses on the role that hybrid and/or flexible printed electronics will play in
enabling 3 major technology trends:

(i) Structural electronics
(ii) Wearable electronics
(iii) Internet-of-Things

In particular, IDTechEx will outline the key market trends shaping all these major categories
whilst focusing on selected flexible and printed electronic components that play an
enabling role. These include stretchable inks, in-mould electronic inks, functional films,
printed sensors, flexible OLED displays and flexible printed batteries. For each component,
important insights into the latest innovations and market developments will be outlined.

Biography

Dr Khasha Ghaffarzadeh is a Research Director at IDTechEx. Dr Khasha advises multi-
billion dollar corporations worldwide on their growth and technology strategy in
the field of emerging technologies. He has specific technical expertise in graphene
Carbon Nanotubes (CNT), transistors, functional inks, photovoltaic and piezoelectric and
piezoresistive materials, flexible and organic sensors, transparent conductive films, and
solid-state lighting.

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SIMTech Flexible and Printed Electronics

Dr Wei Jun
Programme Manager, Large Area Processing
SIMTech

Abstract

Flexible and printed electronics (FPE) technology is the process to create and print
functional devices on a flexible substrates such as plastic, textile, paper or metallic foil.The
competitive advantages of FPE are direct printing, shortened design to product time, less
process steps and material flexibility. It is environmentally friendly and enables large-scale
production of thin, flexible, wearable, lightweight functional devices with varying sizes and
low cost. This presentation will highlight the opportunities and applications of printed
electronics in a number of industry sectors and the research activities in SIMTech.

Biography

Dr Wei Jun is currently a Principal Scientist, Programme Manager of the Large Area
Processing Programme and 3D Additive Manufacturing Programme for SIMTech, Agency
for Science, Technology and Research (A*STAR). He received his PhD degree in Materials
Science and Engineering from Tsinghua University, China. His research includes printed
functional devices, 3D additive manufacturing and low dimensional materials. Dr Wei
Jun has published more than 600 scientific articles with citations over 8000 times. He has
also led and participated a lot of research and industry projects to support Singapore’s
manufacturing industry. He serves several international conference committees and
editorial boards.

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Printed Sensors Technology: Design,
Manufacturing Process and Applications

Dr Soren Fricke
Section Head
CSEM Switzerland

Abstract

Printed sensors on flexible substrates (e.g. foils) are yielding the opportunity to bring
sensors to large areas and into applications where thickness and flexibility are required
properties. Low production costs in large volumes promise advantages in the field of IoT
and disposables, e.g. for point-of-care diagnosis.

This presentation will give a general overview on sensing principles and their
implementation in printed sensors. Real examples of printed sensors in different phases of
the product life – from proof-of-concept to volume production – will give the audience an
impression on the maturity level of printed sensors. Examples of recent developments at
CSEM will also be shared.

Biography

Dr Sören Fricke received his Diploma degree in Physics from the Swiss Federal Institute of
Technology (ETHZ), Zurich, Switzerland in 2004.He joined Sonys Fusion Domain Laboratory
in Tokyo, Japan, where he prepared his Diploma Thesis. In 2005, he continued his research
on micro-sensors at the Corporate Research Centre of EADS in Ottobrunn, Germany and
received his PhD degree from Saarland University, Germany in 2010. In 2008, he joined
Robert Bosch GmbH and worked in the field of semiconductors and MEMS packaging in
the business unit Automotive Electronics. From 2012 to 2013, he was the team manager of
an international engineering team responsible for the volume production of automotive
ASICS and sensors. Since November 2013, he worked at the CSEM Center Muttenz, and has
led the section on Large Area & Flexible Systems there since February 2015.

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Flexible Hybrid Electronics Architecture
Opportunities and Challenges in IoT Ecosystems

Mr Girish Wable
Manager, Strategic Capabilities
Jabil, USA

Abstract

Digital revolution is upon us and connected devices are getting ubiquitous. Integrating
both the hardware data collection and analytics layers of the IOT ecosystem across different
domains (smart retail, hospitality, health & safety) can help enhance the ROI of the solution.
Some examples of such integration are discussed in this presentation to provide insights
into such opportunities. While there are several subsystem components, this presentation
outlines opportunities and challenges for enabling hardware, especially leveraging current
and future technologies in flexible hybrid electronics.

Biography

Mr Girish Wable is the Manager for Strategic Capabilities at Jabil, USA. He is the author
of internal engineering and business standards, white papers, technical publications and
thought leadership articles. He has been requently invited to contribute in panels and
blogs on manufacturing and innovation. He manages emerging technology development,
operations, sourcing and business solutions. He is a skilled professional with more than 20
years of global experience in strategy, planning and trench level execution in electronics
manufacturing, high performance coatings, material handling & automation.

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Advanced Materials for Flexible
Hybrid Electronics

Dr Zhou Chaohui
Technology Director
Henkel Electronic Materials LLC

Abstract

In order to support higher speed production requirements for printed electronics, Henkel
has introduced 2 new inks that take electronic circuit production speed to the next level.
ECI1011 is a highly conductive silver ink with very high conductivity while ECI7005 is a
water-based carbon ink. Both are very cost effective solutions as they can be applied in
very thin layers using fast printing techniques like flexography or rotogravure.
To support the trend towards 3D shaped electronics, Henkel also introduces a material
set to allow thermoformed, in-mold electronics that include: stretchable silver conductor
and dielectric, solder or conductive adhesives for component attach and Technomelt
protection materials.

Biography

Dr Zhou Chaohui has a PhD in Materials from the Rensselaer Polytechnic Institute. She also
has 15 years of experience in industrial product and application development in functional
composite materials from multinational companies.

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Printed Electronics Technology Platforms
at CDT and their Applications

Dr Richard Wilson
Director, Innovation
CDT Ltd, UK

Abstract

The field of printable electronics is an area that encompasses a large range of electronic
components that can be produced using a variety of solution based materials and printing
methods, thus allowing for flexibility in the design, functionality, form factor and the
scaling of electronics systems. Flexible displays, photodetectors, integrated sensors and
lighting are a number of technologies that continue to be pursued at Cambridge Display
Technology (CDT).More recently,CDT has initiated the development of gas sensors. Recent
progress made in these areas will be shared.

Biography

Dr. Richard Wilson is the Director of Innovation at CDT Ltd where he heads the new
frontiers team, engages in technology scouting, identifies opportunities and incubates
new technologies for CDT’s parent company, Sumitomo Chemical Co, Japan. Dr Richard
Wilson has over 20 years of research and development experience in the field of printed
and organic electronics. He has led a number of innovative R&D teams at CDT including
solar cell, OLED materials for displays, OLED lighting materials and devices, OTFTs and most
recently biosensors, organic photo-diodes and sensor systems. Dr Richard Wilson holds a
PhD in organic electronic device physics from the University of Cambridge, UK.

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Durable Conductive Materials for
Wearable Electronics

Mr Leonard Allison
Business Manager, Electronic Materials
Engineered Materials Systems, Inc.

Abstract

New conductive inks and SMT adhesives produce very durable printed electronics on
traditional polyester film and on new form factor substrates like ThermoPlastic Urethane
(TPU), other resin-coated substrate, and ink transfer. Design and material selection has led
to durable SMT attachment for further printed electronics performance.

Biography

Mr Leonard Allison has over 30 years of experience in printed electronics including 10
years in Asia.

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Applications of Pressure Sensing Mats

Dr Xia Qinghua
Executive Director
Yoggzee Corporation Pte Ltd

Abstract

Pressure sensing mats have many applications in different industries. They are used for
gait and gesture analysis, foot function, balance, stability, pressure offloading, joint analysis,
injury prevention, gripping force analysis, fitness, physical therapy training, gaming, virtual
and augmented reality etc.
This presentation will address various applications of pressure mats that are jointly
developed with SIMTech.

Biography

Dr Xia Qinghua has 28 years of working and research experience in electronics and
automation industries, including filing 17 patents in Singapore, USA, China, Europe and
India. He obtained his PhD and master’s degrees from the National University of Singapore.
Dr Xia Qinghua has worked for multinational corporations and research institutes in
Singapore. He founded Yoggee Corporation Pte Ltd in 2013 with a business focus on
applications of pressure mat in the areas of sports, fitness, medical, healthcare, elderly care,
robotics, etc.

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Open Innovation in Packaging

Dr Allan Lim
Group Manager
Nestlé R&D Center Pte Ltd

Abstract

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Biography

Dr Allan Lim started his career in industrial research at Nestlé R&D Center in Singapore
in 1995 after obtaining his PhD from the Institute of Molecular and Cell Biology at the
National University of Singapore. He served as the Research Manager, Acting-R&D Director
and Senior Scientist at Kemin Industries, a US-based agrifood company, to manage
the development of animal feed additives for the Asia Pacific region. Dr Allan Lim then
returned to Nestlé for a new role in promoting innovation partnerships with the academia
and industry in the Asia-Pacific region. He has since been focusing on commercialisation of
new technologies through partnerships. Today, Allan heads a department responsible for
external partnerships, regulatory, IP and contract management.

At the national level, Dr Allan Lim supports Spring Singapore by serving as the Chairman
of the Singapore Food Standards Committee, member of the Singapore Standards Council,
member of the Technical Committee on Animal and Vegetable Fats and Oil and National
Mirror Committee on Natural Food Ingredients. He also contributes to the academic
institutions by serving as advisory committee member in several institutions of
higher learning.

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Application of Printed Light Technology

Mr Jared Chew
Managing Director
Worldbizz Engineering Pte Ltd

Abstract

The application in printed light technology will determine the success level of the
technology. Success is measured by the number of users and the area of application that
it is employed in. The presentation will focus on who, where and how Worldbizz Group
applies the printed light technology.

Biography

Mr Jared Chew is the CEO of Worldbizz Group. His focus is in innovation on new and
emerging technologies. In early 2005, he started Worldbizz Engineering and developed
the core business of Worldbizz, which uses PMMA acrylic panels for swimming pools and
water features.Today, this business has expanded into PMMA acrylic panel application with
SIMTech’s printed light technology, among other applications.

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From Adding to Creating Value

Mr Pascal Delloue
General Manager
Central Midori International

Abstract

In the past, we have always operated under the rule of a zero-sum game for every winner,
there is a loser. Today, creating value is not about beating the competition, it is about
putting the customer first and offering bigger and better opportunities.

The missions of Central Midori International’s New Development Centre are to provide fast
design, high speed prototyping and testing capabilities to reduce customer development
cycle; to provide printed electronic expertise to designers and R&D engineers in South East
Asia; and identify, evaluate and transfer advanced printed electronic technologies
to Singapore

Biography

Pascal Delloue is currently the General Manager of Central Midori International. After 5
years of service in the French navy aboard a nuclear submarine, Pascal started his career as
a production engineer in the suburb of Paris, France. In 1989, he moved to Eastern Europe
to train local engineers to comply with the Western standards and produce for UK, France
and German OEM’s. Back in Western Europe, Pascal moved to the flexible printed circuit
industry to work for a French manufacturer located in Alsace. In 1998, Pascal’s career took
a fresh turn when he moved to Boston, Massachusetts with his wife and 2 children. Pascal
has held several positions in the US and spent extensive periods of time traveling in Asia,
Europe and North America. In 2014 he was hired by Demmel Gruppe to take the leadership
role at CMI. Pascal and his wife now live in Singapore.

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Wearable Electronics

Mr Daryl Lim
Operation Manager
GM Nameplate Asia Pte Ltd

Abstract

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Biography

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Process, Material and Capability Development
for Flexible Hybrid Printed Electronics

Dr Shan Xue Chuan
Process Technology Team Lead, Large Area Processing
SIMTech

Abstract

Roll-to-roll embossing is a promising method for manufacturing functional films with
microstructures such as optical components and microfluidic devices. Roll-to-roll
UV embossing and thermal embossing systems with novel specifications have been
developed and demonstrated several promising processes and applications. One such
example is optical film with linear Fresnel lens array developed by using ultra-precision
diamond turning for mould fabrication and roll-to-roll micro UV embossing for transferring
micro features from mould to the flexible plastic films. The Fresnel lens film produced by
the optimised roll-to-roll UV embossing process demonstrated strong light concentration
effect on a solar simulation system, with light intensity increasing by more than 6 times.

Biography

Dr Shan Xuechuan leads the process team in SIMTech’s Large Area Processing Programme.
Dr Shan received his PhD in Precision Engineering from Tohoku University of Japan, and
worked at Olympus as a Senior Researcher before joining SIMTech.

His research interests include microsystem technologies, microelectromechanical systems
(MEMS), micro-embossing and nano-imprinting and large area processing for
printed electronics.

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Application Development of
Flexible Hybrid Printed Electronics

Mr Lok Boon Keng
Applications Team Lead, Large Area Processing
SIMTech

Abstract

The introduction of functional materials into the roll-to-roll manufacturing process has
enabled cost effective manufacturing, assembly of electronics devices and large area
applications. Roll-to-roll multilayer coating of various functional materials such as light
emitting, conductive and dielectric materials has enabled the realisation of large format,
flexible lighting sheet for backlighting of signages and banners.The material is formulated
such that it is compatible to the roll-to-roll process and further improves the effectiveness
of its cost-performance.The corresponding electronic system is developed to cater for large
capacity. Other applications of printed lighting and printed electronics devices including
touch sensing and antenna will also be discussed.

Biography

Mr Lok Boon Keng obtained his Master of Science (Management of Technology) and
Bachelor of Science (Physics) from the National University of Singapore. He has been in the
semiconductor manufacturing and electronics industry for 10 years. He joined SIMTech in
2001 and has been actively involved in the R&D of wafer bumping, wafer level packaging,
integrated passives, printed electronics and roll-to-roll manufacturing processes. He is the
technical lead of the applications team in SIMTech’s Large Area Processing Programme.

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