Ventec PCB Product Brochure

Wherever technology venteclaminates.com
takes you, Ventec delivers

無論將來科技如何發展、
騰輝總能不負所託

Wherever technology takes you, 無論將來科技如何發展、
Ventec delivers 騰輝總能不負所託

Ventec International Group is a world leader in polyimide 騰輝國際集團是聚醯亞胺和高信賴度環氧基板與黏合片產業的世
& high-reliability epoxy laminates and prepregs. Founded 界領導者。2000年成立於中國大陸蘇州市，擁有全球的供貨能力
in 2000 in Suzhou, China, with sales and technical support 和技術支援據點，員工人數超過1,100人。
offices worldwide, Ventec employs over 1100 people.
我們專注於創新、品質、價值，始於強大的研發能力，紮根於大
Our focus on innovation, quality, and value starts with 中華，成為世界領先的材料和應用專家。
strong R&D, anchored in China and powered by the
world’s leading materials and applications specialists. 我們從材料選擇、設計、量產甚至更廣闊的領域提供全方位的支
持，協同PCB和EMS廠家合作開發完整的解決方案。
We support you from materials selection and design-in
to production and beyond, working with OEM’s, PCB 騰輝在中國大陸和台灣的工廠均通過完整品質認證，有卓越能力
fabricators and EMS companies to create the 為您提供優化的產品性能與服務。
complete solution.

All Ventec products are manufactured at our quality-
approved factories in China and Taiwan: your assurance
of ultimate performance and service.

Global Reach… Local Service

全球佈局... 在地服務

Chicago (Americas HQ)

製造基地
服務中心
銷售辦事處
代理/經銷商

Location Sales Administration Manufacturing Stockist Service Center Technical Support Lab Services
據點 銷售管理 製造基地 倉儲 服務中心 技術支援 實驗室測試服務

ASIA China, Suzhou / 中國蘇州      
亞洲 China, Jiangyin / 中國江陰  
China, Shenzhen / 中國深圳      
EMEA Taiwan / 台灣     
歐洲、中東和 Korea* / 韓國* 
Singapore* / 新加坡*   
非洲 Japan* / 日本*     
UK / 英國 
AMERICAS Germany / 德國   
美洲 France / 法國   
Italy / 義大利     
Russia* / 俄羅斯*    
Israel* / 以色列*  
USA, Illinois / 美國伊利諾州  Prepreg Testing Only
USA, California / 美國加利福尼亞州  僅可測試黏合片特性
Canada / 加拿大 

Ventec International Group
* Sales Agents / 銷售代表

Ventec PCB base Materials – 騰輝的線路板基材
High-Performance Foundation for 高性能為基礎的先進新產品設計
Advanced New Product Designs
如今的高科技市場要求極其嚴格。為了滿足預期，同時打敗競爭
Today’s high-tech markets are ultra-demanding. 對手，需要關注每一個細節。我們先進的基材在適當的條件下可
To meet expectations, and beat your competitors, demands 以輕鬆地突破性能的限制，這是一般材料所不能實現的。
attention to every detail from the ground up. Our advanced 從高等FR-4到高頻高速的tec-speed產品系列、tec-thermal散熱
substrates, properly applied, can unleash performance 產品系列、高信賴度的聚醯亞胺，以及各種特殊應用的材料如
simply not possible using standard materials. LED晶片封裝、通孔填充、大電流、或光學遮蔽，我們都可以幫
助您解決各類專業型的工程方案。
From our high-quality enhanced FR4 range to our
tec-speed and tec-thermal families, high-reliability 產品亮點：
polyimides, and special materials for applications like
LED-chip packaging, via filling, high-current handling, 高頻材料：騰輝引領了高頻材料的發展。我們最新的
or optical blocking, we can help you achieve perfectly tec-speed 30.0為未來最先進的高頻系統和尖端的汽車電子
engineered solutions. 產品提供了最佳的信號完整性特性。
VT-5A2: 為新一代中最佳的高Tg薄基板和黏合片材料，專為需要
Product highlights: 最嚴格的散熱高多層PCB應用設計。
tec-thermal: 全系列的金屬基板，以及多層板所需的高導熱銅
High Frequency Materials: Ventec sets the pace in 箔基板和黏合片，可以組合成各種創新的散熱設計。可彎折的
high-frequency substrates. Our latest tec-speed 30.0 VT-4B1和超薄高導熱的VT-4B5SP使得選擇和設計的空間得以更
offers the highest signal-integrity characteristics for 大的延伸。
the most advanced high-frequency systems and VT-901: 高性能聚醯亞胺板材，用於高溫、高壓力環境。
cutting-edge automotive electronics ofthe future.

VT-5A2: a next generation best-in-class, high Tg thin-core
and prepreg material designed for the world’s most
thermally demanding PCB applications.

tec-thermal: our IMS families, and laminates and prepregs
for excellent thermal performance. Formable VT-4B1 and
selective-preference VT-4B5SP extend choice and design
freedom even further.

VT-901: a high-performance polyimide laminate for
high-temperature, high-stress environments.

Ventec Solutions / 騰輝的解決方案

Polyimide Signal Integrity Thermal Management High-Frequency Special Applications
聚醯亞胺 訊號完整性 熱管理 Materials 特殊應用
高頻材料

Standard FR4 Halogen Free Lead-Free Assembly Flex-Rigid and Integrated IC
標準玻璃布環氧銅 無鹵 無鉛組裝 Heatsink bonding Package Substrates
箔基板 (FR-4) 軟硬結合板和散熱器 IC載板
接著材料

tec-speed - high-Speed

tec-speed: High-Speed Material Technology

The ultimate choice for high-reliability and high-speed applications

tec-speed: 高速材料技術

高可靠性和高速應用的終極選擇

With the growing demand for high-reliability and 隨著對高可靠性和高速計算與存儲應用的日益增長的需求，
high-speed computing & storage applications, the tec-speed系列基板和黏合片集合了最全面的高速/低損耗PCB材
tec-speed laminates & prepreg brand unites one 料產品。從低損耗（Df 0.0095）到超低損耗（Df 0.002）規格，
of the most comprehensive range of products in Dk等級在3.8到3.2之間，tec-speed通過騰輝專有的製造和銷售網
high-speed/low-loss PCB material technology. 路提供了最高的基板技術和品質保證。
From low-Loss (Df 0.0095) to ultra-low-loss (Df 0.002)
specifications with Dk levels ranging between 3.8 and tec-speed集合科技創新、高性能和優異品質於一體，在寬頻和較
3.2, tec-speed offers the ultimate in laminate technology 寬溫度範圍內表現優異且穩定的電性和可靠性。tec-speed廣泛應
and quality assurance through Ventec's proprietary 用於要求電性能優越的應用，如：通訊設備領域，包含交換機、
manufacturing and distribution network. 伺服器、背板和子卡等設計，以及高頻高速領域，包含汽車和衛
星通訊、導航、手持式設備等領域。
tec-speed combines technological innovation, high
performance and superior quality, offering excellent
electrical properties for reliability and stability across
a broad range of frequencies and temperatures.
tec-speed materials are designed for applications where
good Signal Integrity is essential, including: telecom, router,
servers, backplane & line card designs, high-frequency &
high-speed designs, automotive & satellite communication,
navigation, GPS, hand-held products etc.

Key Features / 關鍵特性 Tg: 160-200 ºC

Dk: 3.2-3.8

Df: 0.0095-0.02 Td: 350-405 ºC

Applications / 應用 tec-speed tec-speed tec-speed tec-speed tec-speed tec-speed

Networking Equipment / 網路設備 2.0 / 2.1 3.0 4.0 5.0 6.0 7.0 / 7.1
Base Station / 基地台
Optical Communications / 光通訊
Telecoms Industry, Mobile Phones / 行動電話
Base Station Antenna & Power Amplifiers / 基地台天線，功率放大器
IC Tester / 積體電路測試儀
Automotive Radar / 汽車雷達
LNB for Broadcast Satellites / 廣播衛星低雜訊降頻器
RF Identification (RFID) / 射頻識別
Radio Frequency & Microwave / 微波射頻

tec-speed 7.1 = Dk 3.2 Df 0.002 ULTRA Df ≤ 0.003
LOW LOSS 0.003 < Df < 0.006
tec-speed 7.0 / 7.0H = Dk 3.5 Df 0.005 0.006 < Df < 0.010
Df ≤ 0.015
tec-speed 6.0 / 6.0H = Dk 3.5 Df 0.005

tec-speed 5.0 = Dk 3.5 Df 0.006

tec-speed 4.0 = Dk 3.8 Df 0.007 VERY
tec-speed 3.0 = Dk 3.7 Df 0.0075 LOW LOSS
tec-speed 2.0 = Dk 3.8 Df 0.0095
tec-speed 2.1 = Dk 3.8 Df 0.0095 LOW LOSS

VT-447 = Dk 4.2 Df 0.015

MID LOSS

Halogen Free

Description / 描述 Type / 機型 Product / 產品 Tg Td Z-Axis CTE Z-Axis CTE T-288 Dk @ 10GHz Df @ 10GHz IPC-4101E
(mins) (RC 50%) (RC 50%)
( ̊C) ( ̊C) (before Tg) (%) Total >120 3.2 0.0018 /91 /102
>120 3.5 0.0028 /91 /102
Ultra low loss tec-speed 7.1 VT-463LK 200 410 40 2.5 >120 3.5 0.0028 /91 /102
Ultra low loss tec-speed 7.0H VT-463H 200 410 40 2.5 3.5 0.005 /91 /102
Ultra low loss tec-speed 7.0 VT-463 >30 3.5 0.005 /91 /102
Ultra low loss tec-speed 6.0H VT-462SH 200 410 40 2.5 >30 3.4 0.0055 /91 /102
LowDk&ultralowloss tec-speed 6.0 VT-462S >60 3.8 0.007
Mid Dk & low loss tec-speed 5.0 VT-464G 170 400 48 2.8 >60 3.8 0.007 /126
Mid Dk & low loss tec-speed 4.0 VT-462L LFPP/NFPP 170 400 48 2.8 >30 3.7 0.0075 /126
Mid Dk & low loss tec-speed 4.0 VT-462L 230 420 30 1.4 >30 3.8 0.0095 /130
Mid Dk & low loss tec-speed 3.0 VT-464L >30 3.8 0.0095 /97 /98 /99 /101 /126
Mid Dk & low loss tec-speed 2.1 VT-461 175 360 50 2.5 >30 /127 /128 /130
Mid Dk & low loss tec-speed 2.0 VT-464
190 360 52 2.5
175 390 45 2.4
180 350 40 2.8

180 390 45 2.4

All test data provided are typical values and not intended to be specification values.
所有測試資料均為典型值，無意用於規範。

tec-speed 6.0

tec-speed 6.0 High-Speed Material Technology

High reliability with superior Signal Integrity performance

tec-speed 6.0 高速材料技術

高信號完整性及高可靠性

For when you need great signal integrity and low-Dk 當您需要高信號完整性和低Dk優勢以及高可靠性時，
benefits with high reliability, our tec-speed 6.0 我們的tec-speed 6.0配方還具有高Anti-CAF性能，
formula also features high Conductive Anodic 可在潮濕環境中為您提供最高可靠性保證。
Filament (CAF) resistance to give you ultimate
assurance of reliability in humid environments.

Key Features / 關鍵特性 Applications / 應用

Dk: 3.5 High-Speed Network Equipment
Df: 0.005 高速網絡設備
Tg: 170ºC
Td: 400ºC IC Tester
積體電路測試儀

High-frequency Measuring
Instruments & Devices
高蘋儀器測量設備

ANTI CAF Class 2 / 关键特性

tec-speed 6.0 6 Layers Reliability Data / 可靠性資料 : TC7

Spec Via to Conductor 455µm Sample 1# Sample 3# Sample 5#
Via to Via 650µm Conductor to Conductor 210µm Sample 2# Sample 4#

14.0
12.0
10.0

8.0
6.0
4.0
2.0
0.0

0 100 200 300 400 500 600 700 800 900

Time (hours)
Resistance (Lgohms)
Resistance Change Rate (%)
1
47
93
139
185
231
277
323
369
415
461
507
553
599
645
691
737
783
829
875
921
967
8
5
2
-1

Cycle

Properties / 特性 Test Method / 測試方法 Units / 單位 Specification / 規範 Typical Value / 典型值

Thermal Properties / 熱學特性 210
170
Tg DMA IPC-TM-650 2.4.24.4 ˚C 170 minimum 400
IPC-TM-650 2.4.24 ˚C 170 minimum >60
TMA ASTM D3850 ˚C 340 minimum >30
IPC-TM-650 2.4.24.1 Minute 30 minimum >600
Td IPC-TM-650 2.4.24.1 Minute 15 minimum 48
IPC-TM-650 2.4.13.1 Second Pass 10s 260
T260 IPC-TM-650 2.4.24 ppm/˚C 60 maximum 2.8
IPC-TM-650 2.4.24 ppm/˚C 300 maximum
T288 IPC-TM-650 2.4.24 % 3.5 maximum 11~13
130
Thermal Stress @ 288˚C IPC-TM-650 2.4.24 ppm/˚C –
Z-axis CTE Before Tg UL 746E ˚C – 3.6
3.5
After Tg IPC-TM-650 2.5.5.9 0.003
IPC-TM-650 2.5.5.13 0.005
Total Expansion IPC-TM-650 2.5.5.9 5.0E+8
(50~260˚C) IPC-TM-650 2.5.5.13 5.0E+6
IPC-TM-650 2.5.17.1 5.0E+7
X-Y CTE IPC-TM-650 2.5.17.1 5.0E+6
IPC-TM-650 2.5.17.1 1372 (54)
MOT IPC-TM-650 2.5.17.1 60
IPC-TM-650 2.5.6.2 Grade 4 (175~250)
Electrical Properties / 電氣特性 IPC-TM-650 2.5.6 124
ASTM D3638
DK (RC 50%) @ 1GHz ASTM D495 – – 6.0 (1.05)
– – 6.0 (1.05)
@ 10GHz IPC-TM-650 2.4.8 – – 80 (560)
IPC-TM-650 2.4.8 – – 65 (450)
DF (RC 50%) @ 1GHz IPC-TM-650 2.4.4 MΩ-cm 1.0E+4 minimum
IPC-TM-650 2.4.4 MΩ-cm 1.0E+3 minimum 0.10
@ 10GHz MΩ 1.0E+4 minimum V-0
IPC-TM-650 2.6.2.1 MΩ 1.0E+3 minimum
Volume After Moisture Resistance UL-94 Volt/mil (KV/mm) 762 (30) minimum
Resistivity E-24/125 KV 40 minimum
Rating (Volt) –
Surface After Moisture Resistance Second 60 minimum
Resistivity E-24/125

Electrical Strength

Dielectric Breakdown

Comparative Tracking Index (CTI)

Arc Resistance

Mechanical Properties / 機械特性

Peel Strength As received lb/in (N/mm) –
(1oz) After thermal stress lb/in (N/mm) 4.0 (0.70) minimum
Kpsi (MPa) 60 (415) minimum
Flexural Warp Kpsi (MPa) 50 (345) minimum
Strength Fill

Physical Properties / 物理特性

Moisture Absorption % 0.80 maximum
Rating V-1 minimum
Flammability

All test data provided are typical values and not intended to be specification values.
所有測試資料均為典型值，無意用於規範。

tec-speed 7.0 & 7.1

tec-speed 7.0 & 7.1 High-Speed, Ultra-Low-Loss
Multilayer Materials

Excellent Signal Integrity for extremely high-speed applications

tec-speed 7.0 和 7.1 超低損耗多層材料

超高速應用中優異的訊號完整性

With the proliferation of devices such as smartphones, 隨著手機，電腦和網路通訊的更新換代，高速大容量的資料傳輸
tablet PCs and social networking & video sites, the 要求越來越高。基礎建設正在調整和開發更強更快的高性能伺服
need for high-speed processing of large data-volumes 器和路由器以及其他設備以滿足現在和未來的需求。
is paramount. The infrastructure is adapting and
developing with ever more powerful and fast high- 為了支援基礎設施的建設發展，新的電路板材料持續不斷的推
performance servers, routers and other equipment 陳出新以滿足大容量，高傳輸速率以及更高層的印刷電路板需
that are needed to fulfil today’s requirements and the 求。tec-speed 7.0和7.1正是為了滿足此需求而精緻設計，具有優
demands of the future. 異的電性能表現，應用於超高速應用領域。

To support these developments, new circuit board
materials are continuously evolving that enable increased
capacity and transmission speeds as well as a greater
number of layers. tec-speed 7.0 and 7.1 are sophisticated
multi-layer circuit board materials designed to meet
the requirements of high-end networking equipment
for high-capacity and high-speed transmission.
Ultra-Low-Loss specifications ensure excellent signal
integrity for extremely high-speed applications.

Key Features / 關鍵特性 Applications / 應用

Dk: 3.5 / 3.2 Extremely High-Speed (56Gbps/Channel)
Df: 0.003 / 0.002 Network Equipment
Tg: 200ºC 超高速（單通道56Gbps）網路通訊設備

Datacenters, Switches, Routers
資料中心，交換機，路由器

Td: 405ºC

Base Stations
基地台

Radio Frequency & Microwave Applications
射頻微波

Optical Communications
光通訊

Properties / 特性 Test Method / 測試方法 Units / 單位 tec-speed 7.0 tec-speed 7.1
VT-463 VT-463(LK)
Dk @ 10GHz Cavity resonator - 3.5 3.2
- 0.0028 0.0018
Df @ 10GHz Cavity resonator oC 200 200
oC 410 410
Tg IPC-TM-650 2.4.25 sec >600 >600
minute >120 >120
Td ASTM D3850 ppm/oC 40 40
ppm/oC 220 220
Thermal Stress @ 288˚C IPC-TM-650 2.4.13.1 % 2.5 2.5
Lb/in 4.5 4.5
T288 IPC-TM-650 2.4.24.1

Before Tg IPC-TM-650 2.4.24

Z-CTE After Tg IPC-TM-650 2.4.24

Total IPC-TM-650 2.4.24

Peel Strength (1oz HVLP) IPC-TM-650 2.4.8

All test data provided are typical values and not intended to be specification values.
所有測試資料均為典型值，無意用於規範。

SDD21

2.000 dB/ Method
AFR with VNA
0.000
Differential Pare Line Length
-2.000 15 inch and 5 inch

-4.000 Copper
Hoz HVLP (1μm roughness)
Insertion loss (dB/10 inch) -6.000

-8.000 tec-speed 7.1
-10.000

-12.000 tec-speed 7.0
-14.000

-16.000

-18.000 3999.00 MHz/ 40.00 GHz

-20.000

10.00 MHz (Step 10.00 MHz)

tec-speed - high-frequency

tec-speed: High-Frequency Material Technology

The ultimate choice for high-reliability and high-frequency applications

tec-speed: 高頻材料技術

高可靠性和高頻應用的終極選擇

The highest signal-integrity characteristics for the most 對於最先進的高頻系統來說，最高的信號完整性可能只是您
advanced high-frequency systems your designers may 的設計人員今天才會想到的。而我們卻已經具備支援未來尖
only be imagining today. We have the chemistry and the 端汽車電子產品的產品和能力。
capacity to support the cutting-edge automotive
electronics of the future. 騰輝蘇州工廠引進最先進的高溫壓合設備和迴流系統生產
線，極大地提高了生產能力，可以滿足全球對PTFE材料日益
Ventec's lastest state-of-the-art high-temperature 增長的需求。
press and lay-up/break-down line at the company's
Suzhou (China) manufacturing plant delivers a significant
increase in manufacturing capacity to meet the growing
global demand for PTFE laminates.

Key Features / 關鍵特性 Tg: 160-280 ºC
Td: 402-520 ºC
Dk: 3.0-10.2

Df: 0.0009-0.0037

Applications / 應用 tec-speed 20.0 tec-speed 30.0 tec-speed 30.0
VT-3703 / VT-3706 VT-6710
Cellular Base Station Antenna / 手機基地台天線
Wimax Antenna Networks / Wimax天線網路
Power Amplifiers / 功率放大器
Automotive Radar / 汽車雷達
LNB (Low Noise Block) for Broadcast Satellites / 廣播衛星低雜訊降頻器
RF Identification (RFID) / 射頻識別
Patch Antenna for Wireless Communication / 無線通信的貼片天線
Global Positioning Satellite Communication Systems / 全球衛星定位系統天線
Military Radar / 軍用雷達

tec-speed 30.0

VT-3703 VT-3706 VT-6710

Dk 3.0 Dk 6.15 Dk 10.2
Df 0.0009 Df 0.0019 Df 0.0022

PTFE
High Frequency

High Frequency
Thermoset

Df Dk 3.48 Dk 3.40 Dk 3.30 DkD3f.00.00027
0.0037
Df 0.0027 Df 0.0025
VT-870 H348 VT-870 L340 VT-870 L330 VT-870 L300

tec-speed 20.0

Description / 描述 Type / 機型 Product / 產品 Tg Td Z-Axis CTE Z-Axis CTE T-288 Dk @ 10GHz Df @ 10GHz IPC-4103
( ̊C) ( ̊C) (before (%) Total (mins)
VT-3703 Tg) >120 3.0±0.04 0.0009 /06
VT-3706 - 520 >120 6.15±0.15 0.0019 /07
High frequency, PTFE tec-speed 30.0 VT-6710 - 520 25 (50-288 ̊ C) >120 10.2±0.25 0.0022 /08
tec-speed 30.0 - 520 >120 3.0±0.05 0.0027 /230
High frequency, PTFE tec-speed 30.0 24 (50-288 ̊ C) 3.3±0.05 0.0025 /10 & /240
tec-speed 20.0 >120 3.4±0.05 0.0027 /10 & /240
High frequency, PTFE tec-speed 20.0 16 (50-288 ̊ C) 3.48±0.05 0.0037 /10 & /240
tec-speed 20.0 >120
High frequency, tec-speed 20.0 VT-870 L300 280 418 30 (50-250 ̊ C)
hydrocarbon >120
VT-870 L330 280 402 35 (50-250 ̊ C)
High frequency,
hydrocarbon VT-870 L340 280 406 33 (50-250 ̊ C)

High frequency, VT-870 H348 280 410 31 (50-250 ̊ C)
hydrocarbon

High frequency,
hydrocarbon

All test data provided are typical values and not intended to be specification values.
所有測試資料均為典型值，無意用於規範。

tec-speed 20.0

tec-speed 20.0 - Dk 3.0~3.48
Ceramic-Filled Hydrocarbon Thermoset Material

No More Compromises - Performance, Price & Availability

tec-speed 20.0 Dk 3.0~3.48 具有陶瓷填料的碳氫熱固型材料

無需再妥協 - 性能、價格與有效性

Designed to preserve signal integrity up to high-GHz 專為保持高頻下的訊號完整性而設計的 tec-speed 20.0 (VT -870) 具
frequencies, tec-speed 20.0 (VT -870) laminate has 有極佳的電性能, Dk 3.0~3.48 和 Df 0.0027~0.0037 。通過最小化插
extremely low 3.0~3.48 Dk and 0.0027~0.0037 Df. By 入損耗，tec-speed 20.0為您提供了更大的自由度來優化線
minimizing insertion losses, tec-speed 20.0 gives you 寬線距和PCB厚度，以匹配您的應用需求。
more freedom to optimize copper trace widths, spacing,
and PCB thickness to suit your application. 依照業界標準規範的IPC-TM-650規範測試，tec-speed 20.0
通過了UL認證，長期穩定地提供傑出的熱性能。高玻璃轉化溫
Tested according to IPC-TM-650 specifications – 度、高剝離強度和低熱膨脹係數，即使是在最難解決的高速電
the industry’s gold-standard – tec-speed 20.0 is 路, 也可確保結構完整性。
UL-approved, reliable and durable, offering outstanding
thermal performance. High glass transition temperature tec-speed 20.0 基板 (VT-870) 和黏合片 (VT-870PP) 已正式量產，搭
(Tg), high peel strength, and low CTE ensure structural 配標準的高溫延展銅箔，或用於衰減無源互調 (PIM) 作用的超低
integrity, even in hardworking, high-speed circuits. 棱線銅箔。

tec-speed 20.0 is available as laminate (VT-870) or prepreg
(VT-870PP), and with standard HTE copper foil, RTF
(Reverse Treated Foil) or HVLP (Hyper Very Low Profile) foil
used to attenuate passive intermodulation (PIM) effects.

Key Features / 關鍵特性 Td: 402~418 ºC Peel strength: 1.05 N/mm

Dk: 3.0~3.48

Df: 0.0027~0.0037 Z axis CTE: 31 ppm/ºC IPC 4103 /11

Tg: 280ºC X/Y axis CTE: 10/11 ppm/ºC PP/Bondply available

Applications / 應用 tec-speed 20.0 tec-speed 20.0 tec-speed 20.0 tec-speed 20.0

Cellular Base Station Antennas / 手機基地台天線 L300 L330 L340 H348
WiMax Antenna Networks / WiMax天線網路
Power Amplifiers / 功率放大器
Automotive Radar / 汽車雷達
Low Noise Block / 低雜訊降頻器
Security Monitoring Equipment / 安防監控設備

Properties / 特性 Test Method / Units / tec-speed 20.0 tec-speed 20.0 tec-speed 20.0 tec-speed 20.0
測試方法 單位 L340* H348
Dielectric Constant IPC-TM-650 2.5.5.5 - L300 L330 3.4±0.05 3.48±0.05
@10GHz Clamped Stripline -
Differential Phase - 3.0±0.05 3.3±0.05 3.55 3.66
Design Dk Length Method -
(1.7~5GHz) 2.98 3.45 0.0022 0.0032
IPC TM650 2.5.5.13 0.0027
Dissipation Factor 0.0023 0.002 -160 0.0037
@2.5GHz Cavity resonator 0.0027 0.0025 280
406 -160
@10GHz 33 280
0.70 410
PIM*1 43dBm, 1900MHz dBc -165 -160 6.0 31
V-0 0.690
Tg IPC-TM-650 2.4.24 oC 280 280 32, 40, 62 6.0
Td ASTM D3850 oC 418 402 Hoz, 1oz V-0
Z-CTE (50~250oC) IPC-TM-650 2.4.24 ppm/oC 30 35 No 3.3, 4.0, 6.6, 10, 16.6,
20, 30, 40, 60
Thermal Conductivity ASTM D5470 W/mK 0.75 0.72 Hoz, 1oz, 2oz
VT-870PP
Peel Strength (1oz) IPC-TM-650 2.4.8 Lb/in 5.0 6.0 BH348-4mil

Flammability UL-94 Rating V-0 V-0
20, 30, 32,
Dielectric Thickness - mil 10, 20, 30, 40, 60
40, 60 Hoz, 1oz

Copper Thickness - oz Hoz, 1oz No

Prepreg Type - - VT-870PP
BL300-5mil

All test data provided are typical values and not intended to be specification values.
所有測試資料均為典型值，無意用於規範。

*VT-870 L340 is available in Asia only.

tec-speed 30.0

tec-speed 30.0 - Dk 3.0~10.2
Ceramic-Filled High-Speed/High-Frequency PTFE Material

Highest signal-integrity characteristics for
the most advanced high-frequency systems

tec-speed 30.0 Dk 3.0~10.2 陶瓷填充的PTFE材料

無需再妥協 - 性能、價格與有效性

With 5G and evermore sophisticated radar applications, 隨著5G和複雜的雷達應用，對低損耗/高頻材料的需求和要求正
the demand and requirements for low loss/high frequency 在加速增長。嚴苛的RF /微波，天線，功率放大器和子組件應用
material is accelerating. Critical RF/Microwave-antenna- 需要出色的電氣性能，這些性能可以通過PTFE基板提供。騰輝的
power amplifier- and sub-assembly-applications require tec-speed 30.0陶瓷填充高速/高頻PTFE材料為最先進的高頻系統
superior electrical performance that can be delivered (例如77~79 GHz汽車雷達系統)提供了最高的訊號完整性。
through PTFE laminates. tec-speed 30.0, Ventec’s ceramic
filled high-speed/high-frequency PTFE material range tec-speed 30.0的Dk規格為汽車雷達，基地台，功率放大器和
offers the highest signal-integrity characteristics for the 天線，全球衛星定位天線，無線通信的貼片天線或電源背板等
most advanced high-frequency systems such as 應用提供了廣泛的選擇。
77~79 GHz automotive radar systems.

tec-speed 30.0's Dk specifications offer a wide range
of options for applications such as automotive radar,
cellular base stations, power amplifiers & antennas,
global positioning satellite antennas, patch antennas for
wireless communication or power backplanes.

Key Features / 關鍵特性 Stable Dk versus temperature
隨溫度的變化具有穩定的Dk性能
PTFE without glass reinforcement Lower in-plane thermal expansion
沒有玻璃布增強的PTFE材料 較低的平面熱膨脹
Ceramic filled PTFE composites
陶瓷填充的PTFE材料
Dk 3.0 with excellent extremely low Df (0.0009)
Dk 3.0且超低損耗Df (0.0009)

Applications / 應用 tec-speed 30.0 tec-speed 30.0 tec-speed 30.0

77~79GHz Automotive Radar Systems / VT-3703 VT-3706 VT-3710
77-79GHz汽車雷達系統

Patch Antenna for Wireless Communications /
無線通信的貼片天線

Global Positioning Satellite Communication Systems /
全球衛星定位系統天線

Power Amplifier & Antenna for Cellular Communications /
移動通訊的功率放大器與天線

Direct Broadcast Satellites / 直播衛星

Properties / 特性 Test Method / Units / 單位 tec-speed 30.0 tec-speed 30.0 tec-speed 30.0
測試方法 VT-3703 VT-3706 VT-6710
Dielectric Constant IPC-TM-650 2.5.5.5 - 3.0±0.04 6.15±0.15 10.20±0.25
@10GHz Clamped Stripline
Design Dk Differential Phase - 3.00 6.50 11.2
(8~40GHz) Length Method
Dissipation Factor - 0.0009 0.0019 0.0022
@10GHz IPC-TM-650 2.5.5.13
Thermal coefficient of - -3 -260 -420
Dk IPC-TM-650 2.5.5.5 oC 520 520 520
Td -50~150˚C W/mK 0.51 0.80 0.87
ASTM D3850 ppm/ oC 16/17 17/17 24/24
Thermal Conductivity ppm/ oC 25 24 47
ASTM D5470 Lb/in (N/mm) 13.0 (2.28) 8.0 (1.40) 12.5 (2.19)
x, y-axis CTE MPa 908/805 1500/1295 932/560
IPC-TM-650 2.4.24.5 gm/m3 2.1 2.6 3.1
Z-axis CTE % 0.04 0.02 0.01
IPC-TM-650 2.4.24 Rating V-0 V-0 V-0
Peel Strength (1oz)
IPC-TM-650 2.4.8
Tensile Modulus
ASTM D638
Density
ASTM D792
Moisture Absorption
IPC-TM-D650 2.6.2.1
Flammability
UL-94

All test data provided are typical values and not intended to be specification values.
所有測試資料均為典型值，無意用於規範。

VT-3703 Normalised Dk vs Frequency VT-3703 - TcDk @10GHz with clamped stripline test method

Dk HTE Copper Reverse Treated Copper 1.01 VT-6710
3.4 1.005 VT-3703 / VT-3706
3.3 10
3.2 Frequency (GHz) 1
3.1 0.995
3.0
2.9 0.99
2.8 0.985

1 0.98
100 -50 -25 0 25 50 75 100 125 150

Temperature 0C

tec-thermal

tec-thermal: High-Performance IMS Material Technology

Designed for the world’s most thermally demanding PCB applications

tec-thermal: 高性能金屬基板技術

專為世界上最嚴苛的散熱應用PCB設計

Automotive, medical, industrial, aerospace & military 全球範圍的汽車、醫療、工業、航太與軍工製造商可以依靠騰輝
manufacturers around the world can rely on Ventec 提供技術創新解決方案為電子模組和元件散熱。tec-thermal系列
to deliver technologically innovative solutions that 提供最先進的高性能絕緣金屬基板材料，具有陶瓷填料的無鹵素
dissipate heat from electronic modules and assemblies. 介質技術，提供無與倫比的熱性能、信賴度和品質。騰輝同時提
Ventec’s tec-thermal range offers the latest advances 供多種產品, 滿足高導熱多層PCB的設計。
in high-performance IMS materials that deliver an
exceptional thermal performance, reliability and quality tec-thermal系列提供全系列的導熱產品，搭配最寬厚度範圍的絕
through their established ceramic-filled halogen-free 緣介質選擇和導熱係數。
dielectric technology. Multi-layered constructions are
made possible through resin-coated foil and film options.

With tec-thermal Ventec offers the most comprehensive
range of thermally conductive products with the widest
choice of dielectric thicknesses and dielectric
thermal-conductivity.

Key Features / 關鍵特性 Tg: 100-190ºC

Dk: 4.3-5.1

Df: 0.008-0.016 Td: 370-380ºC

Applications / 應用 VT-4A1 VT-4A2 VT-4A2H VT-5A2 VT-4B1 VT-4B3 VT-4B5 VT-4B5L VT-4B5SP VT-4B5H VT-4B7

Ultra-bright LED / 超亮LED

Power Conversion, Power Supply /
電力轉換、電源

Welder / 電焊機
Air Conditioning / 空調
Monitor Drives / 監視器驅動
OBC / 車載充電器
EPS / 電子助力轉向

Pump & Fan Controllers /
泵&風扇控制器

Hybrid Multilayer Constructions /
混壓多層板

3D Assemblies / 3D組裝

VT-4B7 SP 7.0 W/m.K Ultra Thermal Conductivity > 7 W/m.K
Low Rth Thermal Conductivity > 3 W/m.K
min Rth 0,009 °C*in2/W
Low Rth
VT-4B7 7.0 W/m.K
Thermal Conductivity > 2 W/m.K
min Rth 0,011 °C*in2/W
Mid Rth Thermal Conductivity > 1 W/m.K
VT-4B5SP 4.2 W/m.K
Std Rth
min Rth 0,015 °C*in2/W

VT-4B5 / VT-4B5H 4.2 W/m.K

min Rth 0,019 °C*in2/W

VT-4B5L 3.6 W/m.K

min Rth 0,023 °C*in2/W

VT-4B3 3.0 W/m.K

min Rth 0,026 °C*in2/W

VT-5A2 2.2 W/m.K

min Rth 0,054 °C*in2/W

VT-4A2 / 4A2H 2.2 W/m.K

min Rth 0,054 °C*in2/W

VT-4A1 1.6 W/m.K

min Rth 0,074 °C*in2/W

VT-4B1* 1.0 W/m.K

min Rth 0,078 °C*in2/W

Remark: min Rth calculated using a 50μ dielectric thickness
*VT-4B1 is available only for volume production programs
by arrangement

Product /產品 Thermal Thermal Dielectric Tg Td Dk Df MOT Flammability Peel Strength - 1oz
Conductivity Impedance Break (DSC) (TGA)
( ̊C*in2/W) ( ̊ C) ( ̊ C) (@1 MHz) (@1 MHz) (̊C) (UL 94) LB/in (N/mm)
(W/m*k) Down (Volt)
100
Without Glass Reinforcement / 無玻纖布 3000 100
7000 120
VT-4B7SP 7.0 0.009 3000 180 380 4.8 0.016 130 V-0 7 (1.23)
7000 100 4.5 (0.79)
VT-4B7 7.0 0.017 7000 120 380 4.8 0.016 130 V-0 7 (1.23)
7000 130 4.5 (0.79)
VT-4B5SP 4.2 0.015 7000 100 380 4.8 0.016 130 V-0 5 (0.88)
6000 7 (1.23)
VT-4B5H 4.2 0.029 130 400 4.8 0.016 155 V-0 11 (1.93)
6000 130 11 (1.93)
VT-4B5L 3.6 0.034 6000 130 380 4.8 0.016 155 V-0
6000
VT-4B5 4.2 0.029 380 4.8 0.016 130 V-0

VT-4B3 3.0 0.040 380 4.8 0.016 130 V-0

VT-4B1 1.0 0.116 380 4.8 0.016 130 V-0

Glass Reinforced / 有玻纖布

VT-4A2H 2.2 0.054 380 5.1 0.014 105 V-0 12 (2.1)
12 (2.1)
VT-4A2 2.2 0.054 380 5.1 0.014 90 V-0 12 (2.1)

VT-4A1 1.6 0.074 380 5.0 0.015 90 V-0

All test data provided are typical values and not intended to be specification values.
所有測試資料均為典型值，無意用於規範。

VT-5A2

VT-5A2 Ceramic-Filled Thermally Conductive
Laminate or Prepreg

Superior thermal performance where size and simplicity matter

VT-5A2 陶瓷填充的高導熱基板和黏合片

優異的熱性能，對尺寸和設計簡單化尤為重要

For multi-layer circuits or ultra-thin circuits, for 對於多層板和超薄板，對於強化的陶瓷和覆銅陶瓷混成基板，或
strengthening ceramic or direct-bond copper (DBC) 者典型的陶瓷基板功率範圍之外的應用，騰輝的VT-5A2兼顧了高
hybrids, or in applications beyond the typical power 導熱係數、傑出的機械穩定性和電性。
range of ceramic substrates, Ventec’s VT-5A2 combines
high thermal conductivity with outstanding mechanical VT-5A2可以使持續運作的元件如大功率開關和整流器保持低溫以
stability and electrical properties. 維持最佳效果和可靠性。VT-5A2可用於厚達30z的銅，絕緣層厚度
從80μm至150μm，導熱係數是普通FR-4的8倍，是無風扇和散熱
VT-5A2 keeps hardworking components such as 片設計的極佳材料。
high-power switches or rectifiers cool for optimum
performance and reliability. VT-5A2 is available with VT-5A2導熱基板和黏合片採用陶瓷填充，推薦用於高功率應用及
up to 3-oz copper, and from 80μm-150μm thickness. 厚銅設計。
With eight-times better thermal conductivity than
ordinary FR4, VT-5A2 is a great choice for fanless
orheatsink-free designs.

VT-5A2 is available as ceramic filled thermally
conductive laminate, or prepregs recommended for
high-power applications or with heavy copper traces.

Key Features / 關鍵特性 Applications / 應用

Thermal conductivity: 2.2 W/mk Flat-panel televisions, Monitor Drives
Tg: 190ºC 平板電視，監視器驅動
Td: 375ºC
T260 >60 min, T288 >30min, T300 >15 min Automotive Electronics
MOT: up to 150ºC 汽車電子
Lead-free assembly compatible
Hybrid Multilayer Constructions
混壓多層板結構

High-Performance Power Conversion
高性能功率轉換

General applications requiring thermal
performance beyond FR4
高於普通FR-4熱性能的一般應用

Properties / 特性 Test Method / 測試方法 Units / 單位 Specification / 規範 Typical Value / 典型值

Thermal Properties / 熱學特性 190
375
Tg IPC-TM-650 2.4.25 ˚C 170 minimum >60
Td ASTM D3850 ˚C 340 minimum >30
T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >15
T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >600
T300 IPC-TM-650 2.4.24.1 Minute 5 minimum 29
Thermal Stress @ 288˚C IPC-TM-650 2.4.13.1 Second 10 minimum 220
Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/˚C 60 maximum 2.1
IPC-TM-650 2.4.24 ppm/˚C 300 maximum
After Tg IPC-TM-650 2.4.24 % 3.0 maximum 11~13
Total Expansion 130 (Internal test 150)
(50~260˚C) IPC-TM-650 2.4.24 ppm/˚C –
X-Y CTE UL 746B ˚C – 4.3
MOT 0.008
IPC-TM-650 2.5.5.9 5.0E+8
Electrical Properties / 電氣特性 IPC-TM-650 2.5.5.9
IPC-TM-650 2.5.17.1 5.0E+7
Dk (RC 50%) @ 1GHz – 5.2 maximum 5.0E+7
Df (RC 50%) IPC-TM-650 2.5.17.1 – 0.035 maximum
Volume @ 1GHz IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 5.0E+6
Resistivity After Moisture >1000 (40)
Resistance IPC-TM-650 2.5.17.1 60
IPC-TM-650 2.5.6.2 Grade 0 (600)
E-24/125 IPC-TM-650 2.5.6 MΩ-cm 1.0E+3 minimum >150
ASTM D3638 MΩ 1.0E+4 minimum
Surface After Moisture ASTM D495 6.8 (1.2)
Resistivity Resistance 6.8 (1.2)
IPC-TM-650 2.4.8
E-24/125 IPC-TM-650 2.4.8 MΩ 1.0E+3 minimum 0.12
Volt/mil (KV/mm) 762 (30) minimum V-0
Electrical Strength IPC-TM-650 2.6.2.1 KV 40 minimum 2.2
UL-94 Rating (Volt) – 3.4
Dielectric Breakdown ISO22007-2 Second 60 minimum 0.895
2.2
Comparative Tracking Index (CTI) ASTM E1269
ASTM D792 Method A
Arc Resistance

Mechanical Properties / 機械特性

Peel Strength As received lb/in (N/mm) –
lb/in (N/mm) 6 (1.05) minimum
(1oz) After thermal stress

Physical Properties / 物理特性

Moisture Absorption % 0.5 maximum
Rating –
Flammability W/mK –
–
Thermal Z axis J/gK –
Conductivity X, Y axis g/cm3 –

Specific Heat
Specific Gravity

All test data provided are typical values and not intended to be specification values.
所有測試資料均為典型值，無意用於規範。

VT-4B

VT-4B Series IMS: Aluminium Base Layer;
Ceramic-Filled, Non-Reinforced Dielectric

Versatile choice of formable substrates, selective dielectric,
conductivity from 1.0 to 7.0 W/m.K

VT-4B 系列金屬基板，陶瓷填充，無玻璃布

在可彎折基材、精選的介電層、1~7.0 W/mK的導熱係數的產品裡靈活選擇

When you need the superior thermal dissipation of an 當您需要高散熱性能的金屬基板時，可以在選擇多樣的VT-4B系列
insulated metal substrate (IMS), you will find the right 裡找到最匹配的性能和特性的優秀產品。
performance and properties for your application in our
versatile VT-4B family. VT-4B1專為彎折和變形設計。微小的彎折半徑使得裝配在狹
小的空間裡遊刃有餘，完美實現了工程美學。超級柔軟的基
VT-4B1 is designed for bending and forming. The tiny 質不會發生開裂或剝落。導熱係數1.0W/mK，最低熱阻可達
minimum radius eases fitting in tight spaces, for an 0.078°C*in2/W。
elegantly engineered assembly. The extremely flexible
dielectric will not crack or peel. Thermal conductivity 從VT-4B3到VT-4B7，整個家族產品提供了眾多的熱性能選擇。
1.0W/m.K, for minimum Rth 0.078°C*in2/W. 導熱係數從3W/mK到7.0W/mK，熱阻分別低至0.026°C*in2/W
和 0.011°C*in2/W，可滿足嚴苛的應用，如LED照明、高功率密度
From VT-4B3 to VT-4B7, the family provides a broad 轉換器、電源、汽車照明和控制。
choice of thermal performance. 3W/m.K to 7.0 W/m.K,
and minimum Zth from 0.026°C*in2/W to 0.011°C*in2/W 對於低電壓的應用來說，VT-4B5SP精選的介電層厚度保證了最大
satisfy demanding applications: LED lighting, 的熱效率。
high-power-density converters, power supplies,
automotive lighting and controls.

For low voltage applications, VT-4B5SP selective
preference substrates ensure maximum
thermal efficiency.

Key Features / 關鍵特性 Applications / 應用

Thermal conductivity: 1.0 - 10.0 W/mk 3D Assemblies
MOT: 130ºC 3D組裝
Tg: 100-130ºC
Td: 380ºC Power Conversion/Supply
Dielectric thickness: 50µm to 200µm 功率轉換/電源
Flammability UL94 V-O
Rectifiers
整流器

Automotive Projector/Matrix Lighting
汽車投影式/矩陣式燈光

Power Steering
助動力轉向

Item / 項目 Test Method Unit / 單位 VT-4B1* VT-4B3 VT-4B5 VT-4B5 SP VT-4B5H VT-4B5L VT-4B7
Thermal Conductivity 測試方法 W/m*K
(IPC-TM-650) 1.0 3.0 4.2 4.2 4.2 3.6 7.0
0.116 0.040 0.029 0.015 0.029 0.034 0.017
ISO22007-2 100 130 120 120 180 100 100
380 380 380 380 400 380 380
Thermal Impedance ISO22007-2 ºC*in2/W ≥5 ≥5 ≥5 ≥5 ≥5 ≥5 ≥5
>600 >600 >600 >450 >600 >600 >600
Tg DSC 2.4.25 ºC 6000 6000 7000 3000 7000 7000 7000
4.8 4.8 4.8 4.8 4.8 4.8 4.8
Td TGA ASTM D3850 ºC 0.016 0.016 0.016 0.016 0.016 0.016 0.016
5.0E+8 5.0E+8 5.0E+8 5.0E+8 5.0E+8 5.0E+8 5.0E+8
Thermal Stress Solder Dip@288ºC 2.4.13.1 Minute 3.0E+7 3.0E+7 3.0E+7 3.0E+7 3.0E+7 3.0E+7 3.0E+7
2.0E+7 2.0E+7 2.0E+7 2.0E+7 2.0E+7 2.0E+7 2.0E+7
Hi-Pot Proof Test DC 2.5.7.2 V 5.0E+6 5.0E+6 5.0E+6 5.0E+6 5.0E+6 5.0E+6 5.0E+6
11 11 7 7 5 4.5 4.5
Breakdown Voltage AC 2.5.6.3 V 600 600 600 600 600 600 600
V-0 V-0 V-0 V-0 V-0 V-0 V-0
Dk @ 1MHz C-24 /23 / 50 2.5.5.3 _ 130 130 130 130 155 155 130
130 130 130 130 155 155 130
Df @ 1MHz C-24/ 23 / 50 2.5.5.3 _

Volume Resistance After Moisture 2.5.17.1 MΩ-cm
E-24/125

Surface Resistance After Moisture 2.5.17.1 MΩ
E-24/125

Peel strength (1oz) As Received 2.4.8 Lb/in

CTI As Received ASTM D3638 V

Flammability As Received UL 94 Rating
RTI Electric UL 746E ºC
Mechanical UL 746E ºC

All test data provided are typical values and not intended to be specification values.
所有測試資料均為典型值，無意用於規範。

*VT-4B1 is available only for volume production programs by arrangement.

Polyimide

Polyimide Laminates and Prepregs:
Superior Strength, Stability and Endurance

For high-performance substrates that can take
the heat and the stress

聚醯亞胺基板和黏合片：優異的強度、穩定性和耐受性

用於可以承受高熱和應力的高性能基質

Ventec’s polyimide laminates and prepregs ensure the 騰輝的聚醯亞胺板材確保足夠的機械韌性以應對整板一體化的挑
mechanical flexibility needed to ease board-integration 戰。同時，材料的彈性和尺寸穩定性, 即使在非常嚴苛的環境下,
challenges. At the same time, the materials’ resilience and 仍然使得電路保持在最佳的性能。
dimensional stability keep circuits performing at their best,
even in unusually demanding environments. 我們的聚醯亞胺不含MDA配方, 已通過美國航空及太空總署(NASA)
的釋氣測試與認可, 可以供應基板與黏合片。騰輝自主發展的專有
Our safe non-MDA formula, with low outgassing tested 樹脂系統完全在內部生產，為供應鏈提供了充分的安全性和品質
and approved by NASA, is available as laminate or prepreg. 保證。我們品質導向的生產流程可確保基材的純淨度，從而保證
Ventec’s proprietary resin system is produced entirely 強度和耐久性。
in-house, giving ultimate supply-chain security and quality
assurance. Our quality-focused process flow safeguards 優異的熱性能，結合高導熱和熱穩定性，可輔助散熱，並能承受
substrate purity to ensure strength and durability. 困難的工作條件。具備廣闊的操作溫度範圍，以及可全面匹配的
化學相容性，使得聚醯亞胺成為工業、汽車、航太和其他殘酷、
Outstanding thermal characteristics, combining high 嚴苛的應用環境下的主要選擇。
thermal conductivity and heat resistance, aid dissipation
and withstand tough working conditions. The wide operating
temperature range, as well as broad chemical compatibility,
makes polyimide a great choice for deployment in industrial,
automotive, aerospace and other harsh and exacting scenarios.

Key Features / 關鍵特性 Applications / 應用

Tg: 250ºC Aerospace
Td: 395ºC 航太
Z axis CTE: 50 ppm/ºC
T260/288 >60 min Military
Flex strength: 87 psi 軍工

Semiconductor packaging/burn-in boards
半導體封裝/老化測試板

Power Supplies
電源

Backplanes
背板

Polyimide

Description / 描述 Product / 產品 Tg (̊C) Td Z-Axis CTE Z-Axis T-300 Dk @1 GHz Df @1 GHz Flammability IPC-
( ̊ C) (before Tg) CTE 4101E
Polyimide, non MDA (%) Total (Minutes) (RC 50%) (RC 50%) (UL 94)
Polyimide, non MDA 50 /40 /41
VT-901 250 395 50 1.4 >30 4.05 0.012 V-0 /40 /41
VT-90H 250 408 >30 4.05 0.012 HB
1.2

Rigid Flex & VT-901LF/NF 200 390 50 2.5 >30 3.8 0.015 V-0 /40
Heat-Sink Prepreg 40 (RC 75%) >30 4.3 0.016 V-0 /40 /41

Via hole filling (seq.lam) VT-901HW 250 390 3.2
and thick copper (RC 75%)

All test data provided are typical values and not intended to be specification values.
所有測試資料均為典型值，無意用於規範。

Proprietary resin system providing security of 自主產權的樹脂體系，確保原料供給、品質和穩定性
supply, quality and consistency
美國太空總署測試並核可的釋氣測試
NASA tested and approved for outgassing 獨立的製造和裁切系統，以減少污染和異物的風險

Separate manufacturing and cutting systems 自主產權的樹脂過濾和清潔系統
reduce the risk of contaminations and inclusions 歐洲航天局認證

Proprietary resin filtration and cleaning systems

ESA-qualified

FR4 Materials

FR4 Glass-reinforced
Epoxy Laminate Material

The backbone material
PCB Designers rely on

FR4 玻璃布增強的環氧樹脂層壓材料 我們可以提供標準和客制的基材厚度的高質量FR4環氧玻璃基板
和黏合片，以及適用於低功率至高功率應用的銅箔。高抗彎曲強
PCB設計者所依賴的主幹材料 度和剝離強度，高Tg和高Td以及出色的介電性能。較低的X-Y和z
軸熱膨脹係數可以確保在較高的工作溫度下焊錫的可靠性和尺寸
High-quality FR4 epoxy-glass laminates and prepregs in 穩定性。
standard and custom core thicknesses, and copper-foil
gauges for low- to high-power applications. High flex
and peel strength, high Tg, and high Td combine with
excellent dielectric properties. Low X-Y and z-axis CTE
ensure solder-joint integrity and dimensional stability up
to high operating temperatures.

Description / 描述 Product / Tg (̊C) Td (̊C) Z-Axis CTE Z-Axis T-260 Dk @1 GHz Df @1 GHz Flammability IPC-
產品 (before Tg) CTE 4101E
Phenolic Cured, (%) Total (Minutes) (RC 50%) (RC 50%) (UL 94)
Lead free VT-481 /97 /98
155 345 45 2.6 >60 4.3 0.015 V-0 /99 /101
Phenolic Cured, VT-47
Lead free 180 355 45 2.3 >60 4.27 0.016 V-0 /97 /98
/99 /101

/126

Dicy Cured VT-42 140 310 50 3.75 20 4.2 0.015 V-0 /21
130 310 40 3.5 25 4.8 0.018 V-0 /97
Dicy Cured, CTI 600V VT-42C 150 315 50 3.75 25 4.2 0.015 V-0 /21 /24

Dicy Cured VT-42S 140 305 50 3.75 10 4.5 0.018 V-0 /21

Dicy Cured, Black, VT-42
Light Blocking (Black)

Phenolic Cured, VT-441V 158 385 38 2.2 >60 4.4 0.014 V-0 /127 /128
Lead & Halogen Free VT-447V 175 385 40 2.2 >60 4.35 0.013 /153

Phenolic Cured, V-0 /127 /128
Lead & Halogen Free /130 /154

Phenolic Cured, VT-441 158 385 38 2.2 >60 4.4 0.014 V-0 /127 /128
Lead & Halogen Free 175 385 40 2.2 >60 4.35 0.013
VT-447 180 380 45 2.3 >60 4.35 0.013 V-0 /127 /128
Phenolic Cured, VT-447 155 385 35 2.2 >60 4.6 0.011 /130
Lead & Halogen Free (Black)
VT-441C V-0 /127 /128
Phenolic Cured, /130
Black, Light Blocking
V-0 /127 /128
Phenolic Cured,
CTI 400V

All test data provided are typical values and not intended to be specification values.
所有測試資料均為典型值，無意用於規範。

Special Applications

Special Prepreg

Bringing Ventec quality, performance
and value to specialist circuits

特殊應用-黏合片

為特殊功能的電路板帶來騰輝的品質，性能和價值

Bring Ventec quality, performance, and value to circuits 為特殊功能的電路板帶來騰輝的品質，性能和價值。例如那些需
with specialist requirements. Like those needing 要機械柔韌性的產品-無論是一次成型以允許在產品組裝過程中進
mechanical flexibility - whether formed once to 行安裝，還是與諸如印表機機頭或光碟驅動器之類的運動部件進
allow installation during product assembly or flexing 行動態撓曲，我們的柔性和軟硬結合板材料均可承受迴流溫度並
dynamically with moving parts such as a printer head or 保持其結構完整性以防止疲勞或腐蝕。
optical drive, our flex and flex-rigid formulas withstand
reflow temperatures and maintain their structural 當您需要特殊的屬性, 例如用於高壓應用的高CTI, 或用於填充或增
integrity to prevent fatigue or corrosion. 層所需的低收縮率或出色的穩定性等其他特性，騰輝可以幫助您
實現每個細節都恰到好處。
When you need special properties, such as high CTI for
high-voltage applications, or other properties such as
low shrinkage or superior stability for filling or build-up,
Ventec can help you get every detail just right.

Description / 描述 Product / 產品 Tg (̊C) Td (̊C) Z-Axis CTE Z-Axis Dk @1 GHz Df @1 GHz Flammability IPC-4101E
(before Tg) CTE (RC 50%) (RC 50%) (UL 94)
(%) Total
tec-speed 4.0 No Flow Prepreg VT-462L 190 360 52 2.5 3.9 0.005 V-0 /126
50 3.52
Via hole filling (seq.lam) and VT-901HW 250 390 50 (RC75%) 4.3 0.016 V-0 /40 /41
thick copper, Polyimide 70
55 2.5
Rigid-Flex and Heatsink Prepregs, VT-901LF/NF 200 390 3.8 0.015 V-0 /40
Halogen Free LCTE 3.5 3.9 0.015
4.3 0.018
Rigid-Flex and Heatsink Prepregs, VT-447LF/NF 170 370 3.5 3.9 0.017 V-0 /127 /128
Halogen Free (RC75%) /130

Via hole filling (seq.lam) and VT-47VF 180 355 4.0 V-0 /127 /128
thick copper, FR4 /130

Rigid-Flex and Heatsink Prepregs VT-47LF/NF 170 360 70 V-0 /97 /98 /99
/101 /126

All test data provided are typical values and not intended to be specification values.
所有測試資料均為典型值，無意用於規範。

Substrates

Integrated IC Package Substrates

Enabling reliable IC packaging
IC載板

確保可靠的IC封裝

With the rise of new types of ICs like BGA (ball grid array) and 隨著BGA和CSP等新型IC的興起，騰輝處於集成IC封裝基板產品
CSP (chip scale package), Ventec is at the forefront of product 開發的最前沿。
development for integrated IC package substrates.
我們的先進技術材料可提供當今重量輕，更薄，更小的先進功能
Our advanced technology materials deliver the properties 設備, 例如智慧型手機，筆記型電腦，可穿戴設備和特殊的軍事/
& performance demanded by today's light weight, ever- 航太應用等領域所要求的特性和性能要求。
thiner and smaller advanced-function devices such as smart
phones, laptops, wearables and special mil-aero applications.

Key Features / 關鍵特性 Applications / 應用

Super high Tg Memory Modules (TF/UDP/SIM)
Low coefficient of thermal expansion X-Y/Z 記憶體模組 (TF/UDP/SIM)
High modulus
Halogen free High Frequency Parts (AiP)
Environmentally friendly materials 高頻天線封裝 (AiP)

Semiconductor package / 半導體封裝
(CSP, FC-PKG, BGA, PGA & POP, SIP等 etc.)

! Semiconductor Testing Devices /
半導體測試裝置

LED RGB Display / LED RGB 顯示

Substrates

Test Item / 項目 Test Method / 測試方法 Unit / 單位 VT-464G VT-464GS VT-464GS(LK) VT-464GS(B)

Tg TMA IPC-TM-650 2.4.24 ºC 230 260 260 230
DMA IPC-TM-650 2.4.24.4 ºC 260 300 300 260
Color Etched - - Nature Nature Nature Black
CTE-X/Y ɑ1 IPC-TM-650 2.4.24.5 ppm/ ºC 9~10 6~8 6~8 10~12
Z CTE ɑ1 IPC-TM-650 2.4.24 ppm/ ºC 30 20 20 25
T-288 Unclad IPC-TM-650 2.4.24.1 min >60 >60 >60 >60
Td 5% WL ASTM D3850 ºC 420 450 450 400
Flexural Modulus 50ºC IPC-TM-650 2.4.4 Gpa 27~29 30~31 30~31 24~26
Dk 2GHz @70% Cavity Resonator - 3.3 3.5 3.2 3.8
Df 2GHz @70% Cavity Resonator - 0.003 0.0053 0.004 0.0075

All test data provided are typical values and not intended to be specification values.
所有測試資料均為典型值，無意用於規範。

CORPORATE HEADQUARTERS / 集團總部 The information contained in this brochure is valid at the time of printing and may
Ventec Electronics Co. Ltd. be subject to change. Refer to www.venteclaminates.com for latest information.
308 TaiShan Rd, 歐洲及非洲區域總部 歐洲及非洲區域總部 歐洲及非洲區域總部 歐洲及非洲區
New District Suzhou, 非洲區域總部 歐洲及非洲區域總部 歐洲及非洲區域總
Jiangsu, P.R. China 215129 June PCA 2020 – EN/CN-TRAD
T: +86 512-68091810
Email: [email protected]
EMEA REGIONAL HEADQUARTERS / 中東、歐洲及非洲區域總部
Ventec Europe
Unit 1 Trojan Business Centre,
Tachbrook Park Estate,
Leamington-Spa, CV34 6RH, UK
T: +44 1926-889822
Email: [email protected]
AMERICAS REGIONAL HEADQUARTERS / 美洲區域總部
Ventec USA
720 Lee Street
Elk Grove Village
Illinois IL 60007
United States of America
T: +1 630-422 1627
Email: [email protected]

www.venteclaminates.com

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