PICO-IMX7-EMMC
Main Features
The PICO-IMX7-EMMC design based on the NXP i.MX7
processor is a purpose-built, small footprint hardware
platform compatible with Intel Edison baseboards
and adds a number of additional high-speed signals
such as RMII LAN, USB and 24 bit TTL Display
ARM Cortex-A7 NXP i.MX7 scalable single / dual core
System-on-Module
WiFi 802.11ac and Bluetooth v. 4.0 communication
interface
EDISON EXP-A EXP-B
CAN PCIe HDMI SATA
SDIO I2S SPI PWM LVDS RGMII
UART I2C GPIO
Power USB USB
OTG HOST
3.3~4.5V
TTL I2C MIPI
Specifications
Core System NXP i.MX7 Solo @ 800 MHz / Dual @ 1GHz Video Image re-sizing, rotation, overlay and
ARM Cortex-A7 + M4 CSC Pixel Processing Pipeline
CPU up to 2GB DDR3 PXP
Technology Onboard eMMC (default 4GB)
System Memory Audio
Storage
Interface
Connectivity Audio Codec I2S (2 channel)
on Carrier Board
Network RGMII
WiFi Signals routed to connector Power Specifications
Bluetooth Broadcom BCM4339 802.11ac
Broadcom BCM4339 BT 4.0 Input Power 3.3 ~ 4.5 VDC
I/O Interface Signalling Connectors
Edison I/O @ 1.8V 9x GPIO Board-to-Board 1x Edison compatible connector (Hirose 70-pin)
2x Hirose 70-pin connectors
4x PWM
2x I²C
1x I²S Operation Systems
1x SPI Standard Support Linux 3.x, Yocto, Brillo
2x UART
USB-OTG
SDIO (4-bit)
Additional I/O @ 3.3V 24-bit TTL RGB
RGMII LAN
CAN
USB Host
I²C
PICO System-on-Modules and DWARF Platform
PICO-IMX7-EMMC
Block Diagram Broadcom Connector #2
BCM4339
eMEMMCC WiFi 802.11ac
DDR3 Bluetooth 4.0
NXP Additional Signals Connector #1
i.MX7 Edison Signals
Solo / Edison
Dual Connector
Environmental and Mechanical Ordering Information
Temperature Commercial : 0° to 60° C TBD.
Extended : -20° to 70° C
Humidity Industrial : -40° to 85° C (no WiFi) * Feel free to contact us for custom tailored Carrier Board request for
Dimensions 10 to 90% your projects.
36 x 40 mm
MTBF 1⅜ x 1⅝ inch
Weight >100,000 hours
Shock 8 grams
Vibration 50G / 25ms
20G / 0-600 Hz
Dimensions 36
(units in mm)
36
40
40
2015-05. All specifications are subject to change without notice.
PICO System-on-Modules and DWARF Platform