Magazine | News | Industries EDITION #12 | MAY 2026EXPLORING INDIA’S SEMICONDUCTOR AMBITIONSTECH INSIGHTSemiconductorForu.comHOW MICRO FUEL CELLS ARE REVOLUTIONIZING PORTABLE ELECTRONICS AND IOT DEVICESHow much power is enough to build battery-free electronics?ENERGY HARVESTING:A popular, Proven TechnologyEEPROM AT 40 YEARS:What does the future look like?HUMANOIDS:Powering the next era of intelligent electronicsGAN-ON-SI REVOLUTION:
E D I T I O NA N N I V E R S A RCATALOG Y
BATTERY CLIPS, CONTACTS,HOLDERS & RETAINERSAdvances in portable electronics and Lithium-Ion battery technology demand dependable battery connections. Keystone leads the way with a vast range of reliable, high-quality, cost-effective products for most battery types.SPACE-SAVINGFUSE CLIPS & HOLDERSFuse clips and holders for Electronics, Datacom, Telecom, Automotive and Solar use. Keystone answers your needs with SMT, Thru-Hole and Rivet mount products.SPACERS, STANDOFFS/SUPPORTS –METALLIC & NON-METALLICDiverse insulated and non-insulated spacers and standoffs are available in a wide range of lengths, thread sizes, hole sizes, mounting styles & materials. Choose from English or Metric type products for your PCB, panel and mounting applications.PINS, PLUGS, JACKS & SOCKETS,INDUSTRY’S MOST DIVERSE GROUPKeystone’s USB 2.0 & 3.0 Jacks and Plugs, Micro Pins/Jacks, Banana and Phono Plugs & Jacks are designed for use in the latest Mobile & Computer Electronics, Home Theatre, Test Gear and Industrial Interconnects.PANEL HARDWARE, HANDLES,SCREWS & LED SPACERSCheck out Keystone’s value-added products: Fan Filters & Guards, LED Lens Caps, Holders & Spacer Mounts, Jack Screws & Connector Hardware, Instrumentaion Handles, Cable Clamps, Knobs and more.PCB TEST POINTS &UL RECOGNIZED TERMINALSLow Profile and limited space drive today’s PCB connectivity designs. Keystone is the right fit with solder & solderless PCB Quick-Fit Snap-on, Snap-Fit and Screw-on terminals as well as Color-coded Screw Terminals & THM and SMT Test Points and more.Keystone Electronics Corp.Quality Electronic Conponents and HardwareLeading edge technology and precision manufacturing have defined Keystone’s performance for over 75 years. Their current Catalog K75 reflects their diversity of product to support today’s engineering and design community.Keystone’s personnel takes pride in meeting all requirements, efficiently and promptly. Our skilled and dedicated technicians, experienced production personnel and customer service teams have made us an industry leader.All Keystone facilities are fully integrated with 3D/CAD product modeling and CAD/CAM precision tool and die operations. Application and Engineering specialists utilize progressive dies, four-slides, wire forming, in-die tapping and high-speed blanking along with automated machining to produce tight tolerance standards and custom products. Secondary operations include: Tapping, Drilling, Assembly and Finishing.Application engineering services are available for product modifications or special design requirements. Products appearing in Keystone’s new and expanded Catalog K75 comply with RoHS and REACH directives. Our quality system is certified to the ISO 9001:2015 standards.IT’S WHAT’S ON THE INSIDE THAT COUNTS®E L E C T R O N I C S C O R P.55 South Denton Avenue, New Hyde Park, NY 11040 • (800) 221-5510 • (516) 328-7500www.keyelco.com • [email protected]
CONTENTSTechnology Updates 06Tech Spotlight 12Gan-On-Si Revolution: Powering the Next era of intelligent electronicsStart-up Sparks 10Next-Gen Sourcing: The rise of 1Buy.Ai in a $600 B Industry16\"The Future of automotive control: STMicroelectronics unveils the Ai-enhanced stellar P3E\"Luca Rodeschini | Stellar P3EIndustry Dialogs18Humanoids - What does the future look like?Blog Beat242636EEPROM at 40 years: A popular, proven TechnologyEnergy Harvesting: How much power is enough to build battery-free electronics?Industry BulletinBlog BeatBlog Beat22When smartphones start thinking aheadBlog Beat20\"We are building a true design-to-manufacturing bridge for the semiconductor ecosystem in India.\"Suresh Kumar Muthuswamy | Zettaone TechnologiesIndustry DialogsBreakthroughs fuelling the future of AI chipsBlog BeatHow micro fuel cells are revolutionizing portable electronics and IOT DevicesBusiness Unboxed 3034\" You cannot prompt your way to a working analog circuit- it's built on physics, patience, and instinct.\"Preethi Ashwath | Analog DevicesIndustry DialogsThe big push to bring physical buttons backBlog Beat 3840
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06 | www.semiconductorforu.comTECHNOLOGY UPDATESSiemens and Arm have expanded their strategic partnership to advance semiconductor and automotive innovation through integrated digital engineering technologies. The collaboration combines Siemens’ EDA, digital twin, and verification solutions with Arm’s compute platforms and semiconductor IP to accelerate chip and software development. The partnership focuses on AI-driven applications, software-defined vehicles, and faster pre-silicon validation workflows. It also supports academic initiatives and cloud-enabled development environments aimed at reducing design complexity, shortening product development cycles, and improving performance for next-generation semiconductor and mobility solutions worldwide.Siemens and Arm Expand Strategic CollaborationMurata will showcase its latest power electronics innovations at PCIM 2026, focusing on robotics, e-mobility, AI infrastructure, and energy systems. The company will introduce new isolated DC-DC converters, compact PoE solutions, and its advanced IPaS™ technology that integrates passive components directly into PCBs for higher efficiency and reduced system size. Murata will also present the MYC0409 UltraCP™ converter module designed for high-density AI and data center applications, delivering up to 96.5% efficiency. The showcased technologies aim to simplify power design, improve thermal performance, and accelerate next-generation industrial and mobility applications.VIAVI Solutions has introduced the CyberFlood CF1000 Appliance, a next-generation 400G security and application performance testing platform designed for multi-terabit AI and data center infrastructures. The solution enables realistic Layer 4–7 validation under encrypted and AI-driven traffic conditions, supporting up to 1.2Tbps of application 01Murata Unveils Advanced Power Solutions at 02 PCIM 2026VIAVI Launches CyberFlood CF1000 for AI 03 Infrastructure Validationtraffic in a compact 2RU form factor. It delivers over 500Gbps encrypted throughput and up to 800,000 TLS 1.3 connections per second while supporting quantum-safe cryptography validation and AI inference traffic emulation. The platform helps network operators, hyperscalers, and service providers accelerate deployment, improve security validation, and optimize AI infrastructure performance.
TECHNOLOGY UPDATESwww.semiconductorforu.com | 07Infineon Technologies is contributing its semiconductor manufacturing expertise to three European quantum pilot line projects — SUPREME, CHAMP-ION, and SPINS — aimed at accelerating industrial-scale quantum chip production. The initiatives focus on superconducting, ion-trap, and semiconductor spin-based quantum technologies to bridge the gap between laboratory research and commercial manufacturing. Supported under the European Chips Act, the projects will provide startups, SMEs, and research organizations access to advanced fabrication infrastructure. Infineon’s involvement is expected to strengthen Europe’s quantum ecosystem, improve scalability of quantum processors, and support the development of commercially viable quantum computing technologies.Infineon Advances Europe’s Quantum Chip ManufacturingTDK has introduced SensorStage™, a new software evaluation platform designed to simplify and accelerate development for its SmartMotion® inertial measurement units (IMUs). The platform combines advanced visualization, automated workflows, and customizable scripting to help engineers quickly evaluate MEMS IMUs and TMR magnetometers. SensorStage supports features such as machine learning algorithms, sensor fusion, motion detection, and power optimization, enabling faster calibration and reduced development time. Designed for applications including smart glasses, wearables, IoT, and optical image stabilization, the future-ready platform supports both current and upcoming TDK sensor technologies for next-generation intelligent devices.Keystone Electronics has launched a new locking vertical-entry 20mm coin cell battery holder designed for high shock and vibration environments. Compatible with popular CR2032 batteries, the slim-line holder features a locking flange and polarity protection tab to ensure secure battery retention and prevent incorrect insertion. The through-hole mounted design offers low contact resistance, simplified PCB assembly, and compatibility with lead-free reflow processing. Built with a UL 94V-0 flame-retardant housing and tin-plated brass contacts, the compact solution is ideal for high-density PCB applications, backup power systems, portable electronics, and industrial devices requiring reliable battery connectivity and durability.04TDK Launches SensorStage Platform for Faster 05 IMU DevelopmentKeystone Introduces Locking Vertical Entry Coin 06 Cell Holder
08 | www.semiconductorforu.comTECHNOLOGY UPDATESDiodes Incorporated has introduced the PI3EQX32904Q, a 32Gbps four-channel automotive-compliant linear ReDriver designed for next-generation smart cockpit and AI-driven vehicle platforms. Supporting PCIe 5.0, SAS4, and CXL protocols, the device enhances highspeed signal integrity for ADAS, infotainment, and instrument cluster systems. Built on 0.13µm SiGe BiCMOS technology, it delivers ultra-low jitter and programmable equalization through I2C control. The ReDriver also supports low-power standby operation below 5mW, helping improve energy efficiency. The solution enables longer PCB trace routing, reduced interference, and optimized performance for evolving automotive computing architectures.Diodes Launches 32Gbps ReDriver for Smart Cockpit PlatformsSamtec has introduced new through-hole PCB termination options for its ultra-micro mPOWER® connectors, enhancing mechanical strength and reliability in rugged applications. Designed for space-constrained systems, the connectors support high-current power delivery with compact 5.2mm stack heights and up to 18A per pin. The expanded portfolio targets demanding sectors such as industrial automation, data centers, automotive, and embedded computing. Featuring rugged Tiger Eye™ contacts and flexible board-to-board configurations, the solution improves durability while simplifying assembly and thermal management. Samtec’s latest addition helps engineers achieve higher power density and dependable connectivity in next-generation electronic designs.Cadence and Google Cloud have partnered to accelerate AI-driven semiconductor design by integrating Google’s Gemini models with the Cadence ChipStack™ AI Super Agent platform. The collaboration aims to deliver scalable, cloud-native, agentic design automation for next-generation chip development and verification. Cadence claims the platform can improve productivity by up to 10X across digital design, debugging, verification planning, and regression management. Pow07Samtec Expands mPOWER Connectors with 08 Through-Hole Design09 Cadence and Google Scale AI-Driven Chip Designered by Google Cloud’s infrastructure, the solution combines advanced AI reasoning with Cadence EDA tools to shorten development cycles, improve design accuracy, and accelerate time-to-tapeout for increasingly complex semiconductor systems.
TECHNOLOGY UPDATESwww.semiconductorforu.com | 09STMicroelectronics has introduced the ST64UWB family, a next-generation ultra-wideband (UWB) chip platform designed for automotive, smart home, and industrial applications. Supporting both IEEE 802.15.4z and the upcoming IEEE 802.15.4ab standards, the chips enable longer-range, high-precision localization, secure digital access, motion sensing, and child presence detection. Built on ST’s 18nm FD-SOI technology, the devices deliver enhanced RF performance, improved reliability, and up to 50% extended range. The portfolio includes automotive-focused and consumer-oriented SoCs with AI acceleration and STMicroelectronics Unveils Next-Generation UWB 10 Chip Familyradar capabilities, helping accelerate adoption of advanced connected and intelligent mobility applications.Samsung Electronics has showcased the advantages of its 4nm FinFET process technology, emphasizing a balance between high performance and manufacturing reliability. The company said the mature node delivers improved yield, lower defect rates, and design flexibility for applications ranging from AI and HPC to wearables and automotive. Samsung also highlighted a redesigned wiring architecture that reduces signal delay by nearly 26%, enabling faster and more power-efficient devices while serving as a bridge toward next-generation GAA technology.Samsung Highlights Maturity of 4nm FinFET 11 ProcessQualcomm has introduced the Snapdragon 6 Gen 5 and Snapdragon 4 Gen 5 mobile platforms, bringing faster gaming, AI-powered imaging, smoother UI performance, and enhanced connectivity to mid-range and entry-level smartphones. Both chipsets are built on a 4nm process and support improved graphics, battery efficiency, and advanced 5G features. Devices powered by the new platforms are expected in the second half of 2026 from brands including Honor, OPPO, realme, and REDMI.Qualcomm Expands Mid-Range Mobile 12 Portfolio
START-UP SPARK10 | www.semiconductorforu.com Next-Gen Sourcing: The Rise of 1Buy.AI in a $600B IndustryWith data at its core, 1Buy.AI is turning procurement from a reactive function into a strategic advantage. In the fast-evolving world of electronics manufacturing, where supply chains stretch across continents and volatility is the only constant, a quiet disruption is underway. At the center of this shift is 1Buy.AI—a young, ambitious startup that is reimagining how the world sources, prices, and manages electronic components. Founded in 2023, the company represents a new generation of AI-first ventures determined to solve deep-rooted inefficiencies in global procurement.The origins of 1Buy.AI lie in a persistent industry problem: procurement in electronics remains fragmented, opaque, and heavily dependent on manual processes. Despite being a multi-billion-dollar ecosystem, sourcing components often involves spreadsheets, delayed quotations, and inconsistent pricing. Recognizing this gap, seasoned entrepreneurs Nitin Jain, Visham Sikand, and Pradeep Paliwal came together to build aThe Spark Behind the Startupplatform that could bring intelligence, transparency, and speed into procurement. The founding team was no stranger to scaling businesses. With prior ventures and successful exits, they brought both credibility and a sharp understanding of enterprise pain points. Their vision was clear: create an AI-powered operating system that could act as the “brain” of electronics procurement.At its core, 1Buy.AI aims to become the global intelligence layer for electronics supply chains. The company is not just another marketplace—it is building a data-driven ecosystem that enables predictive decision-making. By leveraging vast datasets and machine learning, it empowers procurement teams to shift from reactive buying to proactive, insight-led strategies. Vision: Building the Intelligence Layer of Supply ChainsThe platform integrates over hundreds of millions of data points, offering real-time pricing signals, supplier intelligence, and risk analysis. This allows companies to optimize their bill of materials (BOM), reduce costs, and navigate supply volatility more effectively. In an industry where margins are tight and disruptions frequent, such capabilities can directly impact profitability.
www.semiconductorforu.com | 11START-UP SPARK1Buy.AI’s innovation is anchored in its three flagship platforms—each designed to tackle a specific procurement challenge: • 1Data: An AI-driven intelligence engine that provides pricing benchmarks and alternative sourcing options. • 1Source: A dynamic procurement platform that enables efficient and transparent sourcing of components globally. The Product Suite: Three Pillars of Transformation• 1Xcess: A marketplace that helps companies monetize excess and obsolete inventory, unlocking working capital. Together, these solutions replace fragmented workflows with a unified, intelligent system. Early deployments have reportedly delivered cost savings of 5–10% within months—an impressive metric in large-scale manufacturing environments.The timing of 1Buy.AI’s emergence is significant. The global electronics supply chain—valued at over $600 billion—is undergoing rapid transformation, driven by geopolitical shifts, semiconductor shortages, and the rise of new manufacturing hubs like India. Yet, procurement processes have lagged behind, often relying on outdated methods. By digitizing and automatingMarket Opportunity and Relevancethese processes, 1Buy.AI is addressing a critical bottleneck in the industry. Its solutions are particularly relevant for OEMs (Original Equipment Manufacturers) and EMS (Electronics Manufacturing Services) companies seeking efficiency and resilience in their supply chains.The startup’s early traction has attracted strong investor interest. In January 2026, 1Buy.AI raised approximately $3.9 million (₹32.5 crore) in seed funding, led by 100Unicorns, with participation from FJ Labs, Gruhas, and notable investors including Ashish Kacholia. Funding and Growth MomentumThis funding is being deployed to enhance the platform’s AI capabilities, expand its global data infrastructure, and scale its SaaS offerings. The company also plans to strengthen its presence in international markets, including the United States, Europe, and Southeast Asia. Though still in its early stages, 1Buy.AI has already begun making an impact. The platform is working with enterprise clients, managing large-scale sourcing operations and helping organizations unlock efficiencies in procurement. Its ability to convert excess inventory into liquidity through 1Xcess adds an additionalTraction and Impactlayer of value, especially in an industry prone to overstocking and obsolescence. By enabling transparency and real-time decision-making, the startup is not only improving operational efficiency but also contributing to a more sustainable supply chain ecosystem.Looking forward, 1Buy.AI’s ambitions extend beyond cost optimization. The company envisions a future where procurement becomes autonomous, powered by AI systems that continuously learn, adapt, and optimize decisions in real time. Its roadmap includes expanding its data intelligence capabilities, deepeningThe Road Aheadintegrations with global suppliers, and building a truly interconnected procurement network. As the electronics industry continues to scale and diversify, the demand for such intelligent systems is expected to grow exponentially.In just a short span, 1Buy.AI has positioned itself as a promising disruptor in the procurement-tech space. By combining deep industry expertise with advanced AI capabilities, it is tackling one of the most complex challenges in global manufacturing.The Next ChapterIf the startup succeeds in executing its vision, it could redefine how electronics supply chains operate—making them smarter, faster, and far more efficient. In a world increasingly powered by electronics, the significance of such innovation cannot be overstated.
12 | www.semiconductorforu.com TECH SPOTLIGHT Gallium Nitride on Silicon (GaNon-Si) technology is redefining modern power electronics with faster switching speeds, higher efficiency, compact designs and lower energy losses. From electric vehicles and data centers to renewable energy and consumer electronics, the technology is emerging as a cost-effective alternative to traditional silicon. As industries push for energy-efficient and high-performance systems, GaN-on-Si is becoming a critical enabler of the next generation semiconductor ecosystem.GAN-ON-SI REVOLUTION: POWERING THE NEXT ERA OF INTELLIGENT ELECTRONICSHow Gallium Nitride on Silicon is Transforming Power, Performance and the Future of Semiconductor InnovationThe global semiconductor industry is entering a transformative phase where energy efficiency, miniaturization and high-speed performance are becoming central to innovation. In this rapidly evolving landscape, Gallium Nitride on Silicon, popularly known as GaN-on-Si, is emerging as one of the most promising breakthroughs in power semiconductor technology. By combining the superior electrical characteristics of Gallium Nitride (GaN) with the cost advantages and manufacturing scalability of silicon substrates, the technology is paving the way for a new generation of high-performance electronic systems.For decades, silicon has been the backbone of the semiconductor industry. Its reliability, abundance and mature manufacturing ecosystem made it the preferred material for chips powering computers, mobile devices and industrial systems. However, with increasing demand for faster charging, higher power density, reduced energy consumption and compact designs, conventional silicon-based devices are approaching their physical limitations. This is where GaN-on-Si technology is gaining momentum. GaN is a wide-bandgap semiconductor material known for its exceptional electron mobility, high breakdown voltage and thermal stability. These characteristics allow devices made from GaN to switch faster and operate at higher frequencies with significantly lower power losses compared to conventional silicon devices. Traditionally, GaN devices were fabricated on expensive substrates such as silicon carbide (SiC) or sapphire. While effecTHE RISE OF A NEW SEMICONDUCTOR ERA
www.semiconductorforu.com | 13TECH SPOTLIGHT'' GAN-ON-SI IS NOT JUST AN INCREMENTAL IMPROVEMENT IN POWER ELECTRONICS; IT REPRESENTS A FUNDAMENTAL SHIFT TOWARD SMARTER, SMALLER AND MORE ENERGY-EFFICIENT SYSTEMS. ''tive, these substrates increased manufacturing costs and limited large-scale commercial adoption. The introduction of GaNon-Si technology changed the equation. By growing GaN layers on standard silicon wafers, manufacturers gained the ability toleverage existing silicon fabrication infrastructure while reducing production costs. This integration has made GaN technology more commercially viable for mass-market applications.WHY GAN-ON-SI MATTERSOne of the biggest advantages of GaN-on-Si technology is its ability to dramatically improve power efficiency. In modern electronic systems, a considerable amount of energy is lost in the form of heat during power conversion and switching processes. GaN devices reduce these switching losses significantly due to their high electron mobility and lower resistance. This leads to higher energy efficiency, reduced cooling requirements and smaller device footprints.TRANSFORMING CONSUMER ELECTRONICSThe consumer electronics industry is among the first sectors to witness the large-scale impact of GaN-on-Si technology. Compact fast chargers for smartphones, laptops and wearable devices have become increasingly popular in recent years. Unlike traditional silicon chargers that require larger heat sinks and bulky designs, GaN chargers deliver higher power output in significantly smaller form factors. This has transformed user expectations around charging speed, portability and device efficiency.DRIVING THE ELECTRIC VEHICLE REVOLUTIONThe automotive sector is another major beneficiary of GaN-on-Si innovation. Electric vehicles (EVs) require highly efficient power conversion systems to maximize battery performance and driving range. GaN-based power devices are increasingly being integrated into onboard chargers, DC-DC converters and traction inverters. Their ability to operate at higher switching frequencies enables lighter and more compact powertrain systems while improving overall vehicle efficiency.POWERING RENEWABLE ENERGY SYSTEMSIn addition to EVs, renewable energy systems are also accelerating the adoption of GaN-on-Si devices. Solar inverters, energy storage systems and smart grids rely heavily on efficient power management. GaN technology improves conversion efficiency and reduces energy wastage, making renewable energy systems more reliable and cost-effective. As countries across the world intensify their focus on sustainability and carbon neutrality, the demand for advanced power semiconductors is expected to grow rapidly.ENABLING GREENER DATA CENTERSData centers, which form the backbone of the digital economy, are also turning toward GaN-on-Si technology to manage increasing power consumption. With the rise of artificial intelligence, cloud computing and high-performance computing, modern data centers require enormous amounts of electricity. Efficient power delivery systems are becoming essential to reduce operational costs and environmental impact. GaN devices help achieve higher efficiency and lower thermal losses, contributing to greener and more sustainable data infrastructure.THE SILICON ADVANTAGEAnother significant factor driving the popularity of GaN-on-Si technology is its compatibility with existing silicon manufacturing processes. Semiconductor manufacturers have invested billions of dollars in silicon fabrication facilities over several decades. Completely replacing these facilities with new infrastructure would be economically challenging. GaN-on-Si allows manufacturers to adapt current production lines with relatively lower investment, accelerating commercialization and reducing barriers to entry.
14 | www.semiconductorforu.com TECH SPOTLIGHT CHALLENGES ON THE ROAD AHEADHowever, the technology is not without challenges. Growing high-quality GaN layers on silicon substrates is technically complex due to differences in lattice structure and thermal expansion coefficients between the two materials. These mismatches can create defects and mechanical stress during fabrication, potentially affecting device reliability and performance.Researchers and semiconductor companies are continuously working to overcome these technical barriers through advanced epitaxial growth techniques, improved wafer engineer ing andinnovative device architectures. Significant progress has already been made in enhancing material quality, reliability and manufacturing yield. Another challenge lies in market competition between GaN and Silicon Carbide technologies. While both are wide-bandgap semiconductors, they are optimized for different applications. Silicon Carbide is currently preferred for extremely high-voltage and high-temperature applications such as industrial drives and grid infrastructure. GaN-on-Si, on the other hand, is gaining dominance in medium-voltage applications where switching speed, compactness and cost efficiency are critical.AI, 5G AND THE NEXT WAVE OF INNOVATIONThe rise of artificial intelligence and edge computing is expected to further strengthen the relevance of GaN-on-Si technology. AI-driven systems demand faster processing, higher computational density and efficient power management. From AI servers to robotics and industrial automation, advanced power semiconductors will play a crucial role in supporting next-generation digital infrastructure. Telecommunications is another emerging application area. With the global rollout of 5G networks and the future transition toward 6G, telecom infrastructure requires highly efficient radio frequency and power amplification systems. GaN devices are increasingly being used in RF amplifiers because of their superior high-frequency performance and thermal stability. The aerospace and defense sectors are also exploring GaN-on-Si solutions for radar systems, satellite communication and advanced electronic warfare applications. The material’s high power density and reliability under harsh operating conditions make it suitable for mission-critical systems.GLOBAL RACE FOR GAN LEADERSHIPGlobally, leading semiconductor companies and research institutions are heavily investing in GaN-on-Si development. Governments are also recognizing the strategic importance of advanced semiconductor materials in achieving technological self-reliance and energy efficiency goals. Several countries are expanding investments in semiconductor research, manufacturing incentives and supply chain localization.Asia-Pacific currently dominates the semiconductor manufacturing ecosystem, and the region is expected to remain a major hub for GaN-on-Si production and innovation. Meanwhile, Europe and North America are strengthening efforts to develop domestic semiconductor capabilities amid growing geopolitical competition and supply chain concerns.OPPORTUNITIES FOR INDUSTRY AND STARTUPSFor startups and emerging technology companies, GaN-on-Si presents enormous opportunities. The demand for compact, energy-efficient and high-performance devices is opening doors for innovation across multiple sectors including industrial automation, mobility, healthcare electronics and smart consumer devices.The commercial success of GaN technology will ultimately depend on continued advancements in manufacturing scalability, reliability and cost reduction. As wafer sizes increase and fabrication processes mature, economies of scale are expected to make GaN-on-Si devices even more affordable and accessible.SUSTAINABILITY AT THE COREThe transition toward sustainable technologies is another factor accelerating adoption. Governments and industries worldwide are under increasing pressure to reduce carbon emissions and improve energy efficiency. Power semiconductors capable of minimizing energy losses can contribute significantly to these sustainability objectives.In many ways, GaN-on-Si technology represents the convergence of performance, efficiency and scalability. It addresses some of the most pressing challenges faced by modern electronics while enabling entirely new possibilities in system design and power management.'' THE FUTURE OF POWER ELECTRONICS WILL BE DEFINED BY WIDE-BANDGAP SEMICONDUCTORS, AND GAN-ON-SI IS POSITIONED AT THE CENTER OF THIS TECHNOLOGICAL TRANSFORMATION. ''
www.semiconductorforu.com | 17TECH SPOTLIGHT
INDUSTRY DIALOGS 16 | www.semiconductorforu.com THE FUTURE OF AUTOMOTIVE CONTROL: STMICROELECTRONICS UNVEILS THE AI-ENHANCED STELLAR P3EDuring a virtual media briefing for Asian journalists, attended by Vaishali Umredkar, Editor of Semiconductor For You, Luca Rodeschini, Group Vice President and General Purpose Automotive Microcontrollers Division General Manager, presented Stellar P3E, a new automotive platform combining real-time control, embedded AI acceleration, dense memory, and advanced safety architecture'This briefing highlighted that STMicroelectronics is positioning the Stellar P3E as the centerpiece of its strategy for the Software-Defined Vehicle (SDV) era. By integrating a dedicated Neural Processing Unit (NPU) into a real-time microcontroller, ST is moving AI from the central \"brain\" of the car directly into the actuators and power control systems.Q: Vehicle electronics are becoming increasingly complex. Where do you see the biggest engineering challenge today for automakers?Luca Rodeschini: The biggest challenge today is managing growing system complexity while keeping innovation fast and cost effective. Vehicle architectures are evolving rapidly because electrification, connectivity, software growth, safety requirements, and cyber security are all advancing at the same time. At the same time, manufacturers are dealing with supply chain uncertainty and strong competitive pressure from new market entrants. The industry therefore needs platforms that are powerful, flexible, and secure enough to support long-term development without increasing system fragmentation.Q: What makes AI a practical advantage in real automotive control rather than just an added feature?Luca Rodeschini: AI becomes valuable when it enables functions that traditional algorithms struggle to handle efficiently.It can detect patterns in complex data, improve prediction accuracy, and support adaptive behavior in real time. This opens possibilities such as smarter sensing, predictive maintenance, better energy conversion, and more efficient actuation. The objective is not simply to add AI, but to make vehicle control systems more responsive, reliable, and capable of handling operating conditions that conventional control methods may not fully optimize.Q: What key automotive trend is Stellar P3E designed to address?Luca Rodeschini: The strongest shift we see today is the movement toward integrated vehicle architectures where multiple functions are consolidated into a single electronic control unit. What used to be separated across several controllers now needs to operate together—battery management, inverter control, charging systems, thermal functions, and power distribution. That level of integration requires a different class of microcontroller. Stellar P3E was designed to combine deterministic control with embedded AI so that control systems become not only faster, but also capable of prediction, classification, and adaptive decision-making. It delivers 8,000 CoreMark through four independent cores, while two cores can operate in splitlock mode to meet safety requirements.Q: Why is embedded AI becoming important at the microcontroller level in automotive systems? Luca Rodeschini: AI becomes most useful when it is placed where real-time decisions are made. Traditional central computing platforms are powerful, but they consume much more energy and are not always ideal for localized control tasks. By moving AI to the edge, we can keep intelligence active without constantly relying on central processors. This matters for functions such as predictive maintenance, onboard charger classification, anti-pinch systems, or hidden motor temperature estimation. Our Neural ART Accelerator performs neural-network operations locally, minimizing data movement and dramatically reducing power consumption while improving response time. In some workloads, inference can be up to 69 times faster than running the same model on the CPU.Q: How does Stellar P3E enable X-in-1 powertrain integration in electric vehicles?Luca Rodeschini: X-in-1 architecture is becoming one of the most important design directions in electric mobility.Previously, each powertrain function required its own controller, its own cooling, housing, and wiring. That adds cost and weight. With Stellar P3E, OEMs can aggregate those functions into one control platform because we provide very high analog capability, more than 100 ADC channels, and up to 308 GPIOs.This allows one microcontroller to manage traction systems, onboard charging, DC-DC conversion, and other critical elements simultaneously. The result is lower weight, reduced cable complexity, fewer expensive connectors, and simplified software deployment.
INDUSTRY DIALOGSwww.semiconductorforu.com | 17LUCA RODESCHINIGROUP VICE PRESIDENT AND GENERAL PURPOSE AUTOMOTIVE MICROCONTROLLERS DIVISION GENERAL MANAGER, PRESENTED STELLAR P3EQ: How does STMicroelectronics differentiate Stellar P3E in addressing long-term software scalability and AI memory demands?Luca Rodeschini: Software growth is becoming one of the biggest constraints in automotive development.That is why we invested heavily in PCM—phase change memory—which gives us very high density embedded non-volatile memory. Stellar P3E offers up to 19.5 megabytes of embedded memory, which allows customers to maintain OTA capability, integrate multiple software functions, and expand features over time.This becomes even more important when AI models are added because memory must store those models efficiently without creating latency. PCM gives us a strong advantage because we can offer larger software capacity without significantly increasing silicon area. Q: How do you assess the relevance of the Indian market for Stellar P3E and its future adoption potential?Luca Rodeschini: India is extremely relevant because performance and cost are both critical there. Stellar P3E is positioned very well because it supports aggregation while remaining efficient in cost structure. At the same time, Indian engineering capability in software is very strong. There is a high level of software sophistication, and AI acceleration gives local teams more possibilities to create differentiated vehicle functions. We are working with local partners and automotive players, and our engineering presence in India is an important strategic advantage. Q: With connected vehicles becoming more software-driven, how does Stellar P3E address cybersecurity?Luca Rodeschini: Cybersecurity must now be built directly into hardware. Stellar P3E complies with ISO/SAE 21434 and integrates a secure hardware module that creates a root of trust inside the device. OTA firmware is authenticated through digital signatures before installation, and secure encryption runs independently of the main processor. We also use internal firewalls so software domains remain isolated. This is essential when multiple vehicle functions operate on one platform.Q: What makes 28nm the right technology choice for Stellar P3E?Luca Rodeschini: Because automotive requires balance.Smaller nodes improve pure digital density, but they do not automatically improve analog precision or cost efficiency. At 28nm we achieve strong analog capability, dense memory integration, and supply resilience. Another important point is manufacturing control. We produce this node internally, which helps us reduce supply chain dependency. That is especially important for automotive customers seeking long-term production stability.THE FUTURE AUTOMOTIVE CONTROLLER MUST COMBINE DETERMINISTIC CONTROL AND PROBABILISTIC INTELLIGENCE IN ONE DEVICE .\"
18 | www.semiconductorforu.com HUMANOIDS – WHAT DOES THE FUTURE LOOK LIKE?KATHY HUTTONSenior Supplier Business Development Manager at DigiKeyI’ve been thinking a lot about AI technology lately, specifically humanoids, and what the future might look like as they become more capable and widespread. While some people remain skeptical, and I fully understand their concerns, I can’t help but feel excited about what’s coming. The pace of innovation is accelerating rapidly, driven by advances in AI, robotics, and computing power, and the possibilities are expanding far beyond simple tasks. Traditionally, the term humanoid has been tied to machines that perform repetitive or physically demanding tasks. Today, that’s still a major focus—but looking ahead, humanoids are positioned to become much more. They’re evolving into adaptable partners designed to operate safely in human environments, from factories and warehouses to homes and hospitals. or enhancing the accuracy of cancer targeting procedures and technologies.Long Term Facilities, Hospitals and HealthcareHealthcare is one of the industries expected to benefit the most. The workload on nurses, aides, and caregivers continues to rise, especially in Memory Care facilities where staffing shortages are a daily struggle. Humanoids could help support these workers by delivering meals and medicine, assisting with mobility tasks, and providing monitoring or reminders for residents with cognitive decline. Some forecasts even show humanoids beginning to fill measurable gaps in elderly care by 2035, offering companionship and safety oversight for aging populations. (Image source: Moxi – Diligent Robotics)And imagine what happens when robotics intersects with precision medicine. Surgery has already progressed from invasive procedures to minimally invasive laparoscopy. With humanoid precision and AI guided accuracy, tomorrow’s medical interventions could become even more targeted, potentially improving recovery times Military, Police, FireHumanoids could also play vital roles in high risk environments. Envision robots deployed to manage traffic at an accident scene, enter burning buildings, war zones, or assist in dangerous search and rescue operations. Their ability to operate where human safety is threatened makes them ideal for emergency response and disaster zones. Projections already show humanoids being used in hazardous or high friction work environments to reduce human risk. This firefighting robot can extinguish fires for up to 10 h. (Image source: Ambipar)FarmingIn agriculture, the groundwork is already available for equipment that can drive itself, and it is booming! So why have someone sitting in a tractor all day? With autonomy and humanoid oversight, farmers might soon control a whole fleet from their phone. As labor shortages rise globally, humanoids are poised to fill roles in logistics and repetitive agricultural tasks.BLOG BEAT
www.semiconductorforu.com | 19Are we coming into the age of robot farmers? (Image by Techslang)Entertainment, Sports and EducationHumanoids are expected to become interactive learning companions in schools, offering personalized tutoring and support for children with diverse needs. They may also enter entertainment, performers, stunt operators, or even collaborative partners in sports training. In cities, humanoids could help with crowd navigation or real‑time translation assistance. See educational robots for more information.The evolution of automated translation points towards machines. (Image source: Tarjama)HomeImagine a world where prep, cooking, cleaning, and everyday household tasks are handled by a humanoid assistant. Companies developing home friendly robots are already on this Need help with household tasks? Humanoid robots can help. (Image source: Camille Cohen for The Washington Post via Getty)path. Honestly, this is where I’m most excited, and I love my robotic vacuum cleaner. Imagine getting a call at work and your in-laws are coming over at 5pm – no problem. Pick up your phone and get your robot to prepare dinner, clean the house, and shovel the snow off the driveway. All while you are at work. ExplorationsWhether it’s deep oceans, remote caves, or even other planets, humanoids may lead exploration missions where humans can’t easily go. With advanced sensors and adaptability, they could soon become essential tools for scientific discovery in extreme environments. I find this very intriguing because there are so many untapped unknowns in our oceans. Do you know 70% of the Earth is water and only 27% of our oceans have been mapped, but less than 5% has been explored or imaged. Robots will be the future of oceanic exploration. (Image source: ASME)The rise of humanoids isn’t just about futuristic machines. It’s about expanding human potential. As they take on repetitive, dangerous, and labor‑intensive tasks across industries, they create space for people to focus on deeper work, meaningful connection, and innovation. The future of humanoids isn’t something to fear; it’s an opportunity to reimagine how we live, work, and care for one another and that future is closer than we think. Whatever you are designing, we have you covered at DigiKey from prototyping to production.(Image created using Co-Pilot)BLOG BEAT
20 | www.semiconductorforu.com INDUSTRY DIALOGS “WE ARE BUILDING A TRUE DESIGN-TOMANUFACTURING BRIDGE FOR THE SEMICONDUCTOR ECOSYSTEM IN INDIA”1. Zettaone Technologies began as a PCB engineering services firm and has evolved into a full-fledged product engineering and manufacturing company. What were the key inflection points in this journey? Zettaone’s evolution has been very deliberate. We started with PCB design services, building deep expertise in high-speed, high-density designs for global customers. The first inflection point came when customers began relying on us not just for design, but for complete product realization—including component engineering, prototyping, and validation.The second major shift was our expansion into semiconductor interface solutions—such as ATE boards, probe cards, and load boards—where precision, signal integrity, and reliability are critical. This positioned us closer to the semiconductor ecosystem. The third inflection point was investing in full-scale manufacturing, including SMT lines and system integration capabilities. Today, we operate as a true end-toend partner—from concept, architecture, design, prototyping, validation, to volume production and system build.2. As a co-founder, what was your original vision for Zettaone, and how has that vision evolved with the changing electronics and semiconductor landscape?Our initial vision was to build a strong, globally competitive PCB design organization from India. Over time, we realized customers were looking for partners who could take complete ownership of product development and manufacturing, not just design.Today, our vision has evolved into building a comprehensive electronics and semiconductor ecosystem company, where we support customers across:• Semiconductor test interfaces (ATE, probe, load boards)• Product engineering (embedded systems, hardware, firmware)• Manufacturing and system integrationWith the global push for supply chain diversification and India’s semiconductor ambitions, we are aligning ourselves as a design-to-manufacturing anchor within this ecosystem. 3. Zettaone today offers end-to-end services—from design to manufacturing. In this interview, Suresh Kumar Muthusamy, Co-Founder & Director of Zettaone Technologies, shares how the company evolved into a design-to-manufacturing powerhouse. In conversation with Vaishali Umredkar, Editor of Semiconductor For You, he highlights key inflection points, India’s semiconductor opportunity, and Zettaone’s role in enabling end-to-end product realization.How important is this integrated approach in today’s competitive electronics ecosystem?This integrated approach is absolutely critical. Products today are complex, with tight coupling between silicon, hardware, and software. By offering concept-to-production services, we ensure:Suresh Kumar Muthusamy Co-Founder & Director of Zettaone Technologies • Better design-for-manufacturability (DFM) and design-for-test (DFT)• Faster prototyping and validation cycles• Seamless transition from engineering builds to mass productionFor semiconductor-related solutions like ATE boards and load boards, this integration is especially important because
www.semiconductorforu.com | 21INDUSTRY DIALOGSdesign accuracy directly impacts yield and test efficiency. Our ability to design, validate, and manufacture under one roof significantly reduces risk and time-tomarket.4. The company has expanded from design services to setting up advanced manufacturing facilities, including a production unit in Tamil Nadu. What strategic thinking drove this expansion?The move into manufacturing was both strategic and customer-driven. Customers wanted a trusted India-based partner who could not only design but also deliver production-ready hardware.Tamil Nadu offered a strong ecosystem—policy support, talent, and infrastructure—which made it an ideal location. This expansion allows us to:• Manufacture high-complexity boards like ATE, probe interfaces, and high-layer count PCBs• Support box build, system integration, and complete product assembly• Deliver localized, scalable productionIt also aligns with global supply chain shifts and India’s push toward electronics manufacturing leadership. 5. Zettaone has seen strong growth in recent years. What have been the primary drivers behind this momentum?Our growth has been driven by:1. Expanding scope of engagement – moving from design services to full product ownership2. Strong positioning in semiconductor interface boards – ATE, probe cards, and load boards3. Integrated ecosystem – combining engineering, manufacturing, and system build4. Market tailwinds – supply chain diversification and India’s growing relevance Additionally, our ability to support customers from evaluation boards and SOMbased platforms to complete production systems has significantly increased our value proposition. systems has significantly increased our value proposition.6. The addition of new SMT lines and manufacturing capabilities marks an important milestone. How does this strengthen your position in the EMS and semiconductor value chain?The new SMT lines enhance our capability to manufacture high-reliability, high-precision electronics, which is essential for semiconductor applications. Specifically, this strengthens our position by enabling:• Production of ATE boards, load boards, and probe card interfaces with tight tolerances• Assembly of complex multilayer, high-speed designs• End-to-end delivery—from bare board to fully integrated systemsWe are not just an EMS player—we are positioned as a critical bridge between semiconductor design, testing, and end-product realization.7. India is pushing hard to build a self-reliant semiconductor ecosystem. What are the biggest gaps and opportunities today?India’s strengths lie in design talent and system engineering, but gaps remain in:• Advanced fabrication• Materials and equipment ecosystem• High-end testing infrastructureHowever, there are strong opportunities in:• Semiconductor test solutions (ATE, load boards, probe cards)• OSAT and system-level testing• Electronics manufacturing and embedded systemsCompanies like Zettaone can play a key role in building the downstream ecosystem that converts silicon into usable products. 8. How can Indian design and manufacturing companies like Zettaone complement large-scale fab investments?Fabs alone don’t create value unless there is a strong ecosystem to support testing, validation, and productization.Zettaone contributes by:• Designing and manufacturing test interface hardware (ATE/load boards/probe cards)• Enabling evaluation platforms and reference designs• Supporting system integration and end-product developmentThis ensures that chips manufactured in India can be quickly validated, deployed, and scaled into real-world applications. 9. What role do EMS and PCB design companies play in strengthening India’s semiconductor supply chain?They are foundational. PCB design and EMS companies:• Translate chip functionality into usable systems• Enable test, validation, and qualification infrastructure• Drive local value addition and manufacturing scaleWith advanced capabilities in high-speed design, signal integrity, and precision manufacturing, they become essential enablers of the semiconductor ecosystem.10. Your company emphasizes “design-to-manufacturing” within India. How does this align with Make in India?Our model directly supports Make in India by ensuring that value creation happens domestically across the lifecycle:• Concept and architecture• Design and engineering• Manufacturing and system buildBy building capabilities in semiconductor interface boards, embedded systems, and complete product development, we are increasing local value addition and reducing dependency on imports.11. Looking ahead, what are Zettaone’s strategic priorities over the next 3–5 years?Our priorities are centered around strengthening our role in the electronics and semiconductor ecosystem:• Advancing embedded systems and SOM-based product platforms• Delivering complete systems for end markets—from industrial to automotive and beyond• Scaling advanced manufacturing with higher capacity and precision• Expanding semiconductor interface solutions (ATE boards, probe cards, load boards)• Building capabilities in semiconductor testing and validationOur goal is to establish Zettaone as a leading concept-to-production partner, enabling customers to move from idea to scalable product entirely within India.
22 | www.semiconductorforu.com BLOG BEAT THE RISE OF PREDICTIVE MOBILE INTELLIGENCEWHEN SMARTPHONESSTART THINKING AHEADThe smartphone is entering a new technological phase in which intelligence is no longer limited to isolated features such as camera enhancement, voice recognition or keyboard prediction. Artificial intelligence is now becoming the central operating layer of mobile devices, transforming the way users interact with technology throughout the day. Instead of functioning only as a responsive tool, the next generation of smartphones is being designed to anticipate actions, understand context and make decisions before a command is fully given.For years, mobile innovation focused heavily on hardware improvements such as display quality, battery life, camera resolution and processor speed. While these remain important, the current shift places greater emphasis on how effectively a device can interpret human behaviour and deliver relevant actions in real time. The future smartphone is expected to think in terms of patterns, not just commands.Artificial intelligence is reshaping smartphones into proactive digital companions that can predict intent, process information locally and respond instantly. The next phase of mobile innovation focuses on devices that understand context, combine multiple inputs and perform tasks before users explicitly request them, creating a faster, more secure and deeply personalized smartphone experience. redesign inside mobile processors. Neural processing units, once treated as secondary additions to the chipset, are now central to system design. These dedicated engines are optimized specifically for machine learning tasks, allowing complex AI operations to run efficiently without draining battery life. Modern mobile performance is no longer judged only by raw speed but also by how many AI operations a device can execute per second while maintaining thermal efficiency.The practical effect of this hardware evolution is that smartphones are beginning to understand more complex human intent. Instead of interpreting one input at a time, future devices are being trained to combine voice, text, image and behavioural context simultaneously. A user may point the camera at a product, ask a spoken question and receive an immediate explanation, recommendation or translation generated from multiple data sources together.A major driver behind this change is the rapid progress in on-device artificial intelligence. In earlier stages of AI adoption, many intelligent functions depended on cloud computing. A voice command, translation request or image enhancement often required sending data to remote servers for processing before returning a result. Although effective, this created delays, raised privacy concerns and required stable internet access.The latest mobile architectures increasingly process these tasks directly inside the device. This means speech recognition, language generation, photo enhancement and content summarization can happen instantly without depending on external servers. On-device processing reduces latency, improves reliability and gives users greater control over personal data. As privacy becomes a stronger concern globally, local intelligence is becoming a major competitive advantage. This transition is supported by a significant
www.semiconductorforu.com | 23BLOG BEATThis form of multi-modal intelligence represents one of the biggest advances in mobile computing. A phone no longer simply reacts to what is typed or spoken; it begins to understand what the user is trying to achieve across several actions at once. This creates smoother interaction and reduces friction in daily use.Predictive intelligence is another area where mobile AI is advancing rapidly. Smartphones already suggest words while typing, recommend frequently used contacts and predict app launches based on usage habits. However, upcoming systems go far beyond these basic functions. Devices are being designed to observe time patterns, location behaviour, repeated workflows and digital routines to anticipate what a user is likely to need next.For example, a phone may automatically prepare navigation before a regular commute, suggest document access before a scheduled meeting or surface relevant travel details before departure. In many cases, the device may complete background actions before the user actively requests them. This reduces screen interaction and creates a more seamless digital environment.The long-term goal is not simply automation but contextual intelligence. Context allows a device to understand why an action may be relevant at a particular moment. This means AI must interpret not only habits but also environment, urgency and current activity.Battery efficiency remains a critical factor in making such intelligence practical. AI workloads require significant computational resources, especially when large language models or advanced visual recognition systems operate continuously. To solve this, mobile chip designers are focusing on energy-aware AI engines that allocate power dynamically depending on task complexity. This efficiency allows advanced intelligence to run in the background without affecting normal daily battery performance. As mobile operating systems become more AI-centric, battery optimization will remain one of the defining factors of successful adoption.Camera systems are among the first areas where predictive AI has already become highly visible. Smartphones now detect scenes automatically, improve portraits, remove noise, sharpen images and even reconstruct low-light details in milliseconds. Future developments extend this further by allowing AI to understand devices.This pattern suggests AI may spread faster than previous hardware-led smartphone transitions because much of the intelligence can be enabled through software once sufficient baseline hardware exists.Developers are also preparing for a new application ecosystem built around predictive behaviour. Apps may increasingly rely on AI models embedded inside the device rather than remote systems. This allows faster personalization and better offline functionality.The smartphone of the coming years may therefore act less like a platform for launching apps and more like a continuously intelligent layer that decides which digital function matters most at any given moment.This shift changes the very meaning of mobile interaction. Users may spend less time opening menus, searching manually or repeating commands. Instead, the device will increasingly surface what matters before being asked.The next major phase of smartphone evolution may not be defined by larger displays or faster charging alone. It may be defined by whether the device understands intent before the first touch occurs.user preference and editing style.A device may soon know whether a user prefers warmer tones, sharper landscapes or natural skin tones and adjust output before the photo is captured. Video recording is also becoming increasingly intelligent through real-time stabilization, speech enhancement and object tracking.Voice interaction is also evolving beyond simple digital assistant commands. Traditional voice assistants often depended on fixed command structures. New AI systems are moving toward conversational understanding, where users can speak naturally, change context mid-sentence and receive more adaptive responses.This makes mobile devices feel less like software tools and more like digital companions capable of maintaining contextual continuity. The device may remember previous requests, link them to ongoing tasks and propose next steps.Another important development is language accessibility. AI-powered smartphones increasingly support instant translation across speech, text and live conversations. This can significantly improve communication in multilingual environments, travel situations and professional interactions.As processing becomes local, translation quality improves while reducing dependence on network quality. This also supports privacy because conversations no longer need to be fully processed externally.Security is expected to benefit strongly from mobile AI as well. Smartphones already use facial recognition and behavioral authentication, but future systems may continuously assess usage patterns to detect abnormal activity. Typing rhythm, gesture patterns and movement habits can help identify whether the current user matches established behaviour.Such passive security adds another protective layer without creating inconvenience. Fraud prevention in mobile payments and digital identity systems may increasingly rely on this kind of behavioral intelligence.The broader market impact is also important. Advanced AI features first appear in premium devices because they require stronger processors and memory capacity. However, semiconductor scaling and software optimization are gradually bringing these capabilities into mid-range \"The future smartphone will not simply respond to instructions; it will increasingly interpret context, predict needs and act before the user asks.\"
24 | www.semiconductorforu.com BLOG BEAT Rangesh RaghavanCorporate Vice President & Managing Director, Lam Research IndiaBreakthroughs Fuelling the Future of AI ChipsArtificial Intelligence (AI) is advancing at a remarkable pace. It is becoming smarter, faster, and capable of processing massive amounts of data in ways that were unimaginable a few years ago. From powering generative AI applications, enabling autonomous vehicles, to driving medical breakthroughs, every AI system depends on one essential technology: semiconductors. These chips move, store, and process the vast streams of data that AI requires.However, current manufacturing methods and materials are being pushed to their limits. To meet these demands, the semiconductor industry is undergoing a once-in-a-generation transformation. In the past, major changes in materials or processes often took a decade or more to fully implement across the industry. But AI’s explosive growth has compressed those timelines dramatically. What used to be a gradual evolution is now an accelerated revolution. Evolving for the AI Era Building advanced chips such as NAND, DRAM, and logic devices, requires extreme precision, complex engineering, and materials that perform reliably at nanoscaledimensions. For rapidly growing AI workloads, the predictable paths of scaling by packing more transistors into smaller spaces are no longer enough. Traditional processes face physical and technical limits. As chips complexity increases, electrical signals must travel through increasingly narrow and intricate connections. These connections can become bottlenecks, slowing down processing speed and increasing the risk of electrical shorts. To overcome these hurdles, companies like Lam Research are rethinking the fundamentals of semiconductor manufacturing. A New Approach to MetallizationOne of the most important changes is in the metals used to connect circuits inside chips. These connections, known as interconnects, are vital for transmitting electrical signals quickly and efficiently. For On the deposition side, atomic layer deposition continues to gain importance as manufacturers seek precise control over material thickness at the atomic scale. Newer ALD platforms have been engineered to handle emerging metals such as molybdenum while maintaining uniform coverage across increasingly complex geometries. Bringing these capabilities from research settings into large-scale production has required extensive process refinement, but it represents a key step toward integrating next-generation materials into commercial devices. Building the Foundation for the AI EraThe changes happening in semiconductor manufacturing are not just about meeting today’s needs but also about preparing for the future. These advancements will enable faster data processing, more efficient energy use, and greater overall performance in computing devices. Just as important, they will ensure that the industry can continue to scale its technologies in line with the increasing demands of AI and other emerging fields.In essence, the semiconductor industry is laying down a new technological foundation, that will support innovation for decades to come. This is a generational shift, and it is happening in real time. The move from tungsten to molybdenum, combined with breakthroughs in etch and deposition, marks a turning point in how chips are made.more than 25 years, tungsten has been the metal of choice. However, tungsten requires the addition of a barrier layer, typically titanium nitride (TiN), to improve adhesion and prevent electrical leakage. The problem is that this barrier layer has a much higher resistivity than pure tungsten, which reduces overall performance.Enter molybdenum, a metal that offers several advantages for next-generation chips. Unlike tungsten, molybdenum doesn’t require a highly resistive barrier layer. This means more space is available for the conductive metal itself, lowering electrical resistance and allowing signals to move faster. In fact, studies show that molybdenum-filled contacts can have more than 50% lower resistance compared to those using the traditional tungsten-and-barrier approach.Molybdenum can also simplify manufacturing by reducing the number of process steps, improving efficiency, and supporting the continued scaling of chip designs. While tungsten will still be used in certain applications, the shift to molybdenum represents a generational leap in semiconductor metallization; one that will help power the AI era and the future of high-performance computing. Breakthroughs in Etch and Deposition TechnologiesWhile the change in metals is significant, it is only part of the transformation. Equally important are innovations in etching and deposition, the processes used to shape and build the microscopic structures within chips.One recent development involves the use of cryogenic processing environments to achieve deeper and more uniform etch profiles in memory devices. Operating at extremely low temperatures allows plasma-based systems to maintain tighter control over sidewall shape and depth consistency, even when forming channels that extend several microns below the surface. This approach can improve both structural accuracy and throughput, making it better suited for high-volume manufacturing.
www.semiconductorforu.com | 33BLOG BEATWE POWER YOUR PRODUCTSrecom-power.comRAC20NE-K HIGHLY VERSATILE 20W AC/DC POWER SUPPLY• 85-305VAC wide input• 12,24 or 36VDC output• 4kVAC isolation OVC III• Full load power rating to 55°C• Optional CV/CC overcurrent limited• Enhanced EMI filter for grounded connections
26 | www.semiconductorforu.com BLOG BEAT SYLVAIN FIDELISMULTI-MARKET BUSINESS LINEDIRECTOR, CONNECTED SECURITY, STMICROELECTRONICSEEPROM AT 40 YEARS:A POPULAR, PROVEN TECHNOLOGYEEPROM is a mature NVM technology with important properties for today’s cutting-edge applications. Sylvain Fidelis, Multi-market Business Line Director, Connected Security at STMicroelectronics, the world’s largest supplier of EEPROM ICs and a leading innovator of products and processes, explains the core strengths of the technology and why it’s the memory of choice for engineers now and into the future. With almost 40 years since its first product development, EEPROM remains the designer’s preferred non-volatile memory (NVM) in many new designs. Chosen in applications that demand byte-level granularity, high power efficiency, extended read/write cycle life, and long data retention, EEPROM is easy to use and brings great flexibility and scalability. Moreover, recent innovations such as Unique ID (UID) EEPROM and Page EEPROM enhance support for current design trends such as AI edge processing, brand protection, and sustainability. In general, EEPROM manufacturers continue to advance the technology and refine the production processes, continually increasing storage density, read/write performance, and power efficiency, as well as quality and reliability.Key Strengths and ApplicationsToday’s designers can choose from a rich selection of NVM types that offer diverse strengths. These include the high speed of discrete serial NOR Flash, bill-of-materials savings thanks to embedded Flash in microcontrollers, and the very fast writing of FRAM (ferroelectric RAM). On the other hand, EEPROM’s bytewrite granularity is a key characteristic that stands out in comparison with these alternatives, ensuring superior performance for tasks such as data logging. In smartphones, where designers face extreme space constraints and EEPROM emulation in embedded Flash appears the best for storing data and parameters, this granularity secures EEPROM’s place on the board. In addition, low power consumption meets the needs of battery-operated applications like smart sensors, smartwatches, smartphones, health and fitness trackers, and other wearables.Additionally, by offering extended read/write cycle life and long data retention, EEPROM delivers the extreme reliability needed to fulfill datalogging needs in automotive applications. Typical uses include storing important parameters for the application to use and recording digitalized information from multiple sensing channels in automated driving systems. With data retention of 100 years or more, EEPROM can easily guarantee perfor
www.semiconductorforu.com | 27BLOG BEATmance throughout the lifetime of the vehicle. Designers also appreciate the flexibility that EEPROM allows during system development. Memory requirements can be difficult to predict when the project starts and are usually expected to increase significantly as the design progresses. Serial EEPROMs of various densities can share a common package type and pinout, which lets storage scale easily by choosing a device of higher capacity without changing the board layout. Manufacturers offer ICs of various densities, from low-cost 1Kbitdevices to 4-Mbit, and more in popular 8-pin surface-mount SO-8 and various other packages. Finalizing a design for production is barely more complicated than sending instructions to the purchasing department.Two important recent developments show how EEPROM is adapting with the priorities of the modern world, particularly the demands of edge AI applications, protection for brands and consumers against product counterfeiting, and sustainability concerns that highlight the virtues of repairable electronics.Page EEPROM: breaking the glass ceiling of data storageOver the past 40 years, the amount of data stored in our customer applications has relentlessly and consistently increased, the users of electronic devices having a growing appetite for more data and for more accurate product settings. In the 2000s using an EEPROM above 256-Kbit looked unthinkable, as did using a 2-Mbit in the early 2020ss. The value proposition of Serial EEPROMs is that developers need only allocate a small 8-pin package to data storage in their application and then have the flexibility to select any memory density.By introducing Page EEPROMs, ST has broken the glass ceiling by being able to fit up to 32-Mbit of reliable data storage in a small 8-pin package.Page EEPROM is an innovation by STMicroelectronics. It primarily targets applications that need the storage capacity and speed of Flash – particularly its ability to handle over-the-air (OTA) firmware updates quickly and efficiently – with EEPROM’s power efficiency and durability. Suited for smart meters, which demand extremely low power, byte-level data logging, and small size, it’s also just right for data-hungry edge-AI devices. Typical applications here include industrial sensors for applications such as asset tracking and intelligent condition monitoring, e-bikes, and healthcare devices. Some of the first applications for this novel hybrid memory were in behind-the-ear hearing aids and GPS trackers. When introduced in 2024, Page EEPROM was available with storage densities of 8 Mbits, 16 Mbits, and 32 Mbits. The devices support byte-level write operations, which makes them perfect for data logging, while page/sector/block erase and page programming facilitate Over The Air (OTA) firmware management. In addition, buffer loading optimizes initial programming.The data-read speed, at 320 Mbit/s, is faster than standard EEPROM and comparable with serial NOR Flash. On the other hand, write-cycle endurance of 500,000 cycles is several times higher than conventional serial Flash and data retention is 100 years. Also, the overall demand on the battery can be 10 times lower. While write current is at the same level as many conventional EEPROMs, there is also a deep power-down mode with fast wakeup that reduces the current to below 1 µA. A further, novel feature of these devices is the peak-current control that restricts the maximum consumption to below 3 mA. This effectively stabilizes the power consumption and minimizes power supply noise, while in principle allowing smaller batteries and longer runtimes.UID EEPROM Unique ID EEPROMs contain a 128-bit read-only unique identity (UID) that’s pre-programmed when the device is manufactured and then permanently locked. Since the ID cannot be changed, OEMs can use this feature like an entry-level secure element to provide basic product identification and clone detection. The UID also permits traceability which, in turn, allows accurate product-reliability analysis and can simplify re-use and repair of equipment to support sustainability goals. The UID is provided in addition to conventional EEPROM user-memory space, with up to 2-Mbit available for parameter storage and data logging. Reliability is assured, with write endurance of four million cycles and data retention of 200 years, and power consumption is extremely low. The devices also support I2C communication up to 1MHz fast-mode plus and allow random and sequential read modes while providing a write-protect mode for the entire memory array.The Position TodayThe overall global market is valued at about $800 million annually. STMicroelectronics began producing EEPROM ICs in 1987 and is currently the world’s largest supplier; a position held since 2005. In total, the Company has shipped about 44 billion devices to date and has a portfolio that contains over 400 different part numbers including UID and Page EEPROM ICs. The
28 | www.semiconductorforu.comBLOG BEATmany different variants offer the widest portfolio of storage density and package options, performance parameters, and temperature grades on the market, as well as support for standard operating voltages from 1.2V to 5V, supporting high-volume trends. All devices benefit from ST’s product longevity program, which ensures availability of commercial- and industrial-grade EEPROMs for 10 years, and 15 years for automotive-grade devices. The Company’s IDM (integrated device manufacturer) model gives control over all stages of the product lifecycle, including design, production, and marketing. Close in-house cooperation helps deliver reliable products more quickly and drives product and process development based on real customer feedback. As EEPROM technology has evolved, the typical bit-cell area is now more than 500 times smaller than the first-generation architecture, while memory density has increased by 1,000 times on the same die size. Endurance is also greatly increased, with the toughest devices achieving 4 million cycles and ensuring zero-failure data retention.The Memory of the FutureEEPROM continues to offer a strong value proposition, alongside Flash technologies and FRAM, in applications that need robust and reliable, high-performance NVM. While recent innovations bring important new capabilities, ongoing technological development further extends EEPROM’s underlying attributes. In today’s AI-centric, sustainability-conscious world, the latest EEPROMs are ready to meet the needs of engineers targeting new designs into the future. More info at www.st.com/eeprom
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30 | www.semiconductorforu.com BUSINESS BUSINESS UNBOXED UNBOXED How Micro Fuel Cells Are Revolutionizing Portable Electronics and IoT DevicesMicro fuel cells are emerging as a transformative power solution for portable electronics and IoT devices, addressing limitations of traditional batteries. Offering higher energy density, longer life, and cleaner output, they enable reliable, low-maintenance operation in applications like wearables, medical devices, and remote sensors. Despite cost and fuel challenges, ongoing innovations are accelerating adoption and shaping the future of sustainable portable power.The rapid evolution of portable electronics and Internet of Things (IoT) devices has created an urgent demand for compact, long-lasting, and efficient energy solutions. Traditional batteries, while widely used, often struggle to keep pace with the growing performance expectations of modern devices. This is where micro fuel cells are emerging as a transformative technology. By offering higher energy density, longer operational life, and cleaner energy output, micro fuel cells are steadily reshaping how portable devices are powered. As innovation accelerates, the Micro Fuel Cell Market is gaining significant traction, driven by the need for reliable and sustainable power sources in increasingly miniaturized systems.The Growing Energy Challenge in Portable ElectronicsPortable electronics such as smartphones, wearables, medical devices, and remote sensors have become integral to daily life. These devices are expected to be lightweight, highly efficient, and capable of operating for extended periods without frequent charging. However, conventional lithium-ion batteries face limitations in terms of energy density and degradation over time. As devices become more sophisticated, incorporating advanced sensors, connectivity modules, and processing capabilities, their energy consumption rises significantly.Micro fuel cells address this challenge by generating electricity through electrochemical reactions, typically using hydrogen or methanol as fuel. Unlike batteries that store energy, fuel cells continuously produce power as long as fuel is supplied. This fundamental difference allows micro fuel cells to deliver consistent performance over longer durations, making them highly suitable for next-generation portable electronics.
www.semiconductorforu.com | 31BUSINESS UNBOXEDWhat Makes Micro Fuel Cells a Game-Changing TechnologyMicro fuel cells stand out due to their compact size, high efficiency, and environmental benefits. Their ability to provide a stable power output without significant performance degradation gives them a clear advantage over traditional batteries. Additionally, they can be refueled quickly, eliminating the downtime associated with recharging. Another key advantage lies in their energy density. Micro fuel cells can store more energy in a smallerfootprint, enabling devices to operate longer without increasing size or weight. This is particularly valuable for IoT applications, where devices are often deployed in remote or hard-to-access locations. The growing adoption of such advantages is a major factor contributing to the expansion of the Micro Fuel Cell Market across various industries.Transforming IoT Devices with Reliable Power SolutionsThe IoT ecosystem relies heavily on a vast network of connected devices, including sensors, trackers, and smart systems. Many of these devices are deployed in environments where frequent maintenance or battery replacement is impractical. Micro fuel cells provide a reliable alternative by offering long-lasting power with minimal intervention. For instance, in industrial IoT applications, sensors used for monitoring equipment performance orenvironmental conditions require uninterrupted power. Micro fuel cells can sustain these devices for extended periods, ensuring continuous data transmission and reducing maintenance costs. Similarly, in smart agriculture, IoT devices powered by micro fuel cells can operate autonomously in fields, enabling real-time monitoring of soil conditions, weather patterns, and crop health.Enhancing Wearable and Medical TechnologiesWearable devices and medical equipment represent another critical area where micro fuel cells are making a significant impact. Devices such as fitness trackers, smartwatches, and health monitoring systems demand lightweight and long-lasting power sources. Micro fuel cells meet these requirements by delivering consistent energy without adding bulk. In medical applications, reliability is paramount. Devices such as portable oxygen concentrators, glucose monitors, and implantable sensors require dependable power to function effectively. Micro fuel cells provide a stable and efficient energy source, reducing the risk of device failure. Their quiet operation and low heat generation further enhance their suitability for sensitive medical environments.Sustainability and Environmental Benefits Driving AdoptionAs sustainability becomes a global priority, the environmental advantages of micro fuel cells are gaining attention. Unlike conventional batteries, which can contribute to electronic waste and environmental pollution, micro fuel cells produce minimal emissions. When hydrogen is used as fuel, the only byproduct is water, making the technology highly eco-friendly. This aligns with the broader shift toward green energy solutions acrossindustries. According to insights often highlighted by Persistence Market Research, the increasing focus on reducing carbon footprints is expected to play a crucial role in accelerating the adoption of micro fuel cells. Their ability to provide clean and efficient energy makes them a compelling choice for environmentally conscious applications.Innovations Accelerating Market GrowthContinuous advancements in materials science and engineering are enhancing the performance and affordability of micro fuel cells. Researchers are developing more efficient catalysts, improving membrane technologies, and exploring alternative fuels to optimize performance. These innovations are making micro fuel cells more accessible for commercial applications.Additionally, integration with advanced electronics and smart systems is opening new possibilities. Hybrid solutions that combine micro fuel cells with batteries are being explored to deliver both immediate and sustained power. Such developments are expected to further strengthen the position of the Micro Fuel Cell Market in the coming years.Overcoming Challenges and BarriersDespite their numerous advantages, micro fuel cells face certain challenges that need to be addressed for widespread adoption. The cost of production remains relatively high compared to traditional batteries, primarily due to the use of specialized materials and manufacturing processes. However, ongoing research and economies of scale are expected to reduce costs over time.Another challenge is the development of efficient fuel storage and delivery systems. Ensuring safe and convenient handling of fuels such as hydrogen or methanol is critical for consumer acceptance. Advances in fuel cartridge design and safety mechanisms are helping to overcome these barriers, paving the way for broader adoption.
32 | www.semiconductorforu.com BUSINESS BUSINESS UNBOXED UNBOXED Future Outlook for Micro Fuel Cells in Portable TechnologyThe future of micro fuel cells looks promising, with expanding applications across multiple sectors. As the demand for portable and connected devices continues to grow, the need for advanced energy solutions will become even more critical. Micro fuel cells are well-positioned to meet this demand, offering a combination of efficiency, reliability, and sustainability.Industry analysis, including perspectives from Persistence Market Research, suggests that technological advancements and increasing investment in clean energy will drive significant growth in this space. From consumer electronics to industrial IoT and healthcare, micro fuel cells are set to play a pivotal role in shaping the future of portable power.Redefining Portable Power for a Connected WorldMicro fuel cells are not just an incremental improvement over traditional batteries; they represent a fundamental shift in how energy is generated and utilized in portable devices. By addressing key challenges related to energy density, longevity, and environmental impact, they are enabling a new generation of innovative technologies.As the Micro Fuel Cell Market continues to evolve, its influence on portable electronics and IoT devices will only grow stronger. With ongoing advancements and increasing adoption, micro fuel cells are poised to redefine the standards of portable power, supporting a more connected, efficient, and sustainable world.
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34 | www.semiconductorforu.com As the world moves toward sustainable and maintenance-free electronics, energy harvesting is emerging as a key enabler of next-generation IoT systems. Instead of relying on disposable batteries, devices can now draw energy from their HOW MUCH POWER IS ENOUGH TO BUILD BATTERY-FREE ELECTRONICS?ENERGY HARVESTING: ENERGY HARVESTING:Energy harvesting is rapidly transforming the design of low-power electronics by enabling devices to operate without traditional batteries. From microwatts to watts, ambient energy sources such as light, heat, and vibration can power a wide range of applications. This article explores realistic power levels, key technologies, and how energy harvesting is shaping the future of sustainable, maintenance-free IoT systems.surroundings—light, heat, motion, or even radio waves—to operate autonomously. However, one critical question remains: how much power can energy harvesting realistically provide, and what can it actually run?Energy harvesting is often misunderstood as a niche or low-output technology. In reality, it spans a wide spectrum of power levels depending on the source and environment. At the lower end, systems can generate just a few microwatts—sufficient for ultra-low-power sensors or intermittent data transmission. At the higher end, certain configurations can deliver several watts, enabling more complex applications. Understanding the Real Power RangeThe variability depends on multiple factors, including the type of energy source, environmental conditions, and system design. For example, indoor light harvesting typically produces only hundreds of microwatts, while outdoor solar setups can reach tens of milliwatts or more. This broad range highlights a key takeaway: energy harvesting is not about replacing high-power systems but about enabling efficient, low-power electronics to operate independently.Despite its relatively modest output, energy harvesting can What Can Energy Harvesting Power?support a surprisingly diverse set of applications.BLOG BEAT
www.semiconductorforu.com | 35Common use cases include wireless sensors for temperature, humidity, and occupancy monitoring, as well as asset tracking devices and smart building systems. It also supports wearables, remote monitoring tools, and environmental sensing platforms. In industrial environments, energy harvesting powers predictive maintenance systems and smart factory need for battery replacement in hard-to-reach locations. In agriculture, it enables distributed monitoring systems that can operate for years without intervention. These applications share a common trait: they are designed for low power consumption, often operating intermittently or in duty cycles rather than continuously.The effectiveness of energy harvesting depends heavily on the available energy source. Each type offers unique advantages and limitations. Light (Photovoltaic): Light is the most widely used energy source, especially in IoT applications. Indoor lighting can support low-power devices, while outdoor sunlight significantly boosts output.Thermal Energy: Thermoelectric generators convert temperature differences into electricity. These are particularly useful in industrial settings where heat gradients are common, producing power in the microwatt to milliwatt range.Key Energy Sources and Their CapabilitiesVibration and Motion: Mechanical energy from vibrations or movement can be converted into electrical energy using piezoelectric materials. This is ideal for machinery monitoring or transportation systems.Radio Frequency (RF): RF harvesting captures energy from ambient signals such as Wi-Fi or cellular transmissions. However, the available power is typically very low and highly dependent on proximity to the source. Each of these sources must be carefully matched to the application to ensure consistent and reliable operation.At the heart of any energy harvesting system lies a power management integrated circuit (PMIC), often referred to as an Ambient Energy Manager (AEM). These components are responsible for extracting maximum energy from the source, storing it efficiently, and delivering it to the load. Advanced PMICs can even start operating with extremely low input The Role of Power Managementpower—sometimes as little as a few microwatts—making them critical for real-world deployments. They also manage fluctuations in energy availability, ensuring that devices can operate reliably even when the harvested energy is intermittent.One of the biggest shifts in adopting energy harvesting is the need to rethink system design. Instead of focusing solely on performance, engineers must prioritize energy efficiency. This involves optimizing hardware and software to minimize power consumption, using sleep modes, and designing systems Designing for Energy Efficiencythat operate in bursts rather than continuously. For instance, a wireless sensor might wake up periodically, collect data, transmit it, and then return to a low-power state. This approach allows the device to function within the limited energy budget provided by harvesting.While energy harvesting offers significant advantages, it is not without challenges. The most obvious limitation is variability. Unlike batteries, which provide a consistent energy supply, harvested energy depends on environmental conditions. A solar-powered device may struggle in low-light environments, while vibration-based systems require consistent motion. Challenges and LimitationsAnother challenge is storage. Energy must often be stored in capacitors or rechargeable batteries to ensure continuous operation, especially during periods when the energy source is unavailable. Finally, system complexity can increase, as designers must balance energy input, storage, and consumption in real time.BLOG BEAT
36 | www.semiconductorforu.com INDUSTRY DIALOGS “YOU CANNOT PROMPT YOUR WAY TO A WORKING ANALOG CIRCUIT—IT’S BUILT ON PHYSICS, PATIENCE, AND INSTINCT.”Q. Can you walk us through your journey from academia to becoming a Senior Analog Design Engineer, and what drew you to analog and mixed-signal design?Although I was always curious about circuit design through my engineering studies, I did not fully commit to analog until my internship at Intel during my Master's at UC Irvine. What made that internship particularly valuable was the breadth of exposure it offered — I worked across CAD scripting, package design, EM/IR analysis and custom block simulations. Seeing every layer of chip development — design, verification, layout, digital, packaging — gave me a complete picture of what goes into building a semiconductor product.Through that experience I realised I felt most connected to design. It was the creativity that drew me in. Every domain in semiconductor engineering is essential and demanding in its own right — but for me personally, design is where I felt most alive. You start with a specification and build a circuit that has never existed before.What has kept me in analog specifically is that it demands patience and rewards mastery. You design a circuit, wait for silicon to come back from the foundry, and find out if your instincts were right. That process — and the depth of physics it requires — means there is always more to learn. I still feel I am mastering the art. Q. Can you walk us through your journey from academia to becoming a Senior Analog Design Engineer, and what drew you to analog and mixed-signal design? Intel was where I became a designPreethi Ashwath\"Preethi Ashwath is a Senior Analog Design Engineer at Analog Devices, Inc. in Greater Boston, Massachusetts. She holds an M.S. in Electrical Engineering from the University of California, Irvine.\"er. It offered a continued education in the truest sense — I did my first independent circuit design there, characterized an LDO I had built from scratch, and experienced for the first time the satisfaction of seeing real silicon behave exactly as I had predicted in simulation. That moment — when the measurements match — is somethingno textbook can teach you. It gave me confidence in my own instincts as a designer. ADI expanded the scope of what I was responsible for. Where Intel gave me depth on individual circuits, ADI gave me the opportunity to handle complete and complex designs — including full ESD pad-ring architectures managing protection across an entire chip with multiple voltage domains. The complexity at that system level requires thinking about interactions between circuits that simulation often cannot fully capture.ADI also gave me visibility beyond the design bench — representing the company as a technical presenter at CES, NAMM and ADI GTC, and contributing to trade publications. That combination of deep technical work and external engagement has shaped how I think about impact. I am still mastering one skill at a time and feel there is much more ahead. Q. Your work focuses on enabling AI at the edge — how does analog and mixed-signal design contribute to low-power edge AI systems? Analog and mixed-signal design is the foundation that AI systems are built on. Every semiconductor chip powering an AI application depends on analog circuits — voltage regulators delivering clean power to processors, ESD protection enIn this Women in Engineering feature, Vaishali from Semiconductor For You speaks with Preethi Ashwath, Senior Analog Design Engineer at Analog Devices, about her journey into analog design and its critical role in enabling edge AI. From silicon validation to system-level thinking, she shares insights on mastering complexity, navigating trade-offs, and building impact in a deeply demanding yet rewarding field.
www.semiconductorforu.com | 37INDUSTRY DIALOGSsuring chips survive real-world use, analog front-ends conditioning signals before digital processing. Without these blocks working correctly, no AI inference happens at all. What makes analog irreplaceable is that it cannot be shortcut. Unlike digital design which has benefited from automation, analog remains rooted in physics intuition. Every transistor must be sized deAnalog and mixed-signal design is the foundation that AI systems are built on. Every semiconductor chip powering an AI application depends on analog circuits — voltage regulators delivering clean power to processors, ESD protection ensuring chips survive real-world use, analog frontends conditioning signals before digital processing. Without these blocks working correctly, no AI inference happens at all.What makes analog irreplaceable is that it cannot be shortcut. Unlike digital design which has benefited from automation, analog remains rooted in physics intuition. Every transistor must be sized deliberately. You cannot prompt your way to a working analog circuit — it requires deep expertise built over years. As AI expands into edge devices and industrial systems, the demand for power-efficient analog blocks will only grow. That is the work analog engineers do every day. Q. What are the key design trade-offs when building high-performance yet power-efficient mixed-signal ICs for consumer applications? Every analog block involves competing constraints that cannot all be optimized simultaneously — and navigating those trade-offs is the core skill of an analog designer. Take ESD protection as an example. You are simultaneously managing area, leakage current, HBM and CDM protection levels, and the speed of the protection response. A larger device protects better but consumes more area and introduces more leakage — which directly impacts power efficiency in a consumer application where every microamp matters.In LDO design the trade-offs are equally interconnected. Power consumption, stability and PSRR are not independent variables. As you increase gain to improve PSRR, stability becomes harder to maintain — gain and PSRR are tightly coupled, and pushing one puts pressure on the other. Resolving that tension requires careful compensation network design and often iterating between simulation and silicon to find the right balance.Q. Having showcased systems at global platforms like CES and NAMM, what key trends are you observing in audio and edge AI applications? Representing Analog Devices at CES 2025 and NAMM 2025 gave me a firsthand view of where consumer electronics and professional audio are heading. At CES the dominant trend was intelligence moving closer to the user — devices that sense, process and interpret signals locally rather than relying on cloud connectivity. Hearables are evolving from audio playback devices into health monitoring platforms, with analog front-ends playing a critical role in extracting meaningful physiological signals from noisy real-world environments. At NAMM the focus was on connectivity and audio quality — ADI's A2B automotive audio bus technology demonstrated how a single thin wire can carry multichannel high-fidelity audio across complex systems, reducing wiring complexity while improving signal integrity. The common thread is that as devices become smarter, the demands on analog design become more stringent. The intelligence of the system is only as good as the quality of the analog signal it starts with. Q. As a reviewer for IEEE ISCAS, what emerging innovations in analog design excite you the most today? Every analog block involves competing constraints that cannot all be optimized Honestly, reviewing papers for IEEE ISCAS, MWSCAS and IEEE CONECCT is as much a learning experience for me as it is a contribution. Reading cutting-edge submissions keeps me connected to where the field is heading beyond my own day-today work. The areas I find myself most engaged with are new SERDES architectures, LDO innovations targeting ultra-low quiescent current, and circuits designed specifically for AI hardware applications. These are domains I work in directly, so seeing how researchers are pushing boundaries gives me fresh perspectives I bring back to my own designs. It is one of the most valuable aspects of the reviewing role — the learning is mutual. Q. You've received recognitions such as the ADI Analog Impact Award — what kind of contributions do you believe create the most impact in this field?The ADI Analog Impact Award recognized cross-functional business impact — and that framing reflects how I think about meaningful contribution. It is not just about a technically elegant circuit. It is about owning a problem end to end and seeing it through to completion in a way that creates real value.The contributions that matter most share that quality — ownership and follow-through. A circuit that comes back from the foundry and works. A solution adopted beyond the original program. A design that prevents a respin or enables something that was not possible before. Academic recognition shaped this mindset early — graduating with three Gold Medals and 2nd University Rank at VTU taught me that genuine mastery of fundamentals is what distinguishes good work from great work. That foundation has stayed with me. Q. What advice would you give to aspiring engineers, especially women, looking to build a career in semiconductor design? I will be honest — the corporate world is not yet fully friendly for women in engineering. In analog IC design women represent roughly 11% of the field. You will often be the only woman in a room full of engineers. There is limited representation at senior and board levels. That reality needs to be acknowledged, not glossed over. But that is also exactly why it matters that women embrace difficult STEM fields like analog design. Every woman who stays, builds expertise and rises makes the field more accessible for the next generation. Representation at the top changes what young women believe is possible for themselves.On a personal level — routine and self-kindness are your greatest assets. This is a demanding field and the pressures are real. Build habits that sustain you. And most importantly — do not measure your growth against someone else's yardstick. Everyone's journey is different. Only you know the full picture of your life and what you are navigating. Define success on your own terms and keep going.
38 | www.semiconductorforu.com BLOG BEAT THE BIG PUSH TO BRING PHYSICAL BUTTONS BACKMy electric kettle has capacitive touch buttons for power and temperature selection. It’s simple and gets the job done. But every time I’m in a home appliances store, I can’t keep my hands off the electric kettles that have a dial for temperature selection. It has just the right amount of resistance as it gently clicks around. The knob kettle costs several times more than my capacitive touch kettle and heats water exactly the same. Still, for many tea and coffee drinkers, the premium experience of having a knob is worth paying a premium. Our love of a great physical interface is the same reason why mechanical keyboards are so popular and why I get questioned by department store employees for touching every button on every coffee machine on display.There’s no denying the utility of touch-based controls. But recent trends show that the sleek touch-based world we’ve found ourselves in is on the cusp of a button renaissance. What was a novelty not long ago, touch controls have become so ubiquitous that buttons are now a luxury, just like the kettle with a knob. In a race to optimize controls for cost and manufacturability, some designers have forgotten the “human” aspect of human-machine interfaces (HMIs). Now, manufacturers are answering consumers’ calls to reinstate the buttons.Where Have All the Buttons Gone?There’s no denying the benefits of touch-based user interfaces for small multifunction devices like mobile phones. As someone who was originally a physical button enthusiast and thought mobile phones with QWERTY keyboards were the pinnacle of phone design, even I learned to appreciate the extra screen space over a physical keyboard. Also, I didn’t have much of a choice. Aside from the now-discontinued Blackberry phones, most smartphone manufacturers chased sleek, keyboard-free styling.Phones proved to be among the more exciting touch-based technologies, which seemingly led to buttons quietly disappearing on all kinds of appliances and devices. In lots of cases, it made sense. As devices took on more advanced functionality, nesting functions within touch menus made them easier to navigate. Office printers would have looked like airplane cockpits if they had dedicated buttons for every setting (Figure 1). White goods manufacturers also saw the benefits of swapping mechanical buttons for capacitive touch: lower cost, fewer points of ingress for dirt and moisture, and simpler manufacturing.
www.semiconductorforu.com | 39BLOG BEATonds. A car moving at 100km/h travels 55 meters in those two seconds. In American units, that’s the distance from the 50-yard line to the back of the end zone. Could you run that on a crowded field with your eyes closed? Automakers around the world have re-examined their touchscreen-based interfaces in response to consumers not wanting to gamble with their safety to change their music or air conditioning while driving. Hyundai cites unfavorable focus group feedback with touch-based controls, while Volkswagen faces a class-action lawsuit against its steering wheel touch controls.Beyond the automotive space, buttons have begun reappearing on consumer devices. Apple, an early trendsetter in button removal, replaced the mute switch with an Action Button on the iPhone 15, then introduced an additional Camera Control button with the iPhone 16. Household appliances are also switching back to buttons and dials, meaning you won’t have to worry about not being able to turn off your touch-based cooktop in the event of a boil-over.Figure 1: While touch screens may be easier to navigate, they’re much less satisfying than angrily jabbing a button with your finger. (Source: jummie/stock.adobe.com)Touch Controls Push Consumers’ ButtonsButton erasure seemed unstoppable until consumers hit the brakes on touchscreens in cars. Intuitively, it makes sense that if phones are considered too distracting to use while driving, a dashboard-mounted tablet might also compete with the road for our attention. A growing body of research supports this intuition.A paper from the Virginia Tech Transportation Institute found a striking difference in the number of times someone glanced at their center console for more than two seconds in a car with legacy physical controls and one with a full touchscreen. About 3 percent of the visual-manual interactions in the legacy car lasted over 2 seconds. In this context, a visual-manual interaction means looking at the center console and performing an input, like adjusting the air conditioning. In touchscreen-based consoles, the percentage of glances over two seconds for visual-manual interactions rises to 34 percent. This means that for a third of every instance in which a driver interacts with their console, they take their eyes off the road for at least two secTouch Controls Push Consumers’ Buttonsversation. We feel reassured that our inputs are welcome and acknowledged. Anthropomorphizing a button may sound dramatic, but human-machine interfaces should feel inviting to a human touch. Users want devices that feel designed for human interaction.Buttons, knobs, and dials are more than just an engineering decision to optimize for price and performance. As the medium between the physical world and the digital world, buttons are the lingua franca between us and machines. A button with satisfying haptic feedback is like an active listener in a conAbout the AuthorMatt Campbell is a technical storyteller at Mouser Electronics. While earning his degree in electrical engineering, Matt realized he was better with words than with calculus, so he has spent his career exploring the stories behind cutting-edge technology. Outside the office he enjoys concerts, getting off the grid, collecting old things, and photographing sunsets.
40 | www.semiconductorforu.comINDUSTRY BULLETINRenesas Strengthens Edge AI with Irida Labs AcquisitionRenesas Electronics has completed the acquisition of Greece-based Irida Labs, a specialist in embedded Vision AI software for intelligent perception systems. The acquisition strengthens Renesas’ edge AI and embedded processing portfolio for industrial, robotics, smart city, automotive, agriculture, healthcare, and IoT applications. Irida Labs’ PerCV.ai software and development tools will be integrated into the Renesas 365 cloud-based development platform to simplify AI deployment and accelerate system-level vision solutions. By combining Renesas’ RA MCUs and RZ MPUs with Irida Labs’ lightweight Vision AI technologies, the company aims to enable faster, power-efficient, and scalable edge AI development worldwide.INDUSTRYBULLETINApplied Materials Expands Advanced Packaging with NEXX AcquisitionApplied Materials has signed an agreement to acquire the NEXX business from ASMPT, strengthening its advanced packaging portfolio for AI-driven semiconductor applications. NEXX specializes in large-area panel-level electrochemical deposition technology used in advanced chip packaging. The acquisition will help Applied support growing demand for larger chiplet-based AI accelerators integrating GPUs, HBM, and I/O chips in 2.5D and 3D architectures. By adding NEXX’s technologies to its existing lithography, deposition, etch, and metrology portfolio, Applied aims to accelerate next-generation panel-level packaging innovation, improve energy efficiency, and enhance high-performance AI semiconductor manufacturing capabilities.IESA Appoints Navin Bishnoi as Chairperson for FY2026-27The India Electronics and Semiconductor Association (IESA) has announced its new Executive Council for FY2026-27, appointing Navin Bishnoi as Chairperson. The newly formed leadership team includes industry experts from semiconductor, electronics, and deep-tech sectors, aiming to strengthen India’s semiconductor ecosystem and accelerate innovation, manufacturing, talent development, and policy collaboration. IESA stated that the council will focus on supporting the country’s semiconductor mission, enhancing global partnerships, and driving growth across chip design, electronics manufacturing, and emerging technologies. The leadership transition reflects IESA’s commitment to advancing India as a global semiconductor and electronics innovation hub.
www.semiconductorforu.com | 41INDUSTRY BULLETINNVIDIA Invests $2 Billion in Marvell to Expand AI EcosystemNVIDIA has invested $2 billion in Marvell Technology to strengthen its AI infrastructure ecosystem and expand adoption of its NVLink Fusion platform. The partnership enables Marvell’s custom AI chips, networking, and silicon photonics technologies to integrate with NVIDIA’s rack-scale AI infrastructure. Marvell will contribute custom XPUs and high-speed interconnect solutions, while NVIDIA will provide CPUs, DPUs, networking, and AI compute technologies. The collaboration also targets AI-RAN and next-generation telecom networks, helping customers build scalable, energy-efficient AI systems while reinforcing NVIDIA’s position in the rapidly growing AI semiconductor market.India Approves ₹3,936 Crore Semiconductor ProjectsThe Indian government has approved two new semiconductor projects worth ₹3,936 crore under the India Semiconductor Mission (ISM), strengthening the country’s domestic chip manufacturing ecosystem. The approved projects include India’s first commercial Mini/Micro-LED display facility based on Gallium Nitride (GaN) technology and a semiconductor packaging unit, both to be established in Gujarat. Crystal Matrix Limited will develop a compound semiconductor and display fabrication facility in Dholera, while Suchi Semicon will set up an OSAT facility in Surat. The projects are expected to generate over 2,200 skilled jobs and further support India’s ambition of becoming a global semiconductor manufacturing hub.Tata Electronics Expands Workforce to 75,000Tata Electronics has increased its workforce to 75,000 employees, surpassing Foxconn to become Apple’s largest contract manufacturing partner in India by headcount. The rapid expansion, up from around 15,000 employees in 2023, has been driven mainly by the company’s large-scale Hosur facility and acquired Pegatron and Wistron operations. The growth reflects rising iPhone production demand and India’s strengthening role in global electronics manufacturing. Tata Electronics is also expanding into semiconductor fabrication, OSAT, and advanced packaging, supporting India’s ambition to build a stronger domestic electronics and semiconductor ecosystemDixon Becomes India’s Largest Smartphone ManufacturerDixon Technologies has overtaken Samsung to become India’s largest smartphone manufacturer in 2025, according to Counterpoint Research. The company achieved a 19% share in India’s smartphone production market, driven by strong manufacturing orders from brands including Motorola, Xiaomi, and Realme. India’s smartphone manufacturing grew 8% in 2025, while exports surged 28%, contributing nearly one-third of total output. The rise of domestic manufacturers reflects growing outsourcing trends, government production-linked incentive (PLI) schemes, and India’s expanding role in the global electronics supply chain and smartphone export ecosystem.
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