Magazine | News | Industries EDITION #8 | JANUARY 2026EXPLORING INDIA’S SEMICONDUCTOR AMBITIONSTECH INSIGHTThe next wearable that could replace screens altogetherAi hardware startups redefining global performanceHow to make 3D prints strongerSemiconductorForu.comAI GLASSES:DIGIKEY\"LOCAL PACKAGING IS THE FOUNDATION OF A RESILIENT SEMICONDUCTOR SUPPLY CHAIN.''SILICON REINVENTEDSHETAL MEHTASUCHI SEMICONEnabling the next WBG leapcopper sintering
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ContentsTable of36Soaring ahead: Now collaborative technologies are shaping the future of flightBlog Beat061610222832Technology UpdatesTrending NowTech SpotlightSilicon Reinvented: Ai hardware startups redefining global performanceAi Glasses: The next wearable that could replace screens altogetherHow to make 3D prints stronger\"Kaynes Semicon is driving India's rise as a self-reliant chip powerhouse\". \"Raghu Panicker, Kaynes Semicon\"\"Local packaging is the foundation of a resilient semiconductor supply chain\". \"Shetal Mehta, Suchi Semicon\"Engineering & DesignIndustry DialogsIndustry DialogsHow context-aware edge AI sensors will redefine consumer electronicsCopper Sintering Enabling the next WBG leapBending light at the Nanoscale: The new physics of shrinking pixelsPanasonic Ignition 3.062 Industry Bulletin56 Event Spotlight40 Blog Beat5246 Blog BeatBlog Beat
2026 20268-9-10 April 2026 | India Expo Mart, Greater NoidaJoin India's POWERPLAY in ElectronicsYOUR PITCH FOR REAL BUSINESS5000+ brands | 50000+ buyers | 50+ countriesScan to ExhibitFor more information, contact:Pranali AgarwalT : +91 22 4255 4772 | E:[email protected] | productronica-india.comHost state
06 | www.semiconductorforu.comTECHNOLOGY UPDATESIndia’s Technological Leap with DHRUV64 1India has launched DHRUV64, its first fully indigenous 1.0 GHz, 64-bit dual-core microprocessor, developed by the Centre for Development of Advanced Computing under the Microprocessor Development Programme. The chip, built on open-source RISC-V architecture, offers improved efficiency, multitasking and reliability for 5G, automotive, industrial automation, IoT and strategic systems. It strengthens India’s domestic semiconductor ecosystem, reduces import reliance and supports innovation among startups and researchers. DHRUV64 follows earlier homegrown designs and paves the way for advanced processors like Dhanush and Dhanush+.ST’ Matter NFC Chip for Smart Homes2STMicroelectronics has introduced the ST25DA-C, the industry’s first secure NFC chip supporting the Matter 1.5 smart-home standard, designed to simplify device integration. It enables users to add lights, cameras, access control and other IoT devices to a Matter network with a single smartphone tap, eliminating complex Bluetooth or QR-code setups. The chip enhances security with cryptographic capabilities, supports battery-less NFC commissioning, and is available for sampling now, with mass production slated for 2026.OmniVision’s Single‑Chip Microdisplay for Smart Glasses 3OmniVision has launched the OP03021, the industry’s only ultra‑low‑power single‑chip LCOS microdisplay that integrates the display array, driver and memory for next‑generation smart glasses. It delivers 1632 × 1536 resolution at 90 Hz in a compact 0.26‑inch optical format, enabling higher resolution and a wider field of view for immersive AR experiences. The integrated design reduces size, power consumption and complexity, helping make smart glasses lighter and more comfortable. Samples are available now, with mass production expected in early 2026.
TECHNOLOGY UPDATESwww.semiconductorforu.com | 07Renesas Boosts SDV Innovation with R-Car Gen 5 SoC 4Renesas has launched its R-Car Gen 5 platform centered on the R-Car X5H, the industry’s first multi-domain automotive SoC built on advanced 3 nm technology, capable of running ADAS, in-vehicle infotainment and gateway systems simultaneously. The company is now offering silicon samples, evaluation boards and the RoX WhiteboxSDK, simplifying software-defined vehicle (SDV) development. The SoC delivers up to 400 TOPS AI performance, enhanced power efficiency and broad software support, with demos planned at CES 2026 to showcase real-world automotive use cases.TDK’s Vibration-Resistant Hybrid Polymer Capacitors 5TDK has expanded its B409x series of surface-mount hybrid polymer aluminum electrolytic capacitors with vibration-resistant variants that withstand up to 30 g mechanical shock/vibration, meeting MIL-STD-202. These SMD components offer low ESR, high ripple-current capability and a wide temperature range (up to +150 °C), with voltages from 25 V to 80 V and capacitances 56 µF–1100 µF. Designed for automotive and industrial electronics like power steering, DC-DC converters, robots and e-mobility systems, they deliver long life and robust performance in harsh environments.Rohde & Schwarz Drives Future of Mobility at CES 2026 6At CES 2026 in Las Vegas, Rohde & Schwarz showcased a suite of automotive test and measurement solutions aimed at accelerating electric, connected and autonomous vehicle development. Highlights include tools for electric drivetrain and battery testing, support for OpenGMSL™ high-speed data links, hyper-realistic radar simulation, UWB in-cabin and access testing, and non-terrestrial network connectivity validation. The company also demonstrated systems for eCall/GNSS compliance and partnered with industry leaders to present integrated automotive testing applications.
Melexis Enhances Smart Single-Coil Fan Driver Family7 Miniature SMT Test Point for Efficient PCB Testing 8A new miniature SMT test point from Keystone Electronics offers a symmetrical flat-wire design that enables high-strength bonding to PCBs with a minimal footprint, ideal for efficient and safe testing of high-density surface-mount circuits. It accepts a variety of gripping probes, replacing traditional wirewrap posts and turret terminals, and supports both lead-free solder and reflow processes, supplied on tape and reel and compatible with most pick-and-place systems.Littelfuse CPC1056N SolidState Relay Enhances Compact Switching9Littelfuse has introduced the CPC1056N, a compact 60 V, 75 mA solid-state relay (SSR) designed for fast, energy-efficient switching in modern electronics. The device offers 3 ms switching, ultra-low 0.5 mA trigger current for direct TTL/CMOS logic drive, and 1500 V RMS input-to-output isolation in a small 4-pin SOP package. With silent operation and robust standards compliance, it suits security, industrial, medical, smart meters and EV-charging applications where space and efficiency matter.08 | www.semiconductorforu.comTECHNOLOGY UPDATESMelexis has introduced the MLX90411-D, extending its single-coil fan driver lineup with enhanced configurability, smoother motor control and easier system integration. The 800 mA driver supports fans from 5 V to 32 V for consumer electronics, home appliancesand power systems. It features a flexible speed-curve, reduced noise operation, FG and RD outputs for monitoring, selectable PWM input options and built-in protections, all in a pin-compatible package with existing designs. The MLX90411-D is now available.
e-peas Debuts AEM15820 PMIC at CES 2026 10At CES 2026, e-peas will unveil the AEM15820, the industry’s first single-chip PMIC able to manage the full dynamic power range of hybrid indoor-outdoor photovoltaic (PV) cells — from microwatts under indoor lighting to several watts in direct sunlight, eliminating the need for multiple PMICs and reducing system complexity and cost. The device supports batteries and lithium-ion capacitors with ultra-low-power cold start, enabling self-charging consumer devices like headphones, e-readers, cameras, smart glasses and power banks. Live demonstrations will run January 6–9 at Venetian Expo Booth #50752.SYSGO Showcases Automotive Embedded Soltions at CES 202611SYSGO will present its next-generation automotive embedded software at CES 2026 in Las Vegas, highlighting its PikeOS certified hypervisor and secure platforms for mixed-criticality ECUs in ADAS, domain controllers and software-defined vehicles. The company will demo a Host-based Intrusion Detection System (H-IDS) that’s AUTOSAR IDS-compliant, QM-qualified and based on AUTO-ISAC/MITRE ATT&CK threat analysis. SYSGO’s solutions support AUTOSAR Adaptive, POSIX, Linux and Android Automotive, helping OEMs and Tier-1s build safe, secure vehicle systems.element14 Launches the DevKit HQ 12element14 has launched The DevKit HQ, a new online centralized resource that brings together evaluation boards, development kits, single-board computers (SBCs), tools and technical documents to simplify embedded design discovery and selection. The platform lets engineers search, compare and access hardware and software resources — including datasheets, demo code, application notes and training videos — by application type, accelerating design decisions and prototype development across AI, IoT, sensors, wireless, motor control and power management domains.TECHNOLOGY UPDATESwww.semiconductorforu.com | 09
10 | www.semiconductorforu.com TECH SPOTLIGHT
www.semiconductorforu.com | 11TECH SPOTLIGHTSILICON REINVENTEDAI HARDWARE STARTUPS REDEFINING GLOBAL PERFORMANCEAs AI workloads scale beyond the limits of conventional computing, a new generation of hardware startups is reshaping performance, efficiency, and deployment modelsArtificial intelligence is entering a phase where advances in algorithms alone are no longer sufficient. The rapid rise of large language models, generative AI, and real-time inference has placed unprecedented demands on compute infrastructure. Performance today is defined not only by raw throughput, but by energy efficiency, memory bandwidth, scalability, and predictability. Addressing these challenges is a growing ecosystem of AI hardware startups that are rethinking silicon architectures for the AI era.Unlike traditional processor vendors, these startups are not aiming for general-purpose dominance. Instead, they are designing hardware optimized for specific AI workloads, ranging from cloud-scale model training to low-power edge inference. In doing so, they are reshaping how performance is measured and delivered across the global AI value chain.
12 | www.semiconductorforu.com TECH SPOTLIGHT Modern AI models place extreme stress on existing computing architectures. Training requires massive parallelism and high-speed interconnects, while inference increasingly demands low latency and deterministic performance. GPUs have played a central role in enabling AI adoption, but their power consumption, cost, and scaling limitations are becoming more apparent as workloads grow.AI hardware startups are addressing these constraints through workload specialization. By focusing on AI-specific operations such as matrix multiplication, attention mechanisms, and sparse computation, they are able to achieve higher utilization and significantly better performance per watt than traditional architectures.The Case for Rethinking AI ComputeOne of the most prominent trends in AI hardware development is the rise of domain-specific accelerators. These processors are designed to execute AI workloads more efficiently by eliminating unnecessary general-purpose features.Companies such as Tenstorrent and Graphcore are developing architectures that prioritise parallel dataflow, scalable interconnects, and software flexibility for AI training and inference. Their approaches challenge conventional CPU- and GPU-centric models by aligning hardware design closely with AI workload characteristics.In contrast, Groq has focused on deterministic execution for inference. By simplifying its architecture and removing sources of variability, it delivers predictable, ultra-low-latency performance—an increasingly important requirement for real-time AI applications.Domain-Specific Accelerators Gain MomentumAs transformer models dominate AI workloads, some startups are designing chips specifically around these architectures. Etched.ai is pursuing transformer-optimised ASICs that focus on attention and dataflow efficiency rather than broad programmability.At the other end of the scale, Cerebras Systems has introduced wafer-scale AI processors, integrating an entire silicon wafer into a single compute engine. This approach significantly reduces interconnect bottlenecks and enables very high compute density, making it well-suited for training large AI models.Transformer-Centric and Wafer-Scale ArchitecturesAI hardware innovation is shifting from general-purpose computing to architectures purpose-built for specific AI workloads.
www.semiconductorforu.com | 13TECH SPOTLIGHTData movement has emerged as a major limitation in AI systems, often consuming more power than computation itself. To address this, startups such as Mythic and Axelera AI are developing memory-centric and compute-in-memory architectures.By bringing computation closer to memory, these designs reduce latency and power consumption, particularly for inference workloads. Such approaches represent a shift from compute-centric design toward architectures where memory plays a central role in determining system performance.Memory-Centric Computing Addresses the Data BottleneckTenstorrent (Canada/US) – Scalable AI processors with flexible cores for training and inferenceGroq (US) – Deterministic, low-latency AI inference acceleratorsGraphcore (UK) – Intelligence Processing Units optimised for parallel AI workloadsEtched.ai (US) – Transformer-specific ASICs for large language modelsCerebras Systems (US) – Wafer-scale processors for large-scale AI trainingMythic (US) – Analog compute-in-memory AI acceleratorsSiMa.ai (US) – Integrated hardware–software AI platformsHailo (Israel) – Low-power AI processors for edge and embedded systemsAxelera AI (Europe) – Memory-centric accelerators for vision and edge AIRebellions (South Korea) – AI chips optimised for large-scale inference workloadsAI Hardware Startups Reshaping PerformanceGlobal InnovatorsIndia-Based Deep-Tech StartupsNetrasemi – Edge AI SoCs for vision, IoT, and surveillanceMindgrove Technologies – Secure, low-power microcontroller and AI-enabled SoCsBigEndian Semiconductors – Vision processing and AI accelerator solutionsNeuroSparq – Energy-efficient edge AI silicon for healthcare applicationsMaieutic Semiconductor – AI-driven acceleration of analog IC and chip designInCore Semiconductors – RISC-V processors with embedded AI capabilitiesSaankhya Labs – AI chips for communications and broadcast infrastructureSenseSemi – AI-enabled semiconductor solutions for industrial systems
14 | www.semiconductorforu.com TECH SPOTLIGHT Performance gains increasingly depend on the tight integration of hardware and software. Startups such as SiMa.ai are emphasising full-stack platforms, combining silicon, compilers, runtimes, and tools to simplify deployment and improve efficiency. This hardware–software co-design approach is becoming a key differentiator in a crowded market.As AI moves closer to the edge, performance requirements shift toward power efficiency, thermal management, and real-time response. Startups including Hailo, Axelera AI, and several Indian companies are enabling this transition with processors optimised for inference under constrained conditions.Hardware–Software Co-Design Becomes CriticalEdge AI Redefines Performance MetricsFuture AI performance will be judged as much by efficiency and predictability as by raw compute throughput.AI hardware startups face significant challenges, including long development cycles, high capital requirements, and competition from established semiconductor players. However, their role in shaping the future of AI infrastructure is increasingly evident.As AI workloads continue to diversify and scale, the industry is moving toward heterogeneous computing environments that combine general-purpose processors with specialised accelerators. In this transition, AI hardware startups are playing a critical role in redefining performance for the next phase of AI adoption.Looking Ahead
www.semiconductorforu.com | 25TECH SPOTLIGHTATTENDEES10000+EXHIBITIONBOOTHS200+SPEAKERS60+SESSIONS12+LOUNGE11000 Sqm VIPEXHIBITIONAREABIG DAYS2PRODUCTSLAUNCHES200+9 10KTPO, BengaluruApril 2026Supported ByKEY DISCUSSION POINTSEdge Computing for Real-Time Vehicle IntelligenceDigital Twinsin Automotive: Simulation to DeploymentOTA Updates: Safety, Compliance & Business ModelsEVs & Connectivity: Integrating Charging, Data & Smart GridsSmart Cities & Connected Transport IntegrationAI-Driven Predictive Maintenance & Fleet OptimizationEmerging Technologiesin Mobility: Blockchain, AR/VR &BeyondIndia’s V2X Journey: Connectivityfor Safer & Smarter RoadsSoftware-Defined Vehicles: Code, Compliance &InnovationScaling ADAS & Autonomous Featuresfor Indian ConditionsTelematics & AIS 140: From Compliance to Smart FleetsCybersecurityin the Software-Defined Vehicle Era5G, AI & IoT: Enablers of Connected MobilityData Privacy & Ownership in Connected MobilityContact Us: [email protected] | +91 87440 88838JOIN ASDelegateSponsorSpeakerExhibitorBOOTH NOW!BOOK YOUR& ELECTRIC VEHICLE EXPOConnected, AutonomousAsia's BiggestCONFERENCE | EXHIBITION | NETWORKING | AWARD
TRENDING NOW 16 | www.semiconductorforu.com GLASTHE NEXT WEARAREPLACE SCREENA
TRENDING NOWwww.semiconductorforu.com | 17SSES:ABLE THAT COULD NS ALTOGETHERAI
TRENDING NOW 18 | www.semiconductorforu.com For decades, wearable technology has tried to strike a balance between usefulness and comfort. Smartwatches succeeded by keeping interactions brief and glanceable, while smartphones dominated by offering full-screen immersion. Now, AI glasses are positioned to bridge this gap, placing intelligence directly in the user’s line of sight without demanding constant attention.What was once considered futuristic eyewear is quickly becoming a practical platform for artificial intelligence. AI glasses combine sensors, microphones, cameras, and on-device processing to deliver contextual assistance in real time. Whether it’s instant translation, voice-driven commands, health insights, or augmented visuals, these devices aim to make digital interaction more natural and less disruptive.The renewed interest in smart glasses is not accidental. Several technology trends are converging at the right moment. Artificial intelligence models are becoming smaller and more efficient, semiconductor processes are enabling higher performance at lower power, and consumers are increasingly comfortable with voice-first and gesture-based interfaces.Unlike smartphones, which demand visual focus, AI glasses allow users to remain engaged with the real world. Information appears only when needed, delivered through audio cues, subtle visuals, or contextual prompts. This hands-free interaction is especially valuable in environments such as healthcare, manufacturing, logistics, education, and travel.From a user perspective, the appeal lies in effortless access to intelligence—no unlocking screens, no typing, no constant notifications. From an industry standpoint, AI glasses open a new frontier for embedded computing, sensors, and low-power AI acceleration.AI-powered glasses are rapidly evolving from experimental gadgets into practical, everyday wearables. Enabled by breakthroughs in low-power semiconductors, embedded AI, and compact design, these devices promise hands-free interaction, real-time intelligence, and seamless digital access. As battery efficiency and processing architectures mature, AI glasses are emerging as a strong contender to redefine personal computing and human–machine interaction.“AI glasses are not just another wearable—they represent a shift toward ambient computing, where technology quietly supports daily life.”Why AI Glasses Are Gaining Momentum
TRENDING NOWwww.semiconductorforu.com | 19Despite their promise, AI glasses face a major constraint: battery size. Unlike phones or watches, glasses must remain lightweight and well-balanced. Typical batteries range between 150 and 300 mAh, leaving little room for energy-hungry processors.At the same time, modern AI workloads—such as voice recognition, image processing, and contextual awareness—demand significant computing power. This creates a fundamental design challenge: how to deliver intelligence without sacrificing all-day usability.The answer lies in smarter system architectures rather than brute-force processing.Most AI glasses today follow one of two design approaches, each with its own advantages.1. Application Processor with Low-Power CoprocessorThis hybrid architecture separates heavy computing from always-on tasks. A high-performance application processor handles complex workloads such as camera input, display rendering, and The Biggest Challenge: Power and PerformanceTwo Architectures Shaping AI Glasses Design
20 | www.semiconductorforu.comTRENDING NOW advanced AI inference. Alongside it, a low-power coprocessor manages continuous functions like voice wake-up, noise suppression, and sensor monitoring. By allowing each processor to operate only when necessary, this approach significantly improves energy efficiency while maintaining performance.2. MCU-Centric ArchitectureSome designs eliminate the application processor entirely, relying on a highly capable microcontroller. These MCUs integrate AI accelerators, DSPs, and multiple cores, enabling them to handle voice processing, lightweight vision tasks, and sensor fusion at extremely low power.This approach enables ultra-light designs, often weighing under 30 grams, making the glasses more comfortable for prolonged wear. While performance ceilings are lower, the efficiency gains are substantial.At the heart of AI glasses is semiconductor innovation tailored specifically for wearables. Modern crossover MCUs and embedded processors are designed to operate across multiple power domains, switching seamlessly between high-performance and ultra-low-power modes.Key innovations include hardware-based voice detection, integrated neural processing units, advanced digital signal processors, and fine-grained power control. These features allow glasses to remain responsive without continuously draining the battery.Equally important is the ability to perform AI inference locally. On-device processing reduces latency, improves privacy, and eliminates dependence on cloud connectivity—critical factors for wearable adoption.The Role of Low-Power Semiconductor InnovationAI glasses are not a one-size-fits-all product. Their success depends on solving real problems across diverse applications.Use Cases Driving Adoption“The future of AI glasses depends less on raw processing power and more on intelligent power management.”Voice-First Interaction: Users can initiate tasks, ask questions, or control devices without touching a screen.Real-Time Translation: Spoken or written language can be translated instantly, making communication more inclusive.Contextual Assistance: Directions, reminders, or task guidance can appear exactly when needed.
TRENDING NOWwww.semiconductorforu.com | 21The wearable market is entering a new phase where intelligence, rather than form factor, defines value. Major technology players are investing heavily in smart eyewear, signaling confidence in long-term adoption.As component costs decline and reference designs mature, AI glasses are expected to reach broader consumer segments. Enterprise adoption may accelerate even faster, driven by productivity gains in fieldwork, healthcare, and industrial operations.Interoperability with smartphones, cloud platforms, and other wearables will further strengthen their ecosystem position.For AI glasses to succeed, technical innovation must be matched with thoughtful design. Comfort, aesthetics, and social acceptability play a crucial role. Glasses must look and feel like normal eyewear, not experimental devices.Equally important is privacy. Since AI glasses may continuously sense the environment, transparent data policies, on-device processing, and secure architectures are essential to build user trust.Manufacturers who address these concerns proactively are likely to lead the market.AI glasses mark a significant step toward ambient, always-available intelligence. By combining efficient semiconductors, thoughtful system design, and meaningful use cases, they have the potential to reduce screen dependency and reshape how people interact with technology.As power efficiency improves and ecosystems mature, AI glasses may evolve from optional accessories into essential companions for work and daily life—quietly enhancing human ability without demanding attention.The next era of computing may not sit in our hands or on our wrists—but right before our eyes.These applications demonstrate that AI glasses are less about novelty and more about practical augmentation of human capability.Market Outlook: From Niche to MainstreamPrivacy, Comfort, and TrustConclusion: A New Chapter in Wearable Computing Health and Wellness: Subtle monitoring of posture, movement, or fatigue can support preventive healthcare.Augmented Reality: Overlaying digital information onto the physical world opens new possibilities in training, repair, and education.
ENGINEERING & DESIGN 22 | www.semiconductorforu.com How to Make3D Prints Stronger3D printing opens the door to rapid prototyping, custom parts, and hobby projects! By Andrew Kazour
ENGINEERING & DESIGNwww.semiconductorforu.com | 23
ENGINEERING & DESIGN 24 | www.semiconductorforu.com 3D prints are strongest in the XY plane but weakest along the Z-axis, where layers bond together. This means that your print will be weakest parallel to the layer lines. You always want the stress of your prints to be perpendicular to the layer lines for maximum strength.Think of the layers like wood grain—design and orient to avoid splitting. This will heavily impact the strength of your prints, but requires a lot of planning and printing for your design.Your specific application will change exactly what you need from your material. If you want to make something but PLA is just slightly not strong enough, then choose PETG. If you need something a lot tougher, then you have all the other options from above.ABS is a very strong material; however, it is hard to print properly. To safely print ABS, you need to have an enclosure around your printer to keep you safe from fumes. Also, we need to make sure our hot end is at the right temperature, which is 230-235 °C for the nozzle, 80-90 °C on the bed. Some printers can't even get that hot on the bed, so it is something to watch out for. When you are storing your filament, make sure it is dry, so it prints properly. The best way to do that is with a filament dryer box, and this is especially important when working with higher temperature filaments like ABS and ASA.Nylon and Carbon fiber filament also need to be cared for in the same way as ABS. The packaging states the corSometimes it can be tough trying to figure out what options to choose while printing. Strength in 3D-printed parts depends on more than just the material you choose. The way you design, slice, and print directly affects durability. Here are the key ways to make your 3D prints stronger.2. Optimize Print OrientationNot all filaments are created equal. PLA (polylactic acid) is easy to print but brittle. Most people start with PLA, which is fine for many circumstances. For stronger prints that will be under stress:1. Choose the Right MaterialPETG (polyethylene terephthalate glycol): More flexible and impact-resistant.ABS (Acrylonitrile Butadiene Styrene)/ASA (Acrylonitrile Styrene Acrylate): Tough and temperature resistant.Nylon: Excellent strength and durability, though trickier to print.Carbon fiber–reinforced filaments: Provide stiffness and strength for functional parts.Orient your part so the main stress runs along the layer lines, not against them.For example, a hook printed standing up is more likely to snap than one laid flat.
ENGINEERING & DESIGNwww.semiconductorforu.com | 25Slicer settings play a huge role in part strength. You can change the infill, wall amount, brick layering, and more. The most important ones would be infill and walls; they are also the easiest to change. First thing is the infill pattern, which should be changed to Gyroid as it is regarded as one of, if not the, strongest patterns. Honeycomb is also a good pattern for strength, but the sine wave pattern of gyroid offers better strength in more directions.It is a common misconception that more infill is the main way to get a print stronger. This is wrong, though, as after a certain point, you get diminishing returns. Increasing the walls is more effective as it adds much more structure to the part for less material used. Adding more walls is basically adding 100% infill around the edge of the part, which provides the best structure.3. Adjust Print SettingsGyroid (20% infill) Honeycomb (15% infill)Infill percentage & pattern: Increase infill (30–50% for functional parts). Solid infill isn’t always necessary; patterns like gyroid or cubic provide excellent strength. After a certain point, infill becomes less efficient. Perimeters (walls) – Adding more perimeters often strengthens a part more efficiently than just adding infill. Aim for 3–5 walls for structural parts.Layer height: Thicker layers (0.2–0.3 mm) can improve bonding between layers compared to very fine layers.Print temperature: Ensure you’re printing hot enough for good layer adhesion without overheating.7% infill Gyroid 15% infill Grid 5 walls instead of standard 2 walls and 20% infill
ENGINEERING & DESIGN 26 | www.semiconductorforu.com The strength of a print is not just about the material or print settings—it also heavily relies on the design itself. By incorporating strategic design elements, you can significantly improve a part’s durability.5. Reinforce with Design TechniquesWeak inter-layer bonding is one of the most common causes of print failure. If the layers don’t bond strongly, your part can become brittle and prone to splitting. To address this:4. Improve Adhesion Between LayersPrint at the Upper End of the Recommended Temperature: Each filament has a temperature range that ensures optimal adhesion. Printing at the upper end of this range allows the filament to bond more effectively between layers.Reduce Cooling: Cooling fans can help improve print quality for many filaments, but for materials like ABS or PETG, reducing cooling speeds can help improve layer adhesion. For ABS, keep the cooling low during the first few layers and adjust based on results.Add Fillets and Chamfers: Sharp edges or corners can act as stress concentrators, leading to cracks. Rounded edges or chamfered corners help distribute stress more evenly and reduce the likelihood of breakage.Use Ribs or Gussets: These are ridges (like little poles) added to flat areas of a design to reinforce sections that are prone to bending or breaking. Ribs can be especially useful for adding rigidity to thin parts without adding a lot of weight or material.
ENGINEERING & DESIGNwww.semiconductorforu.com | 27Avoid Sharp Corners: In many 3D printing materials, sharp corners are weak points that can lead to failure under pressure. Instead, incorporate curves or rounded transitions to help the material handle stress more evenly.Split Large Parts into Smaller Pieces: Sometimes a part is simply too large to print optimally in one piece. Consider breaking down large prints into smaller, more manageable pieces that can be printed with strength in mind. Once printed, these pieces can be assembled into the final product, often with added strength.Image from Wikipedia (https://commons.wikimedia.org/wiki/File:Wing_structure__ribs.svg)Even after your print is complete, there are a few additional steps you can take to boost its strength and durability.Making 3D prints stronger isn’t just about cranking up the infill. It’s a mix of material choice, print orientation, slicer settings, and smart design. By optimizing these factors, you can produce parts that don’t just look good—but can actually handle real-world use.6. Post-Processing for Extra StrengthConclusionAnnealing: For materials like PLA or nylon, annealing can significantly improve strength and heat resistance. This involves baking the printed part in an oven at a controlled temperature to encourage the material’s internal crystalline structure to form, making the part tougher and more heat-resistant.Epoxy Coating: A layer of epoxy resin can add strength, durability, and impact resistance to a 3D print. By brushing or dipping your print in an epoxy coating, you can improve its overall performance and protect it from wear and tear.Metal Inserts: For parts that require screws or bolts, instead of relying on plastic threads, use threaded brass inserts. These provide a much stronger, more reliable method of securing parts together, preventing the threads from stripping or wearing down over time.
INDUSTRY DIALOGS 28 | www.semiconductorforu.com RAGHUPANICKER\"Kaynes Semicon is driving India’s rise as a self-reliant chip powerhouse\"CEO OF KAYNES SEMICONIn this exclusive interaction with Semiconductorforu, Mr. Raghu Panicker, CEO of Kaynes Semicon, shares insights into the company’s leadership philosophy, long-term vision, and technology breakthroughs. From pioneering India’s first packaged chips to building a world-class OSAT facility in Sanand, he outlines how Kaynes is driving innovation, partnerships, and execution to power India’s semiconductor ambitions.What leadership philosophy drives Kaynes Semicon’s journey in establishing itself as a frontrunner in India’s semiconductor space?Kaynes Semicon’s journey builds on decades of expertise in electronics manufacturing and strategic execution, led by a forward-thinking leadership team dedicated to technology-driven transformation. The company’s leadership philosophy centers on “agile execution with global perspective”—prioritizing rapid decision-making, cross-functional collaboration, and openness to international best practices. By bringing in seasoned OSAT leaders from Southeast Asia and nurturing local engineering talent, Kaynes Semicon’s leadership fosters innovation, accountability, and resilience, shaping its path as a frontrunner in India’s semiconductor domain and driving the team to deliver ahead of schedule against ambitious milestones.
INDUSTRY DIALOGSwww.semiconductorforu.com | 29What is your long-term vision for Kaynes Semicon, and how does it align with India’s aspirations to become a global semiconductor hub?Kaynes Semicon’s long-term vision is to become a global benchmark in semiconductor packaging and OSAT services, catalyzing India’s rise as a self-reliant semiconductor hub. This vision aligns seamlessly with India’s aspirations—leveraging government incentives, robust infrastructure, and a phased innovation strategy to reduce import dependency and position India alongside major global supply chains. By focusing on capability-building and integrating design to packaging under one roof, the company creates jobs and nurtures high-value manufacturing in India, supporting the nation’s broader mission to become a deep-tech product powerhouse.Kaynes Semicon has been making strides in product innovation and technology. Could you elaborate on some of the key products and breakthroughs that set the company apart?Kaynes Semicon’s OSAT facility in Sanand, Gujarat, is spearheading several industry-firsts for India. Key breakthroughs include pioneering India’s first packaged semiconductor chips (IGBT, IPM, Power MOSFETs) for critical sectors like EVs, satellites, and consumer electronics. The company’s technology roadmap features rapid prototyping, simulation-driven test methodologies, and phased adoption of advanced packaging (2.5D/3D integration, chiplets) for AI, data center, and telecom applications. Strategic collaborations with Infineon, Emerson, and SEALSQ have also accelerated the adoption of new materials, AI-driven quality inspection, and quantum-resistant security solutions, setting Kaynes Semicon apart as a technology trailblazer.Where do you see the biggest growth opportunities for Kaynes Semicon in both domestic and global markets?Kaynes Semicon sees outsized growth potential in both domestic and global arenas. Automotive remains a high-value, stable growth vertical due to electrification and EV adoption, while industrial electronics offer faster cycles and high volume. Data centers and AI workloads are driving demand for advanced packaging and chiplet architectures, and the company is actively exploring opportunities in aerospace, defence, and future segments like railways and space-based systems. By expanding into Japan, US, and global markets—and fostering joint ventures and technology transfer—the company aims to become a preferred partner in performance-driven domains.Kaynes recently announced/expanded semiconductor manufacturing plants. Can you walk us through the facilities, their capabilities, and the role they will play in strengthening India’s semiconductor ecosystem?The Sanand OSAT facility exemplifies Kaynes Semicon’s commitment to rapid execution and ecosystem development. With an investment of over ₹3,300 crore, the facility offers an initial capacity of 6.3 million chips daily, including high-reliability packaging for automotive, industrial, and consumer sectors. State-of-the-art cleanrooms, vertically integrated assembly and test capabilities, and engineered scalability—all supported by government policy and international partners—position the plant as a catalyst for reducing import dependence and strengthening local supply chains. The pilot line is already operational, with commercial deliveries to key clients targeted by October and mass production starting January 2026.
INDUSTRY DIALOGS30 | www.semiconductorforu.comCould you highlight some of the recent milestones or achievements Kaynes Semicon has accomplished that you are most proud of?Recent achievements include cabinet approval and rapid construction of the Sanand facility, ahead-of-schedule delivery of India’s first paid chip prototypes to anchor clients, multi-year agreements with Alpha Omega Semiconductor and partnerships with Infineon, Emerson, and SEALSQ. Kaynes Semicon’s team has demonstrated exceptional speed, completing cleanroom installation and machinery setup within months. The company secured government subsidies and was the first Indian OSAT company to launch commercial-grade packaging—solidifying its reputation for project execution and strategic agility.What are your near- and longterm priorities for Kaynes Semicon in terms of technology, talent, and global partnerships?Kaynes Semicon’s immediate priorities include scaling the Sanand plant, expanding the skilled workforce to 1,500+ engineering professionals, and delivering its first international chip shipments. Longer-term, the company is investing in advanced packaging technologies, strengthening global partnerships (with players in the US, Japan, Singapore, and Europe), and integrating quantum security and AI tools into production. Talent development is critical: aggressive recruitment, upskilling, and leadership development ensure operational excellence and drive a culture of innovation and accountability—aligning with both government vision and market demands.How do you view the India Semiconductor Mission and government initiatives, and what role do you believe Kaynes Semicon can play in making India a self-reliant semiconductor powerhouse?The India Semiconductor Mission has provided both strategic direction and financial impetus for bold industry moves. Kaynes Semicon is a direct beneficiary, championing rapid execution, indigenous innovation, and local supply chain development. Its role is to catalyze India’s journey from service-based strengths to IC design, packaging, and testing leadership—locking in domestic value and exporting technology to the world. By integrating quantum security and collaborating on ecosystem-wide best practices, Kaynes Semicon strengthens India’s position in global supply networks and reinforces the self-reliant semiconductor powerhouse vision.
INDUSTRY DIALOGS 32 | www.semiconductorforu.com SHETAL MEHTASuchi Semicon, Co-Founder
INDUSTRY DIALOGSwww.semiconductorforu.com | 33LOCALIS THEOF A RESILIENTSUPPLY CHAINPACKAGING \"\"FOUNDATIONSEMICONDUCTORWhat inspired the founding of Suchi Semicon, and how does the company’s vision align with India’s growing ambitions in semiconductor manufacturing?How would you define Suchi Semicon’s core mission as it positions itself as a leading OSAT service provider in India?Suchi Semicon was founded in July 2023 by Ashok Mehta and me to address a critical missing link in India’s semiconductor value chain: domestic OSAT (outsourced assembly and test) capability. India has strengths in chip design, but packaging and test capacity have historically been dependent on overseas facilities. To solve this gap, we committed a $100 million investment, approximately ₹840–870 crore, to set up our first facility in Surat, which was inaugurated on 15 December 2024. This move directly aligns with India’s semiconductor vision under the India Semiconductor Mission, where building local Assembly and Packaging infrastructure is essential for reducing import reliance. Our plant contributes to this national objective by enabling local validation, packaging, and testing of integrated circuits at globally benchmarked standards.Our mission is to build a globally competitive OSAT platform in India, enabling local IC India, enabling local IC assembly packaging, and electrical testing at high reliability and throughput levels. We operate a 30,000 sq ft facility in Surat that houses Class 10K and 100K cleanroom environments essential for precision semiconductor manufacturing. Beginning with a pilot line capable of producing 300,000 chips per day, we have designed an expansion roadmap to scale output to nearly 3–4 million chips per day. This phased approach allows domestic and international customers to qualify their integrated circuits locally rather than overseas, improving time-tomarket and reducing dependency on foreign packaging hubs. Ultimately, our goal is to support India’s semiconductor ecosystem with a facility that blends quality, scalability, and engineering co-development.As India accelerates its push toward semiconductor self-reliance, OSAT capability has emerged as a critical missing link. In this interview, Suchi Semicon Co-Founder Shetal Mehta shares the company’s journey, from launching Gujarat’s first advanced assembly and test facility to building globally benchmarked packaging capacity that supports India’s Atmanirbhar Bharat vision.
INDUSTRY DIALOGS 34 | www.semiconductorforu.com Could you highlight some key milestones in Suchi Semicon’s journey toward establishing itself as a reliable player in semiconductor assembly and testing?How does the company ensure high-quality output, scalability, and flexibility across diverse customer segments and product lines?What advanced IC packaging and testing capabilities set Suchi Semicon apart in terms of precision, innovation, and efficiency?Our journey is marked by several important milestones that reflect both commitment and execution. We began by announcing a capital expenditure of $100 million, over ₹840 crore, to build an advanced OSAT facility in Surat. In December 2024, we inaugurated this 30,000 sq ft plant and launched our pilot production line, starting with an initial capacity of 1.3L chips per day, scaling up to 3L chips per day. In early 2025, we achieved a major milestone by shipping our first domestically packaged chip to a U.S. customer for validation, demonstrating our ability to meet global quality expectations. We have also initiated the next phase of expansion, which targets scaling production to around 3–4 million chips per day through additional equipment installation. These milestones form the foundation for global competitiveness.have planned capacity ramp-ups that will take production from the current 300,000 chips per day to 3–4 million chips per day. This integrated approach gives us strength in precision, speed, and readiness for advanced packaging demands.Quality, scalability, and operational flexibility are built into our systems from the outset. We are officially ISO 9001:2015, ISO 14001:2015 and ISO 45001:2018 certified. Each manufacturing stage is documented with full traceability. Our modular expansion approach enables us to scale from the pilot capacity through additional lines and equipment. Flexibility is supported by diverse package types and a co-development model that allows customisation for different customer requirements. We also aim to create approximately 1,200 jobs over five years, ensuring that we have a trained workforce ready as capacity expands. Together, these pillars enable reliable output, efficient scaling, and sustained manufacturing consistency.What role do partnerships and collaborations play in enhancing Suchi Semicon’s capabilities and expanding its customer ecosystem?Partnerships form an essential part of our technology-building and capacity-expansion strategy. We work with academic institutions such as GTU and SVNIT to develop skilled talent through structured training and internship programs. On the technology front, we collaborate with global equipment and process partners to ensure smooth process transfer, faster qualification, and adherence to global packaging standards. Our customer partnerships involve joint development of packaging flows, which helps reduce time-to-production and enhances reliability for end applications. These collaborations collectively strengthen our ability to serve customers across industrial, automotive, consumer, and export markets. By building an ecosystem rather than operating in isolation, we accelerate capability development and create a strong base for both domestic and international semiconductor customers. Our 30,000 sq ft facility integrates Class 10K and 100K cleanrooms that support highly controlled manufacturing operations essential for semiconductor assembly. We offer a full packaging workflow that includes wafer preparation, wafer sawing, die attach, wire bonding, moulding, marking, and final seal and test. Our engineering team collaborates closely with customers to shorten qualification cycles for complex packages. With scalable floor space and infrastructure, we How is Suchi Semicon integrating innovation and R&D initiatives to strengthen its technological competitiveness in the OSAT domain?Innovation is embedded into our operational and engineering framework. We co-develop packaging architectures and test flows with customers, enabling faster qualification cycles and improved manufacturability. Our R&D efforts are supported through MoUs with IIT B, GuHow is the company addressing skill development and workforce training to meet the demands of advanced semiconductor manufacturing?We aim to create approximately 1,200 jobs over five years as part of our growth roadmap. To ensure the required talent pipeline, we have partnered with academjarat Technological University and Sardar Vallabhbhai National Institute of Technology, helping us access talent, research support, and process-development partnerships.
INDUSTRY DIALOGSwww.semiconductorforu.com | 35How does Suchi Semicon contribute to building a self-reliant semiconductor ecosystem in India and support the country’s Atmanirbhar Bharat mission?ic institutions such as GTU and SVNIT for structured training programs that include classroom modules, clean-room practices, and hands-on process exposure. We have also onboarded experienced engineers, including professionals from Malaysia, to help establish early process maturity and international benchmarking. These initiatives help us build a capable workforce that can maintain high yields, operational discipline, and continuous improvement.What sustainability and growth strategies is Suchi Semicon adopting to ensure long-term success and global competitiveness?Our long-term strategy is phased and execution-driven, focused on building a resilient and globally competitive OSAT operation. We began with a $100 million investment (approximately ₹840–870 crore) to establish the Surat OSAT facility, designed with modular cleanroom infrastructure that allows demand-linked capacity expansion through the addition of tools and production lines.A core pillar of our strategy is quality-led manufacturing. We have deployed top-of-the-line equipment sourced from leading vendors across multiple countries, ensuring alignment with global semiconductor standards. This global sourcing approach enables consistent process performance, high yields, and longterm operational reliability.Equally critical is talent. Our leadership and engineering teams bring extensive experience from international semiconductor markets, providing strong operational foundations, disciplined process execution, and global best practices from day one.In parallel, we are standardising manufacturing processes, strengthening process-control systems, and increasing supply-chain localisation to improve resilience and cost efficiency. We have also entered into MoUs with leading academic institutions to support R&D, workforce training, and skill development, ensuring a sustainable talent pipeline.Together, these strategies position us for sustained competitiveness as a reliable OSAT partner for both domestic and export marketsOur investment of nearly $100 million (₹840–870 crore) in Gujarat’s first OSAT facility supports India’s goal of building domestic semiconductor packaging and testing capacity. India’s semiconductor consumption market is growing rapidly across electronics, automotive, telecom, and industrial sectors, yet continues to rely heavily on imports for chip packaging and validation.With an initial capacity of 300,000 chips per day, scalable to 3–4 million chips per day, the facility enables Indian designers and OEMs to validate and source packaged chips locally, reducing import dependence, improving supply-chain resilience, and accelerating time-to-market.In early 2025, we exported our first packaged devices to a U.S. customer for validation, demonstrating globally competitive manufacturing quality from India. The facility also supports skilled job creation and technology capability development, advancing the Atmanirbhar Bharat objective of a self-reliant and globally competitive semiconductor ecosystem.
36 | www.semiconductorforu.com BLOG BEAT Aviation is undergoing a technology-driven transformation powered by digital engineering, sustainable propulsion, and advanced systems integration. As aircraft become smarter, cleaner, and more connected, collaboration across the aerospace ecosystem is essential. By aligning innovation with safety, sustainability, and scalability, the industry is building a resilient foundation for the next era of flight.SOARING AHEAD: HOW COLLABORATIVE TECHNOLOGIES ARE SHAPING THE FUTURE OF FLIGHT
www.semiconductorforu.com | 37BLOG BEATThe aviation industry is entering a decisive phase where technology is no longer an enabler at the margins—it is the central force redefining how aircraft are designed, built, certified, and operated. Pressures to reduce emissions, improve efficiency, enhance safety, and meet growing global demand are converging with rapid advances in digital tools, materials, and propulsion systems. Together, these forces are reshaping the future of flight.What distinguishes this transformation is its complexity. Modern aircraft integrate advanced aerodynamics, intelligent software, electronics, and data-driven systems, all governed by rigorous safety and regulatory requirements. No single discipline or organization can manage this complexity alone. The future of aviation technology depends on collaboration—across manufacturers, engineering specialists, digital innovators, suppliers, and regulators—working toward shared outcomes.Sustainability has become one of the most powerful drivers of aviation technology development. Reducing environmental impact while maintaining performance and economic viability demands innovation at every level of the aircraft lifecycle.Sustainable aviation fuels are emerging as a near-term solution to reduce lifecycle emissions without requiring immediate fleet replacement. At the same time, advances in aerodynamics, lightweight composite materials, and high-efficiency engines are delivering measurable reductions in fuel consumption. Looking ahead, hybrid-electric and hydrogen-based propulsion concepts point toward more radical shifts in how aircraft may be powered.Importantly, sustainability extends beyond propulsion. Digital manufacturing, energy-efficient production processes, optimized supply chains, and lifecycle management technologies are becoming integral to responsible aerospace development. Technology is enabling a more holistic approach—one that balances performance with environmental accountability.Sustainability as a Technology ChallengeAviation has always been a collaborative endeavor, but today’s technological challenges demand deeper and more integrated partnerships. Aircraft systems now span mechanical engineering, electronics, software, cybersecurity, and data analytics. Excellence in one domain is no longer sufficient. Collaborative technology ecosystems allow partners to combine strengths and accelerate innovation. Engineering specialists contribute deep domain expertise, digital partners bring advanced modeling and analytics capabilities, and manufacturing experts ensure scalability and quality. When these capabilities align, innovation moves faster and with greater confidence.Equally critical is collaboration with regulatory bodies. Early engagement supports the development of certification pathways that accommodate new technologies while preserving aviation’s uncompromising safety standards.Collaboration: The Engine Behind Aerospace Innovation
38 | www.semiconductorforu.com BLOG BEAT The future of aviation won’t be built in isolation—progress emerges where ideas, expertise, and commitment converge across disciplines and organizations.Digital transformation has become the backbone of modern aerospace development. Model-based systems engineering, digital twins, and high-fidelity simulation tools are changing how aircraft are conceived and validated. Engineers can now explore design trade-offs, predict system behavior, and identify risks in virtual environments long before physical hardware is built.These tools significantly reduce development cycles and costs while improving reliability. In manufacturing, automation, robotics, and intelligent inspection systems enhance precision and consistency. Data-driven quality control reduces rework and supports continuous improvement.In operations, real-time data analytics enable predictive maintenance and condition-based monitoring. By anticipating failures before they occur, airlines can improve safety, reduce downtime, and lower operating costs. Digital technologies are also transforming air traffic management, enabling smarter routing and more efficient use of airspace.Beyond conventional commercial aviation, new flight technologies are expanding the industry’s horizons. Electric and hybrid-electric aircraft concepts are gaining traction, particularly for regional and short-haul routes. Advanced air mobility platforms, including electric vertical take-off and landing vehicles, promise new models of urban and regional transport.These technologies rely on advances in battery systems, power electronics, lightweight structures, and autonomous control. While challenges remain—especially in certification, infrastructure, and scalability—progress is accelerating. Incremental improvements are steadily moving these concepts from prototypes toward operational reality.Automation is also playing a growing role in traditional aviation. Intelligent avionics and decision-support systems enhance pilot situational awareness and reduce workload, contributing to improved safety and efficiency. Over time, higher levels of autonomy may become more common, particularly in cargo and specialized applications.Digital Engineering Takes Center StageEmerging Technologies: Electric and Advanced Air Mobility
www.semiconductorforu.com | 39BLOG BEATAs innovation accelerates, safety remains the industry’s non-negotiable foundation. New technologies must be proven, validated, and certified to the highest standards. Regulatory frameworks are evolving to address novel aircraft configurations, propulsion systems, and digital capabilities.Digital validation tools are becoming essential in this process. Virtual testing, simulation-based certification, and data-driven compliance strategies help bridge the gap between rapid innovation and rigorous safety assurance. Transparency, traceability, and system integrity are critical to building trust in next-generation aviation technologies.Technology, Safety, and CertificationAircraft technology does not exist in isolation—it must be supported by equally advanced infrastructure. Airports and air navigation systems are adopting digital platforms to improve efficiency, resilience, and sustainability. Smart infrastructure enables better coordination, reduced delays, and optimized resource use.Passenger experience is also evolving through technology. Biometric identification, personalized digital services, real-time information, and enhanced in-flight connectivity are becoming standard expectations. Cabin systems increasingly integrate health, comfort, and connectivity features, reflecting a broader view of performance that includes the human experience.Infrastructure and the Digital Passenger JourneyDespite strong momentum, the path forward is not without obstacles. High development costs, supply chain complexity, skills shortages, and regulatory uncertainty can slow adoption. Overcoming these challenges requires collective commitment and long-term investment. Open innovation models, cross-industry alliances, and public–private partnerships are proving essential. By sharing risk, knowledge, and resources, the aviation ecosystem can accelerate the transition from breakthrough technologies to scalable, real-world solutions.Scaling Innovation Through Shared CommitmentThe future of flight is being shaped by powerful technological forces—digital engineering, sustainable propulsion, advanced materials, and intelligent systems. But technology alone is not enough. Its success depends on collaboration, trust, and shared purpose across the aerospace ecosystem.In this Technology Spotlight era, the most enduring innovations will be those built together—through aligned vision, disciplined execution, and responsible use of technology. As aviation moves toward a smarter, cleaner, and more connected future, collaboration will remain the key technology that makes all others possible.Conclusion: Technology Built Together
40 | www.semiconductorforu.com BLOG BEAT
www.semiconductorforu.com | 41How context-aware edge AI sensors will redefine consumer electronicsBLOG BEAT
42 | www.semiconductorforu.com BLOG BEATSmart devices will evolve from passive trackers to context-aware personalized assistantsSIMONEFERRI VP, MEMS Sub-Group General Manager STMicroelectronicsImagine a drummer, lost in the groove, her mind focused solely on her music. She pauses, looks at her smartphone; not for the time, but to get instant feedback on her performance: tempo, precision, and even technique. The smart drumsticks in her hands have been collecting real-time data, measuring her beat, force, and rhythm with accuracy. The smartphone connected to these drumsticks offers immediate guidance on how to improve and pinpointing areas for refinement.Wearables used to be simple tools that measured heart rate, calories, or steps. However, as successful as they have been, these devices now face the challenge of evolving consumer expectations. Users no longer want just data; they want insights and actionable feedback that keeps them engaged. With more advanced technology, wearables are expected to deliver personalized experiences, anticipating needs and responding to actions.This is quickly becoming a reality. Today’s technology is rapidly moving from simple tracking of heart beats and steps to a new generation of smart devices able to contextualize user movements. These devices can provide deep insights that go beyond the surface level. Wearables and smart devices are becoming smarter, with edge AI sensors enabling context-aware intelligence. Consider the shift underway. Fitness trackers and the like collect vast amounts of data, but the next step is contextual awareness. Users want more than raw numbers. They seek real-time decisions and predictive feedback. Wearables and smart devices need to move beyond passive tracking and truly understand their environment. They need to be able to enrich everyday life by providing meaningful insights and creating an experience that actively engages users, rather than just measuring their movements.Evolving consumer expectations: from passive tracking to active insight
BLOG BEATwww.semiconductorforu.com | 43This shift is fundamentally about moving sensors from being just reactive, to proactively responding to external and environmental context. Wearables and smart devices of tomorrow will not just record your heart rate. They will know if you are standing still, walking, or in the middle of a high-impact sport or drop. The next generation of smart devices will be able to analyze environmental data alongside personal biometrics to make smarter, more informed decisions. Think of it as going from being reactive to anticipating As smart devices evolve from passive trackers to context-aware personalized assistants, this opens up new possibilities for the consumer electronics industry to truly innovate.Whether it's an angler using a smart fishing rod analyzing his cast or a skier tracking edge control through turns, smart devices and wearables can offer insight into adjusting strength, technique, gait or throwing angles across a number of activities. Real-time contextual analysis enables the next generation of smart devices to combine technology with passion, helping people take their sports and hobbies to the next level. These devices don't just measure performance; they create a more engaging and personalized experience, allowing users to improve faster and smarter. For athletes and fitness enthusiasts recovering from an injury, such as knee surgery, next generation smart devices can track strain and offer highly customized feedback. If the device detects excessive force or imthe unexpected – like the smart drumsticks example, which continuously measure technique and performance. At the same time your smartphone can provide feedback on not just tempo but also rhythm precision, recovery time, and technique. In sports, wearables are moving beyond tracking heart rates to understanding the dynamics of a runner's stride, or the power behind a throw. These insights are delivered in real-time and are tailored to the individual, not just generic benchmarks.proper movement, it can warn the user to adjust their activity, preventing overexertion and safeguarding against further injury or hindering the healing process. This level of tailored monitoring ensures that users can safely improve their performance, pushing their limits without risking long-term damage. Take a jogger running around a lake early in the morning before going to work. She experiences a health issue or stumbles in an unfortunate way. Her smart device detects the unusual pattern, the sudden downward velocity and following that the lack of body movement, then triggers an emergency alert, sending for help or notifying emergency services. This is enabled by an edge AI sensor monitoring both the user’s body and the environment, combining real-time tracking with AI to contextualize a serious incident and take action. The smart device no longer only passively tracks and records data; it proactively analyses what happens and takes action, calling for help and providing peace of mind.Empowering smart devices to understand and respond to contextWhat this means for consumer electronics The underlying technologies that make these advancements possible are edge AI inertial sensors providing real-time data processing on the device itself. Rather than relying on cloud services to do that remotely, edge processing of the motion data atmake adjustments in real-time. the device level is crucial for fast, responsive decision-making. With machine learning running locally on the device, these sensors can continuously assess the situation, learn from the data they collect, and The technology enabling this shift
44 | www.semiconductorforu.com BLOG BEATIMU (Inertial Measurement Unit) sensors can capture high-intensity events that would typically saturate traditional accelerometers resulting in monitoringstalls and glitches. This advanced sensor technology ensures that important data is not lost during high-impact activities without compromising energy efficiency.The future of consumer electronics is one where smart devices are more than just accessories, they will be indispensable personal assistants that blend seamlessly into our daily lives. The vision is clear: wearables and smart devices will not just collect and display data; they will capture, analyze, and learn, improving over time to offer more precise insights and recommendations to the user.We will see the integration of multi-sensing in increasingly compact form factors. Devices like smart rings, smartwatches, and even smart clothing will combine multiple sensing types in a single smart device, offering consumers a fully integrated, real-time health and performance monitoring system.For consumer electronics companies, the path forward is clear: incorporating context-aware edge AI sensors into new products presents a significant opportunity. This technology is poised to unlock new market potential, enabling the creation of innovative product categories and new brands for the years ahead. Responding to evolving consumer needs, companiescan secure a competitive advantage in an increasingly crowded market. This will allow them to create products that go beyond basic functionality, offering solutions that actively address emerging consumer expectations.As the era of context-aware smart devices takes shape, there’s a real opportunity for companies to build the next generation of consumer electronics.When smart devices become personal assistantsSeizing the opportunity in consumer electronics
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46 | www.semiconductorforu.com BLOG BEAT Copper sintering is emerging as a game-changing packaging and interconnect technology for wide band gap (WBG) semiconductors such as silicon carbide and gallium nitride. By delivering high thermal performance, long-term reliability, and cost advantages over traditional materials, copper sintering addresses critical challenges in power electronics and could play a decisive role in accelerating next-generation semiconductor adoption.
www.semiconductorforu.com | 47BLOG BEATCOPPER SINTERINGENABLING THE NEXT WBG LEAP
48 | www.semiconductorforu.comBLOG BEATThe Growing Demands of Wide Band Gap DevicesUnlike silicon devices, WBG semiconductors are designed to operate at junction temperatures exceeding 200°C, with higher voltage and current densities. These conditions place extraordinary stress on traditional solder-based interconnects, which were never designed for such extremes. Over time, solder joints can degrade due to fatigue, void formation, and electromigration, leading to reduced reliability and shorter device lifetimes.As industries push for higher efficiency and smaller form factors, the limitations of conventional packaging methods are becoming increasingly evident. Power modules must dissipate heat efficiently, withstand repeated thermal cycling, and maintain stable electrical performance over millions of operating cycles. This has driven the industry to explore advanced die-attach and interconnect solutions capable of matching the inherent strength of WBG materials.Wide band gap (WBG) semiconductors are reshaping the future of power electronics. Materials such as silicon carbide (SiC) and gallium nitride (GaN) offer higher breakdown voltages, faster switching speeds, and superior thermal performance compared to conventional silicon. These advantages are enabling more compact, efficient, and robust systems across electric vehicles, renewable energy, industrial automation, data centers, and aerospace applications.cHowever, while WBG devices are capable of operating at extreme temperatures and power densities, their performance is ultimately constrained by how well they are packaged. Managing heat, ensuring mechanical reliability, and maintaining electrical integrity under harsh operating conditions have become just as critical as the semiconductor materials themselves. In this context, copper sintering is gaining attention as a potential breakthrough technology that could unlock the full capabilities of WBG semiconductors.Understanding Copper SinteringSintering is a solid-state bonding process in which metal particles are fused together using heat and pressure without fully melting the material. In semiconductor packaging, sintering creates a dense, conductive bond between the semiconductor die and its substrate.Silver sintering has traditionally been favored for high-performance applications due to its excellent thermal and electrical conductivity. However, silver is expensive and subject to supply volatility. Copper, by contrast, offers comparable thermal performance at a fraction of the cost. With high electrical conductivity, strong mechanical properties, and superior resistance to electromigration, copper is a compelling alternative for advanced power electronics.Copper sintering enables the formation of robust, void-free joints capable of handling extreme thermal and mechanical stress. These characteristics make it particularly well suited for SiC and GaN devices operating in demanding environments.Thermal Performance: A Critical AdvantageOne of the most significant benefits of copper sintering is its ability to handle high temperatures over long periods without degradation. WBG devices generate intense localized heat, and any inefficiency in heat removal can compromise performance or lead to premature failure.Sintered copper joints offer low thermal resistance, allowing heat to flow efficiently from the semiconductor die to the substrate and cooling system. Unlike solder, which can soften or creep at elevated temperatures, sintered copper maintains structural integrity well beyond typical WBG operating limits. This stability is essential for appli
cations such as electric vehicle inverters, fast chargers, and renewable energy converters, where thermal stress is continuous and unavoidable.www.semiconductorforu.com | 49BLOG BEATReliability Under Harsh ConditionsIn real-world operation, power modules are subjected to repeated thermal cycling as devices turn on and off. Each cycle introduces mechanical stress due to differences in thermal expansion between materials. Over time, this stress can cause cracks, delamination, or joint failure.Copper sintering produces mechanically strong, fatigue-resistant bonds that perform well under extreme cycling conditions. The monometallic nature of copper-to-copper interfaces also reduces mismatch stresses, improving long-term reliability. For automotive and industrial systems expected to operate reliably for decades, this durability is a major advantage.Cost and Sustainability BenefitsOvercoming Technical ChallengesBeyond performance, copper sintering offers significant economic and environmental benefits. Copper is far more abundant and less costly than precious metals such as silver. As WBG semiconductor adoption scales, especially in electric vehicles and renewable energy systems, material costs become a critical factor in overall system affordability.From a sustainability perspective, copper has a well-established recycling infrastructure and a lower environmental impact compared to precious metals. Reducing reliance on silver aligns with industry goals to improve supply-chain resilience and lower the carbon footprint of advanced electronic systems.Despite its promise, copper sintering has faced technical hurdles that have slowed widespread adoption. Copper \"As wide band gap devices push power density and operating temperatures higher, copper sintering is emerging as the missing link between material capability and real-world reliability.\"
50 | www.semiconductorforu.comBLOG BEATis more susceptible to oxidation than silver, and early sintering processes required high temperatures and pressures that risked damaging sensitive semiconductor components.Recent advances in materials science are addressing these challenges. Improved copper paste formulations now incorporate additives that reduce oxide formation and enable sintering at lower temperatures. Innovations in particle design and process control have made it possible to achieve strong, reliable bonds with reduced mechanical stress on the die.Low-temperature and pressure-assisted sintering techniques are also expanding the range of applications where copper sintering can be safely deployed. As these technologies mature, the gap between laboratory success and industrial scalability continues to narrow.Integration with Advanced Packaging TechnologiesMarket Impact and Industry OutlookConclusionCopper sintering fits naturally into modern power module architectures. Many WBG devices already use copper-based substrates to enhance thermal performance. Sintered copper die-attach layers create a seamless thermal pathway, minimizing resistance and improving heat spreading.As packaging trends move toward higher integration, embedded power modules, and three-dimensional architectures, copper sintering offers compatibility with dense layouts and high power densities. Its mechanical robustness supports thinner substrates and more compact designs without compromising reliability.The global push toward electrification, energy efficiency, and digital infrastructure is driving rapid growth in WBG semiconductor adoption. Electric vehicles, fast-charging networks, renewable energy systems, and industrial power electronics all depend on reliable, high-performance power modules.Copper sintering has the potential to become a cornerstone technology in this transition. By reducing costs, improving reliability, and supporting higher operating temperatures, it helps bridge the gap between WBG device capability and real-world deployment. While silver sintering remains dominant today, copper-based solutions are gaining traction as manufacturing processes mature and cost pressures intensify.The global push toward electrification, energy efficiency, and digital infrastructure is driving rapid growth in WBG semiconductor adoption. Electric vehicles, fast-charging networks, renewable energy systems, and industrial power electronics all depend on reliable, high-performance power modules.Copper sintering has the potential to become a cornerstone technology in this transition. By reducing costs, improving reliability, and supporting higher operating temperatures, it helps bridge the gap between WBG device capability and real-world deployment. While silver sintering remains dominant today, copper-based solutions are gaining traction as manufacturing processes mature and cost pressures intensify.