Magazine | News | Industries EDITION #7 | DECEMBER 2025EXPLORING INDIA’S SEMICONDUCTOR AMBITIONSTECH INSIGHTSteel-Based resistors out-power ceramicthe future of sustainable chipmakingThe rise of decentralized gridsSemiconductorForu.comDIGIKEYPOWER AT THE EDGE:\"ADVANCED PACKAGING IS KEY TO INDIA'S AMBITION OF DECOMING A MAJOR PLAYER IN THE GLOBAL SEMICONDUCTOR.''ZERO-WASTE FABS:RAM TRICHURA New Investment FocusConsumer Electronics Dip vs. Data Center Surge:
Contents64 Industry Bulletin56 Event Spotlight38 Blog BeatAccelerating high-speed network test from lab to field50 Business UnboxedConsumer Electronics Dip vs.Data Center Surge:A New Investment FocusWintechcon 202540 Blog BeatPower at the edge: The rise of decentralized grids46 Blog BeatSingapore's Largest district cooling system begins operations04 Technology UpdatesEngineering & DesignSteel-Based resistors out-power ceramic16Tech SpotlightZero-Waste fabs: The future of sustainable Chipmaking10Industry Dialogs“Advanced packaging is key to india’s ambition of becoming a major player in the global semiconductor ecosystem”. \"Ram Trichur - Henkel Adhesive Technologies\"20Blog BeatEliminating thermal disturbances in non-contact temperature measurement24Blog BeatMetal 3D Printing32
Messe Frankfurt GroupDr. Ambedkar International Centre, New Delhi, India9 - 10 December, 2025The Agent of Change for the Indian Power ElectronicsIndustrypcim.in
04 | www.semiconductorforu.comTECHNOLOGY UPDATESSTMicroelectronics has introduced its new GaNSPIN GaN-IC platform designed to significantly boost energy efficiency in motion-control applications for home appliances and industrial systems. The first ICs in the series, GANSPIN611 and GANSPIN612, support motor drives up to 400 W, making them suitable for compressors, pumps, fans, and servo motors. By integrating GaN power transistors, drivers, and a half-bridge in a compact package, the platform reduces power losses, heat generation, and overall system size. These improvements help appliances achieve higher energy ratings, lower noise levels, and reduced bill-of-materials, enabling more efficient and compact next-generation products.ST unveils GaNSPIN GaN-IC platform for high-efficiency motion controlVox Power partners with DigiKey to enable engineers and designers to quickly configure custom power supplies online. Users can specify parameters like outputs, voltage, and current — the tool then generates a tailored solution which is assembled and shipped within days. According to DigiKey’s senior director, the tool dramatically reduces time from design to delivery, streamlining workflows. The initial offering includes Vox Power’s NEVO+ and VCCM series, marking a shift toward on-demand, configurable power solutions for OEMs and system integrators.DigiKey debuts first-ever power supply configuration tool
TECHNOLOGY UPDATESNavitas Semiconductor has introduced its new ultra-high-voltage (UHV) silicon carbide portfolio, featuring 3300V and 2300V GeneSiC™ devices available in power modules, discrete packages, and known-good-die formats. Built on Trench-Assisted Planar (TAP) MOSFET technology, the devices deliver improved voltage blocking, enhanced avalanche robustness, and reliable high-temperature switching performance. The advanced SiCPAK G+ modules—offered in half-bridge and full-bridge versions—provide significantly longer power-cycling life and superior thermal-shock reliability. Tailored for mission-critical applications such as AI data centers, grid infrastructure, renewable energy systems, industrial electrification, and fast EV charging, the new portfolio strengthens Navitas’ push toward high-efficiency power electronics.Navitas unveils new 3300V and 2300V UHV SiC portfolioTDK Corporation has launched its new S-series inrush current limiters, the S30 and S36 NTC thermistor families, built for demanding high-power applications. Supporting up to 35 A steady-state current and 750 J surge energy, they are ideal for SMPS, photovoltaic inverters, UPS units, and motor soft-start systems. With 30 mm and 36 mm disk sizes and power handling up to 25 W, the devices effectively reduce inrush currents, minimize component stress, and enhance system reliability. Compact, robust, and efficient, TDK’s new S-series provides designers with a reliable protection solution for modern power-intensive electronics.TDK unveils high-capacity S-series inrush current limiterswww.semiconductorforu.com | 05
06 | www.semiconductorforu.comTECHNOLOGY UPDATESGigaDevice has launched the new GD25NX series of xSPI NOR Flash devices, featuring a 1.8 V core and 1.2 V I/O architecture. The design allows direct connection to 1.2 V SystemonChips (SoCs) without external booster circuits — lowering system power consumption and reducing BOM cost. The GD25NX offers octalSPI at up to 200 MHz, providing data throughput of 400 MB/s, faster programming (0.12 ms pageprogram time) and quicker erase (27 ms sector erase) than conventional 1.8 V versions. It also integrates ECC, CRC and datastrobe (DQS) support for robust data integrity and signal stability. With readmode power consumption cut by up to 50%, GD25NX is ideal for powersensitive applications like wearables, edge AI, datacentres and automotive electronics. The series comes in 64 Mb and 128 Mb densities.GigaDevice rolls out GD25NX xSPI NOR Flash with dualvoltage designLittelfuse has unveiled its new TMR (Tunneling Magnetoresistance) magnetic switches — LF21112TMR and LF11215TMR — engineered for ultra-low-power, always-on applications. The omnipolar LF21112TMR detects either magnetic pole with a current draw as low as 200 nA, while the bipolar LF11215TMR provides directional sensing at just 1.5 µA. Both switches deliver high magnetic sensitivity, excellent thermal stability, and digital outputs in compact SOT23-3 packages. Designed for smart meters, IoT devices, wearables, home automation, tamper detection, and industrial automation, these switches enable long battery life, reliable operation in tight spaces, and efficient, energy-conscious magnetic sensing for modern electronics.Littelfuse Launches Ultra-Low-Power TMR Magnetic Switches
TECHNOLOGY UPDATESDiodes Incorporated has launched the AL3069Q, a high-efficiency 60 V boost controller designed for automotive LED backlighting applications, including infotainment screens, instrument clusters, and heads-up displays. It features four high-precision current-sink channels, each delivering up to 250 mA (400 mA pulsed) with excellent channel matching. The controller supports input voltages from 4.5 V to 60 V and offers adjustable switching frequencies from 100 kHz to 1 MHz. Integrated fault diagnostics cover over-current/voltage protection, LED open/short detection, softstart, and thermal shutdown. With precise PWM-to-analog dimming and support for large displays, the AL3069Q provides automotive OEMs a compact, reliable, and energy-efficient solution for next-generation vehicle displays.Diodes Inc. Introduces Automotive-Grade Boost Controller for LED BacklightingMelexis has introduced the MLX90382 magnetic encoder, designed for safety-critical E-chassis applications such as steer-by-wire, brake-by-wire, and active suspension systems. It offers up to 16-bit resolution, zero-latency signal processing, and strong stray-field immunity, ensuring precise angle and speed measurements even under magnetic interference. Supporting on-axis and off-axis mounting, multiple output modes (ABI/UVW, PWM, SPI/SSI), and certified to automotive standards (AEC-Q100, ISO 26262 ASIL D), the MLX90382 provides compact, reliable, and safety-ready digital feedback for next-generation EV steering, braking, and suspension systems.Melexis Launches Automotive-Grade Magnetic Encoder for E-Chassiswww.semiconductorforu.com | 07
08 | www.semiconductorforu.comTECHNOLOGY UPDATESiDEAL Semiconductor has launched its SuperQ MOSFET platform, designed to improve safety and efficiency in high-voltage battery systems (72 V and above). The devices feature 150 V rating, 2.5 mΩ on-resistance, and can handle peak short-circuit currents up to 800 A — around 1.4× higher than competing MOSFETs.This robustness allows designers to reduce MOSFET count by up to 50%, simplifying battery design, cutting BOM costs, and reducing overall pack size. SuperQ MOSFETs address the trade-off between low resistance for efficiency and structural strength for safety, offering a reliable solution for EVs, drones, power tools, and other high-voltage applications.iDEAL Semiconductor Enhances EV Battery Safety with SuperQ MOSFETsVishay Intertechnology has launched the LTA 30, a 30 W thick-film power resistor in a compact TO220 package, designed for demanding automotive applications. The resistor can be directly mounted on a heatsink and withstands harsh conditions, including high humidity, vibration, and temperatures up to +125 °C. It offers high reliability under transient stress, with a 500 V operating voltage and overload capability of 1.5× rated power for short durations. With resistance values from 0.010 Ω to 450 kΩ, non-inductive design, and 1500 Vrms dielectric strength, the LTA 30 is ideal for EV, HEV, and PHEV precharge/discharge resistors, on-board chargers, battery-management systems, and motor controls.Vishay Introduces AEC-Q200 Qualified 30 W Thick-Film Power Resistor
TECHNOLOGY UPDATESMicrochip Technology has introduced the Model Context Protocol (MCP) Server, an AI-powered interface that enables developers to access verified, up-to-date product information, including specifications, datasheets, inventory, pricing, and lead times. The MCP Server delivers context-aware, JSON-formatted data optimized for AI clients such as chatbots, IDE copilots, and enterprise tools. By integrating Microchip’s product data directly into design workflows, engineers can simplify sourcing, accelerate design cycles, and improve productivity, ensuring instant access to accurate information for efficient decision-making in complex electronics projects.Microchip Launches MCP Server for AI-Driven Product DataSamtec has introduced rugged multi-port SMPM interconnects with threaded coupling, designed for high-performance and high-reliability applications in RF, microwave, and millimeter-wave systems. These connectors support dense packaging while maintaining excellent signal integrity, low insertion loss, and high return loss across a wide frequency range. Their robust mechanical design ensures secure mating and long-term durability, making them ideal for aerospace, defense, telecommunications, and test-and-measurement environments. The new SMPM interconnects provide engineers with a compact, reliable, and high-performance solution for multi-channel RF connections in demanding applications.Samtec Unveils Rugged MultiPort SMPM Interconnectswww.semiconductorforu.com | 09
10 | www.semiconductorforu.com TECH SPOTLIGHT ZERO-WASTE FABS:THE FUTURE OF SUSTAINABLE CHIPMAKINGThe world’s appetite for semiconductors continues to expand rapidly, powering everything from personal electronics and medical devices to industrial automation and electric vehicles. Yet behind every microchip lies a complex manufacturing chain that generates significant waste — chemicals, plastics, slurries, discarded wafers, contaminated containers, packaging materials, and more.Most public discussions focus on end-of-life electronic waste, but waste generated during fabrication has an even larger environmental footprint. Manufacturers are now recognizing that upstream waste reduction is the most impactful step toward sustainable chipmaking.As semiconductor manufacturing scales to meet global demand, the environmental footprint behind each chip is becoming impossible to ignore. Waste reduction — from chemical recycling and wafer reclaiming to circular packaging and process optimization — is now essential. By embracing sustainability at every production stage, the semiconductor industry can dramatically cut waste, emissions, and resource consumption.
www.semiconductorforu.com | 11TECH SPOTLIGHTA Circular Approach: Recycle, Reclaim, ReuseSustainability in semiconductor manufacturing hinges on adopting circular-economy principles. Instead of treating materials, consumables, and chemicals as disposable components, manufacturers are designing production flows that keep materials in use longer.Reclaiming Silicon and WafersOne of the most effective interventions is wafer reclaiming — reprocessing used wafers through stripping, cleaning, and polishing so they can be reintroduced into production.This dramatically cuts the need for new wafer manufacturing, which is energy- and resource-intensive. Reclaimed wafers also reduce emissions associated with raw-material extraction and crystal growth.Recycling Chemical Byproducts and PackagingChip fabrication relies on acids, solvents, slurries, and photoresists, all of which traditionally produced hazardous waste. New chemical-recycling methods allow spent materials to be filtered, re-concentrated, or purified for reuse.Even packaging materials — wafer carriers, gloves, garments, plastics, and cardboard — are increasingly diverted into recycling streams instead of landfills.Process Optimization: Eliminating Waste at the SourceRecycling and reuse help mitigate waste, but the most powerful strategy is preventing waste from occurring in the first place.Maximizing Yield EfficiencyIn semiconductor fabrication, even a small yield loss multiplies environmental impact. Losing only a few percent of chip output can translate into massive resource wastage — additional chemicals, more wafer starts, higher water use, and increased emissions.“Every material reused is waste avoided — & in semiconductor manufacturing, those avoided grams quickly add up to avoided tons.”
12 | www.semiconductorforu.com TECH SPOTLIGHT Driving higher yield through precision processes, defect detection, and real-time monitoring reduces scrap while lowering the carbon footprint per functional chip.Material-Efficient Design & Smarter ChemistryManufacturers are also reducing waste by selecting more sustainable process materials, designing thinner wafers, optimizing deposition and etch steps, and minimizing the use of rare or hazardous chemicals.Shifting to bulk chemical delivery, returnable containers, and standardized reusable packaging further reduces single-use waste across the supply chain.“Sustainability isn’t a side project — it’s a production parameter as critical as yield and throughput.”Water, Energy, and Air: Waste Reduction Beyond the BinWaste in semiconductor manufacturing isn’t limited to solids and chemicals. Water, energy, and emissions are equally critical to sustainability.Water StewardshipSemiconductor fabs consume vast volumes of ultrapure water. Modern recycling systems now allow fabs to reclaim, purify, and reuse large portions of wastewater, reducing freshwater withdrawals and lowering effluent discharge.Renewable Energy & Emission CutsEnergy-intensive cleanrooms and process tools make semiconductors among the highest-consuming industrial sectors. Transitioning to renewable energy — solar, wind, or hydro — can drastically cut carbon emissions.Waste reduction also includes reducing volatile organic compounds, gas emissions, and particulates released during fabrication.
www.semiconductorforu.com | 13TECH SPOTLIGHTData-Driven Waste Management: Turning Insight Into ActionLeading semiconductor manufacturers rely on data analytics to evaluate and track waste patterns. By quantifying recycling rates, landfill diversion, chemical consumption, and waste-handling efficiencies, fabs build accountability into their sustainability journey.Centralized Waste-Management EcosystemsMany fabs now operate on-site recycling centers. These centers manage:The key is measurement. Without data-based insights, improvement becomes guesswork.Sorting and segregating waste streamsTreating chemical byproductsReclaiming wafer materialsPackaging reuse programsRecycling of plastics, garments, and cardboardCollaboration and Culture: The Human Side of SustainabilityTechnology alone cannot drive sustainability. Waste-reduction success depends on cultural alignment — employees understanding recycling protocols, suppliers adopting greener packaging, and logistics partners participating in take-back programs.Supplier PartnershipsManufacturers increasingly collaborate with chemical suppliers on closed-loop systems that recover empty containers, reduce packaging, and support material repurposing.Employee Training & AwarenessFrom proper waste segregation to minimizing contamination, workforce behavior influences the efficiency of recycling and handling processes.“Data tells the true story of waste — where it begins, where it spikes, and where it can be eliminated.”
14 | www.semiconductorforu.com TECH SPOTLIGHT Cross-Industry StandardsIndustry bodies are now pushing sustainability frameworks — encouraging fabs worldwide to adopt similar environmental metrics, recycling methods, and best practices.Challenges on the Road to Zero WasteWhy Sustainable Semiconductor Manufacturing MattersConclusion: Turning Waste Into OpportunityDespite significant progress, achieving a zero-waste semiconductor ecosystem comes with challenges:Waste-efficient chipmaking is no longer just an ethical responsibility — it’s a competitive advantage. Benefits Include:The semiconductor industry is entering a pivotal era — one where sustainability is inseparable from innovation. Waste reduction, once seen as a cost, is now recognized as a strategic enabler of efficiency, reliability, and global competitiveness.By reclaiming wafers, recycling chemicals, designing cleaner processes, optimizing yield, implementing renewable resources, and embracing data-driven management, chipmakers can dramatically decrease the environmental footprint of each device they produce.Sustainable semiconductor manufacturing is not just about reducing waste — it is about redefining the value chain to build a cleaner, resilient, and future-ready industry.Ensuring that sustainability aligns with performance, cost, and yield remains a delicate balancing act.As global demand rises with AI, EVs, data centers, automation, and consumer electronics, sustainable manufacturing becomes essential for performance and scalability.Complex hazardous waste streams require advanced recycling technology.Some chemicals cannot yet be purified for reuse at scale.Recycled materials must meet strict purity and reliability standards.Packaging redesign and bulk-delivery systems require supply-chain restructuring.Sustainability upgrades may increase short-term costs before long-term benefits appear.Lower resource consumption and reduced dependency on mined materialsReduced greenhouse-gas emissions across the production lifecycleLower long-term operating costs through recycling and efficiencyFaster compliance with tightening global environmental regulationsStronger brand trust, critical for companies supplying to climate-conscious industries
www.semiconductorforu.com | 25TECH SPOTLIGHTHANNOVER MESSE 202620 – 24 April 2026 Hannover, Germanyhannovermesse.comTHINK TECH FORWARDThe global meeting place for industrial transformationwhere innovative technology and responsibility convergeto shape the future of manufacturing.
Steel-Based Resistors Out-Power CeramicENGINEERING & DESIGN 16 | www.semiconductorforu.com By Barley Li, Applications Engineering Manager – Technical Content, APAC, DigiKey
ENGINEERING & DESIGNwww.semiconductorforu.com | 17Ceramic thick-film resistors, long a staple in electronic applications, rely on a brittle substrate that is vulnerable to cracking or delamination. Bourns, Inc. offers a steel-based alternative for applications that require high power, thermal efficiency, and mechanical robustness.Ceramic thick-film resistors are reliable until they crack or delaminate, especially as devices shrink and power densities rise. Board flex, vibration, or thermal cycling can undermine their performance and erode reliability, which can lead to latent failures in the field.Traditional ceramic thick-film resistors are cost-effective and widely available, but their brittle substrates make them less reliable in demanding environments. Stainless steel provides a rigid yet slightly compliant substrate that can absorb mechanical stress from board flex, vibration, and handling during assembly, reducing the risk of cracks or delamination. Thick film on steel (TFOS) resistors offer a mechanically robust, thermally efficient alternative for demanding high-stress designs where even small amounts of board flex, vibration, or thermal cycling can degrade ceramic-based resistors.Bourns introduced the first TFOS resistor, the TFOS30-1-150T (Figure 1), in mid-2025. TFOS yields components with exceptional thermal transfer, high power densities, and strong mechanical durability, making them suitable for demanding applications. Many power or high-energy circuits are constrained by how well a component can absorb, dissipate, and survive energy pulses without cracking, drifting, or failing prematurely.Steel substrates provide superior heat spreading, which improves power dissipation and enables higher power density in smaller footprints. A high-integrity dielectric layer is applied to the cleaned stainless-steel substrate to prevent electrical conduction through the steel. Figure 1: Featuring a stainless-steel substrate, Bourns' TFOS30-1-150T provides more reliability than thickfilm ceramic resistors. (Image source: Bourns, Inc.)By shifting power handling and ruggedness into the resistor, designers can reduce heatsinking, cut down on part count, and increase field reliability. Simply put, designers can pack more performance into less space without extra thermal hardware, according to Bourns.During TFOS component manufacture, thick film conductor and resistor patterns are applied to the dielectric layer using a screen-printing process. After each pass, the materials are solidified by firing in a high-temperature furnace to ensure adhesion and robust conductive and resistive paths. Finally, a protective overglaze layer is applied over the conductor and resistor for mechanical protection, environmental resistance, and electrical insulation to the underlying layers.TFOS resistors offer high power and pulse-handling capabilities in a compact, low-profile form factor to maintain performance margins under challenging conditions. This enables engineers to meet stringent reliability and thermal management requirements without compromising form factor. The TFOS30-1-150T is AEC-Q200 compliant for automotive-grade applications such as battery energy storage systems, motor drives, inverters, fuel cell vehicle sensor boards, and other applications where high power, thermal management, and mechanical robustness are essential. In an application note on utilizing the component in a fuel cell stack sensor board, Bourns highlights the TFOS's suitability for such applications due to its ability to handle high power densities. It can accommodate pre-charge and discharge circuits in fuel-cell vehicles and ensure efficient energy management even under variable frequency operations. Its low inductance and tight tolerance ensure accurate voltage, current, and temperature measurement within the fuel cell stack. Available in a 4.000 in. L x 2.756 in. W (101.60 mm x 70.00 mm) form factor, the TFOS30-1-150T offers customizable termination options including Premium design considerations
ENGINEERING & DESIGN18 | www.semiconductorforu.comsolder pads, push-on connectors, flying leads, and termination cables. Bourns says the flat, sturdy steel substrate can be manufactured in various shapes and sizes up to 406 mm x 406 mm to accommodate custom layouts, or be directly mounted to heat-spreading surfaces. Designers can also specify alter native ohmic values, resistance tolerances, and integration of multiple resistors. With a resistance value of 150 ohms and a tolerance of ±10%, it is optimized for precision. It boasts power ratings of 260 W when mounted on a heat sink, and up to 900 W with afan-cooled heat sink, making it suitable for applications requiring substantial energy dissipation. The TFOS30-1-150T operates over an extended temperature range of -55°C to +125°C, and according to Bourns, the TFOS can withstand extremely high element temperatures up to 350°C.TFOS isn’t a universal replacement for ceramic resistors, but it provides a strategic upgrade path when thermal margins are tight, reliability is paramount, or substrate fragility poses a risk. By rethinking the substrate, Bourns has turned a fundamental passive component into a more durable, thermally capable, and adaptable building block for modern electronics.Conclusion
INDUSTRY DIALOGS 20 | www.semiconductorforu.com“ADVANCED PACKAGING IS KEY TO INDIA’S AMBITION OF BECOMING A MAJOR PLAYER IN THE GLOBAL SEMICONDUCTOR ECOSYSTEM”In an insightful conversation between Semiconductor For You and Ram Trichur, Global Market & Strategy Head – Semiconductor Packaging at Henkel Adhesive Technologies, the discussion delves into global trends, innovations, and India’s growing semiconductor ambitions. With over two decades of industry experience spanning wafer fabs and electronics manufacturing, Ram shares how Henkel’s materials innovations and its new Chennai Applications Engineering Centre are empowering advanced packaging, driving reliability, and strengthening India’s position in the global semiconductor value chain.What global trends and challenges are currently shaping the semiconductor packaging industry, and how is Henkel addressing them?The semiconductor industry is at a pivotal point, driven by demand from multiple verticals such as automotive, data centers, and mobile applications. The key trends shaping packaging can be viewed through a couple of lenses: technology and geopolitics. On the technology side, AI/HPC, EV electrification, and new consumer devices are fueling packaging innovation. At the geopolitical level, localization and supply chain rebalancing are influencing where and how devices are manufactured. Henkel addresses these challenges with a broad packaging materials portfolio spanning wire bond to advanced packaging. We continue to invest in next-generation die attach and sintering materials for power electronics and in advanced materials—underfills, encapsulants, adhesives, and thermal solutions—to enable AI/HPC packaging. With a global innovation and manufacturing footprint across Asia and the West, Henkel is well-positioned to support customers’ localization needs while delivering cutting-edge technologies
INDUSTRY DIALOGSwww.semiconductorforu.com | 45RAM TRICHURGlobal Market & Strategy Head – Semiconductor PackagingHenkel Adhesive technologies
INDUSTRY DIALOGS 22 | www.semiconductorforu.com How do you see advanced packaging contributing to India’s ambition of becoming a global hub for semiconductor and electronics manufacturing?What role will Henkel’s newly launched Applications Engineering Centre in Chennai play in supporting India’s semiconductor ecosystem?Could you highlight Henkel’s latest innovations in packaging materials that are driving advancements in AI, 5G, IoT, automotive, and HPC?With increasing miniaturization and performance demands in chips, how is Henkel ensuring reliability, scalability, and long-term performance of its packaging solutions?Advanced packaging will be central to India’s long-term ambition of establishing itself as a key player in the global semiconductor value chain. While advanced packaging represents a strategic entry point for OSATs to build high-value capabilities, I believe India can capture short- to mid-term opportunities by scaling wire bond packaging capacity, especially for power devices and traditional wirebond packages. Both pathways align with India’s twin goals: building self-sufficiency while establishing itself as a global technology contributor in semiconductors.As India accelerates investment in electronics and semiconductor manufacturing, Henkel is strengthening our local commitment. The Chennai Applications Engineering Centre is designed to speed up the introduction of our products for consumer electronics and semiconductor customers in India. Equipped with state-of-the-art dispensing, testing, and material analysis systems, the center is staffed with engineers trained in both wire bond and advanced packaging applications. The team is well equipped to support emerging opportunities in India’s semiconductor manufacturing landscape.Beyond local expertise, the Chennai team is connected to Henkel’s global network of semiconductor labs and experts across Asia and worldwide, ensuring Indian customers benefit from both local responsiveness and global innovation. We are continuing our strong innovation investments in advanced packaging addressing AI and high-performance computing trends in datacenter and mobile markets. We predict large technology inflections in this market due to emergence of new computational methods, co-packaged optics, shifts in packaging processes from wafer-level to panel level and evolution of new substrate and interposer materials. Henkel is developing underfills, encapsulants, adhesives and thermal materials to address challenges in building next generation 2.5D/3D packages for end devices like cloud processors, high bandwidth memory, mobile application processors and client processors. We recently launched Loctite Eccobond LCM 1000AG-1, a new anhydride-free, ultra-low warpage liquid molding material designed for wafer-level packaging (WLP) and panel-level packaging (PLP) processes. This new product delivers stable warpage control throughout redistribution layer (RDL) processing, enabling high-yield, reliable advanced packaging solutions. While miniaturization is a continuing trend for mobile and handheld products, we continue to observe large die, and large body package as a key feature for AI/HPC based cloud and data center processors. Both of these end markets continue to demand uncompromising performance and reliability in all new product introductions. Henkel works closely with customers and partners to anticipate long-term packaging requirements. These insights shape our product roadmaps and guide investment in fundamental technology platforms and toolboxes. This approach allows us to deliver scalable, reliable solutions tailored to the evolving challenges of semiconductor packaging.
INDUSTRY DIALOGSwww.semiconductorforu.com | 23How does Henkel plan to align with India’s first OSAT Pilot Line initiative in Gujarat and similar government-led programs?In what ways is Henkel collaborating with global semiconductor manufacturers and designing houses to bridge chip design with real-world applications?What key solutions or technologies will Henkel showcase at Productronica 2025, and how do they reflect the company’s long-term vision for semiconductor packaging?Henkel has supplied packaging materials to the semiconductor industry for over 50 years, and we are proud to be contributing to India’s emerging ecosystem. Several OSATs and IDMs in Gujarat and beyond already use Henkel materials in their BOMs for processes being relocated from overseas.For customers engaged in new product development, our teams work hand-in-hand to identify pain points and opportunities for value creation. We also conduct on-site technology roadmap sessions and training programs to introduce advanced die attach and flip-chip solutions, ensuring our customers in India can scale successfully.We work closely with semiconductor firms (foundries, OSATs, design houses) to understand their roadmap, process limitations such as warpage, alignment, curing, thermal/stress constraints, and other challenges. From those learnings, we co‐create materials and process adaptations to help create value for our customers. As an example, our underfill solutions are tuned for advanced wafer node applications of mobile application processor packages. They are designed for very fast capillary flow to fill gaps reliably and reduce manufacturing defects but also help maximize operational efficiency and productivity, thereby balancing and delivering requirements for the fables as well as our OSAT customers.At Productronica 2025, Henkel highlighted its role as a trusted materials partner across both consumer electronics and semiconductors. For consumer devices, we showcased innovations in structural adhesives, encapsulants, and thermal management solutions that enhance performance and durability in smartphones, wearables, and accessories.On the semiconductor side, our portfolio spans wire bond packaging—including high thermal die attach pastes, sintering materials, and die attach films—and advanced packaging with underfills and encapsulants for AI/HPC.These solutions reflect Henkel’s strategic priorities: enabling high-power, high-reliability applications; advancing AI/HPC packaging; supporting regional manufacturing; and driving sustainability. Our roadmap is built to deliver on these commitments for the long term.
24 | www.semiconductorforu.com BLOG BEAT Non-contact temperature measurement delivers fast, hygienic, and reliable readings, but its accuracy can be disrupted by unpredictable environmental and internal heat sources. Managing these thermal disturbances is essential to ensuring stable, trustworthy performance across medical, industrial, wearable, and consumer applications.ELIMINATING THERMAL DISTURBANCES IN NON-CONTACT TEMPERATURE MEASUREMENT
www.semiconductorforu.com | 25BLOG BEAT
26 | www.semiconductorforu.com BLOG BEAT Non-contact temperature measurement has become a cornerstone of modern healthcare, wearables, industrial automation, and consumer electronics. Yet behind its convenience lies a persistent challenge: thermal disturbances that distort accuracy. These disturbances arise from environmental shifts, internal heat sources, and rapid thermal transitions. As devices shrink and integrate multiple components, the challenge intensifies. This article explores how non-contact temperature sensing works, why thermal disturbances occur, and how innovative design, compensation algorithms, and intelligent thermal management ensure stable and reliable temperature readings in real-world applications.The ability to measure temperature without touching an object has transformed the way we design modern devices. A simple wave of a hand under a smart dispenser, a quick scan across the forehead, or a subtle reading taken by a wearable—these are made possible by infrared-based, non-contact temperature measurement systems. They are fast, hygienic, and increasingly accurate, which explains their rapid rise in both consumer and industrial technologies.But the journey toward reliable non-contact measurement is far from straightforward. While contact sensors such as thermocouples or thermistors sit directly on the object they measure, infrared sensors must interpret the radiation emitted by a surface while simultaneously resisting influence from the world around them. A gentle breeze, a warm component inside a device, or the heat from a hand resting nearby can all distort the sensor’s internal temperature. When readings matter—especially in medical and safety-critical systems—these disturbances can be unacceptable.This tension between convenience and accuracy sets the stage for one of the most intriguing engineering challenges of our time: creating compact, intelligent systems that can measure temperature precisely, even in the presence of unpredictable environmental noise.Introduction: The Pursuit of Touch-Free PrecisionAlthough non-contact sensing may look effortless from the outside, the underlying physics is governed by fundamental thermodynamics. Every object emits infrared energy proportional to its temperature. An IR temperature sensor captures this radiation and converts it into an electrical signal. Essentially, the sensor compares the IR energy from the target with its own internal temperature to estimate an accurate reading. This process relies on a combination of an IR-sensitive element, a reference temperature sensor, and filtering and processing electronics that transform microvolt-level signals into meaningful information. The final temperature value is calculated using radiometric equations that relate thermal emission to absolute temperature. But this elegance comes with complexity. If the sensor’s own temperature changes suddenly—How Non-Contact Temperature Sensing Actually Works
www.semiconductorforu.com | 27BLOG BEATdue to airflow, sunlight, or proximity to an active electronic component—the delicate thermal balance shifts. The sensor no longer compares stable reference points, and the reading can drift. In worst cases, the error can be several degrees, which is unacceptable for body temperature measurements or sensitive industrial processes.Non-contact measurement depends not only on capturing radiation from the target but also on ensuring that the sensor itself remains thermally steady. And that is where things become tricky.Thermal disturbances are unavoidable in real environments. Imagine walking from an air-conditioned room into the sun, holding a smartphone that has been charging for an hour, or wearing a fitness tracker next to warm skin. In such situations, both the environment and the device heat up or cool down rapidly. A non-contact temperature sensor embedded inside the device will inevitably experience these changes.These disturbances can enter the system in several ways. The most obvious are external temperature shifts—moving between indoor and outdoor spaces, changes in airflow, or exposure to sunlight. But internal factors often matter even more. Microprocessors, radios, batteries, and charging circuits produce heat during normal operation, and this heat can migrate toward the sensor’s housing or substrate. In miniaturized devices, components are tightly packed, so thermal gradients spread faster and more intensely.Even the sensor’s own electronic activity can generate heat. Over time, this self-heating subtly shifts its internal temperature, affecting the reference against which IR radiation is interpreted. The result is drift: slow, creeping errors that accumulate as the device operates.Another subtle issue is parasitic radiation—infrared energy emitted not by the object being measured, but by the sensor housing itself or nearby surfaces. Because sensors respond to all IR within their field of view, this ambient emission becomes indistinguishable from the actual signal unless carefully controlled.The challenge isn’t that infrared sensors are inaccurate. It’s that they are exceptionally sensitive—to both useful and unwanted thermal inputs.The Hidden Enemy: Thermal Disturbances\"The true challenge in non-contact temperature sensing isn't detecting heat-it's separating the signal we want from the heat we don't\".
28 | www.semiconductorforu.com BLOG BEAT Modern electronics are shrinking at an incredible pace. We now expect sensors to fit inside earbuds, smart rings, disposable medical patches, and ultra-thin devices worn against the skin. This shrinking footprint introduces what might be called the “miniaturization paradox”: as sensors get smaller, they become both more capable and more vulnerable.A small sensor reacts quickly to IR radiation from the target, which is beneficial. But it also responds quickly to thermal disturbances, which is problematic. The reduced mass means there is little buffering against rapid temperature changes. Meanwhile, compact devices leave no room to physically isolate sensors from internal heat sources.Thus, the same trend that enables innovative products also demands new methods to ensure accurate thermal behavior.The Miniaturization ParadoxOver the past decade, engineers have developed numerous strategies to counteract thermal disturbances. These can be grouped into mechanical, electrical, and algorithmic methods. Instead of relying on large metal housings or bulky covers, modern designs incorporate more subtle, intelligent techniques.At the mechanical design level, careful placement of the sensor is often the first line of defense. By positioning it away from processors, batteries, and power regulators, engineers reduce the heat that can seep into the sensing element. Some devices include tiny thermal barriers or isolation slits in the PCB to slow heat transfer. Others use enclosures designed to shield the sensor from direct airflow while keeping the IR path clear.Electrical strategies play an equally important role. Internal reference temperature sensors monitor the sensor’s own thermal state, allowing the system to compensate for drift. Filtering and signal conditioning smooth out abrupt fluctuations. Multi-point factory calibration ensures that each unit behaves predictably across a range of ambient temperatures.But perhaps the most important innovations have come from intelligent compensation algorithms. Instead of trying to eliminate thermal disturbances physically—which is nearly impossible in compact devices—modern systems measure these disturbances and mathematically subtract their influence. Thermal models predict how the sensor body responds to environmental shifts. Dynamic compensation algorithms update the estimated temperature in real time, adjusting for gradients, drift, and transient effects. In some advanced cases, machine learning models are trained to recognize disturbance patterns unique to specific devices and environments, creating a tailored compensation strategy.This combination of thoughtful hardware design and smart algorithms allows non-contact temperature sensors to perform reliably even in challenging conditions.Engineering Solutions: Balancing Physics With Design
www.semiconductorforu.com | 29BLOG BEATDifferent industries place different demands on non-contact temperature systems, and thermal disturbances affect each in unique ways.In medical applications, where body temperature differences of even half a degree matter, sensors must deliver exceptional stability. A misreading caused by a warm breeze or rapid movement could affect diagnosis or screening. In such cases, aggressive compensation and rigorous testing across diverse scenarios are mandatory.Wearable devices face a different challenge. They operate in constantly changing environments: against human skin, exposed to outdoor temperatures, affected by motion, and influenced by sweat or humidity. A sensor must distinguish between the wearer’s body heat and surrounding conditions, often within a minimal footprint.Industrial systems require robustness above all. Sensors may monitor conveyor belts, electrical cabinets, or machinery where temperature fluctuations can signal safety issues. Here, the environment may be harsh—dusty, noisy, or high-temperature—so sensors must resist disturbances while providing data quickly and consistently.Even consumer electronics such as smartphones incorporate infrared sensors to monitor device safety, optimize charging, or improve user experience. These devices experience rapid heating during gaming, charging, or multitasking, making compensation essential.Across all these applications, one thing is clear: ignoring thermal disturbances is not an option.Application Realities: When Accuracy Matters Most\"As devices shrink and environments grow more dynamic, intelligent thermal management becomes the key to unlocking accuracy in touch-free temperature measurement.\"
30 | www.semiconductorforu.com BLOG BEAT As industries push toward smaller, more integrated devices, the next generation of non-contact temperature systems will rely even more on intelligent design. New materials promise better thermal isolation. Emerging sensor technologies offer faster response and lower power consumption. AI-driven compensation will become more common, teaching sensors to understand and correct disturbances unique to each user or environment.In short, the future of non-contact temperature measurement is not just about sensing heat—it is about understanding thermal behavior in complex, miniature worlds.Toward the Future: Smarter, Smaller, More ReliableNon-contact temperature measurement has evolved from a niche capability to a foundational tool across industries. Yet its biggest challenge—thermal disturbances—remains central to achieving precision. Whether caused by environmental shifts, internal heat sources, or the demands of miniaturized electronics, these disturbances can distort readings and reduce reliability.Fortunately, modern engineering has developed an impressive toolkit to counter them. Through clever mechanical design, intelligent internal monitoring, advanced compensation algorithms, and holistic system-level thinking, developers are now able to create small, fast, and accurate non-contact temperature sensing systems suited for real-world use.As technology continues its march toward miniaturization and smart integration, eliminating the influence of thermal disturbances will remain both a challenge and an opportunity—one that drives innovation at the heart of modern sensing.Conclusion
www.semiconductorforu.com | 53BLOG BEATHANNOVER MESSE 202620 – 24 April 2026 Hannover, Germanyhannovermesse.comTHINK TECH FORWARDThe global meeting place for industrial transformationwhere innovative technology and responsibility convergeto shape the future of manufacturing.
BLOG BEAT 32 | www.semiconductorforu.comPrintingMetal 3DRedefining Customization in Modern Medical ImplantsMetal 3D printing is transforming medical implants by enabling unprecedented personalization, anatomical precision, and biomechanical performance. This technology allows implants to be created directly from patient imaging, optimizing fit, durability, and biological integration. With advancements in materials, lattice structures, and process control, metal additive manufacturing is accelerating the shift toward safer, smarter, and more effective implants designed uniquely for each patient.
www.semiconductorforu.com | 33BLOG BEATMedical implants have long relied on standardized designs—uniform shapes and sizes intended to serve the widest possible range of patients. While effective in many cases, traditional implants often fall short when anatomy deviates from the norm or when surgical reconstructions demand unique geometries. Metal 3D printing, also known as metal additive manufacturing, is rapidly rewriting this story.Human anatomy is inherently variable. Bones differ in shape, density, curvature, and dimensions not just between individuals but also due to age, trauma, pathology, and genetic factors. Traditional implants may require surgeons to reshape bone to fit the implant—metal 3D printing reverses this approach. It allows implants to be shaped for the patient rather than forcing the patient to accommodate the implant.Benefits include:This personalized approach is especially valuable in complex orthopedic cases, trauma repair, tumor resection, cranial reconstruction, and spinal surgery where “one-size-fits-all” solutions often fall short.Improved precision: A custom implant fits seamlessly into the anatomical site.Reduced surgical time: Surgeons spend less time reshaping or adjusting bone.Lower complication rates: Better fit reduces micro-movement, loosening, and long-term failure.Enhanced patient comfort: Custom contours follow natural bone geometry.By building components layer by layer from digital models, metal 3D printing makes it possible to fabricate implants tailored precisely to a patient’s anatomy. Using scans from CT and MRI imaging, surgeons and engineers can collaborate to design implants that perfectly match bone contours, address deformities, and integrate with surrounding tissue. This level of customization is redefining the possibilities for clinical treatment.Why Customization MattersMetal 3D printing unlocks a new realm of design possibilities that traditional manufacturing cannot achieve. Engineers can integrate intricate internal structures, vary density, and create organic shapes inspired by nature.Design Freedom: The Power of GeometryOne of the most significant breakthroughs enabled by metal AM is the creation of internal lattices—geometric networks that:Reduce overall weightIncrease flexibilityImprove shock absorptionPromote bone in-growth (osseointegration)Lattice Structures
BLOG BEAT 34 | www.semiconductorforu.com Lattices can be tailored to match the mechanical properties of surrounding bone, minimizing stress shielding—a phenomenon where overly rigid implants transfer insufficient stress to bone tissue, leading to weakening over time.Metal 3D printing allows precise control over porosity, enabling surfaces and internal regions to be engineered for biological performance. Porous structures encourage:Since the printing process does not require tools, molds, or dies, implants can adopt complex and irregular geometries such as:Unlike coatings or post-processing treatments, porosity created through printing is intrinsic and highly stable.This opens doors to medical solutions previously impossible to produce.Bone cell migrationVascularizationFaster healingStronger long-term fixationCurved plates following skull or jaw contoursAnatomically correct vertebral replacementsCustomized joint surfacesReconstruction pieces for large bone defectsControlled PorosityComplex Organic ShapesMetal 3D printing typically employs biocompatible metals such as titanium alloys, cobalt-chrome, or stainless steel. Titanium is particularly favored due to its exceptional strength-to-weight ratio, corrosion resistance, and compatibility with human tissue.Material AdvantagesAdditive processes use only the material required to build the implant. This significantly reduces waste, which is especially beneficial for expensive medical-grade metals. Unlike machining, which cuts away large volumes of material, 3D printing only adds material where necessary.Properly controlled metal printing produces implants with strength comparable to—or in some cases superior to—traditionally manufactured components. Moreover, the ability to create gradients in density allows engineers to mimic the natural transitions between cortical and trabecular bone.Material EfficiencyMechanical Reliability
BLOG BEATwww.semiconductorforu.com | 35A key factor in implant success is how well it bonds with bone. Metal 3D printing enhances biological integration in several ways:Biological Integration and Healing BenefitsMetal 3D printing is making an impact across a wide range of medical disciplines:Applications Across Medical FieldsCustom implants for:Metal AM is invaluable for:Personalized cages and vertebral replacements improve stability and reduce the risk of implant migration or failure.These implants often require extremely precise anatomical matching, which 3D printing provides.Hip, knee, and shoulder reconstructionComplex fracture fixationLimb deformity correctionsLarge bone defect repairsSkull reconstructionJawbone restorationFacial asymmetry correctionTrauma repairOrthopedicsCranio-Maxillofacial SurgerySpine SurgerySurfaces can be printed with micro-roughness ideal for cell adhesion.Bone grows naturally into porous structures, increasing interface strength.By matching local stiffness to natural bone, printed implants reduce stress concentrations and improve long-term performance.Because design and material distribution can be controlled at the microscopic level, implants can be engineered not only to support the body but to actively encourage healing.Optimized Surface TexturesBuilt-in PorosityAdaptive Mechanical Behavior
36 | www.semiconductorforu.com BLOG BEAT Dental frameworks, abutments, and surgical guides benefit from the precision and custom contours achievable through metal AM.After tumor resection, irregular defects can be filled with perfectly matched implants designed from patient imaging.Dental Implants and ProstheticsTrauma and OncologyTechnological Developments Driving the FutureArtificial Intelligence is increasingly used to predict material behavior, determine optimal lattice configurations, reduce defects, and automate quality control. AI-based generative design tools can create biologically inspired structures stronger and lighter than human-designed equivalents.Combining additive manufacturing with machining or surface treatments allows implants to achieve high precision in critical areas while leveraging the geometric freedom of 3D printing.Future implants may include embedded channels, sensors, or battery-free monitoring systems. These could provide real-time data on load distribution, healing progress, or infection markers.Integration of AIHybrid ManufacturingSmart Implants\"Additive manufacturing doesn't just create implants-it creates possibilities. Every layer represents a step toward restoring mobility, function, & quality of life.\"
www.semiconductorforu.com | 37BLOG BEATChallenges to OvercomeConclusionRapid heating and cooling during printing can generate internal stresses, impacting performance. Heat treatments and controlled scanning sequences help mitigate this.While the benefits are compelling, several hurdles remain.Metal 3D printing is reshaping the medical implant landscape with its unmatched ability to create patient-specific solutions, complex internal structures, and biologically friendly surfaces. As advances in materials, AI-driven optimization, and process control continue, this technology will only accelerate the shift toward truly personalized medicine.From reconstructive surgery to joint replacement and beyond, metal additive manufacturing is not just an evolution of implant design—it is a revolution. It empowers clinicians with tools that were unimaginable just a decade ago, enabling safer surgeries, better outcomes, and implants that feel far more natural to the patient. Ultimately, it bridges engineering and biology in ways that promise a future where every implant is as unique as the person who needs it.Layer-by-layer building leads to direction-dependent properties. Optimizing the print orientation and parameters is crucial.Intended porosity must be balanced against the risk of unintended voids that weaken the structure.Each custom implant is unique, complicating approval processes. Regulatory bodies worldwide are developing new frameworks to address additive manufacturing.Metal 3D printing systems require specialized environments, highly trained operators, and rigorously controlled workflows.Residual StressesAnisotropyPorosity ControlRegulatory ComplexityCost and Equipment Requirements
ACCELERATING HIGH-SPEED NETWORK TEST FROM LAB TO FIELDAI, HPC, cloud expansion, and virtualization are pushing optical networks toward 1.6Tb/s and beyond, demanding precision testing from lab to field. VIAVI’s ONE LabPro ONE-1600 delivers next-gen scale, automation, and accuracy for ICs, pluggables, and switching systems. With advanced traffic analysis and unmatched bandwidth, it enables faster validation, reliable AI fabrics, and future-ready Ethernet performance.Emerging applications like AI, ML, high-performance computing (HPC), virtualization and quantum computing are driving bandwidth and scale at an accelerating rate, creating increasingly difficult challenges for manufacturers of chips, pluggables and network equipment’s. The need for high data rates in data ceters, essential for providing low-latency an high-throughput services, IoT, rapid expansion of cloud services, AI-driven infrastructure and many such applications are pushing higher optical networks to 1.6Tb/s and beyond. To address this, architects and developers need modern, sophisticated instrumentation to test at these higher speeds while maintaining accuracy, deployment and testing efficiency, and overall cost effectiveness. As AI networks continue to fuel ethernet demand, advanced, next-gen testing platform designed for challenges of speed and scale is essential for testing RoCEv2 (RMDAover Converged Ethernet networks v2) traffic and validate the performance and reliability of AI network fabrics.Perfect for high-speed module suppliers, ICPs, NEMs and service providers who work on highspeed Ethernet projects, ONE LabPro ONE-1600 supports manufacturers of Integrated Circuits (ICs), transceivers, and switching systems operating up to 1.6Tb/s with R&D, System Verification Testing (SVT), and live production and manufacturing testing.BY SHASHIKANTH MC, DIRECTOR-SALES, LAB & PRODUCTION, VIAVI“High-speed networks can scale only when testing keeps pace with innovation—ONE LabPro makes that acceleration practical, precise, and production-ready.”38 | www.semiconductorforu.com BLOG BEAT
The ONE LabPro ONE-1600 provides a highly advanced test platform for physical layer silicon fully aligned with emerging standards, the ability to test framed and unframed traffic, and enables support for high-bandwidth network switching devices at the heart of Ethernet fabric for AI at scale. Featuring the highest levels of port density and scalability in the market, ONE LabPro scales to 102Tb/s of test bandwidth such as 64 x 1.6Tb/s test ports using ONE-1600 modules or 128 x 800Gb/s test ports using HSE-800 modules, orchestrated by a single controller. The system can synchronize to sub-nanosecond mixed combinations of test modules, centrally managed by the controller, with full breakout capabilities,multi-user logical port support, and single-user per logical port granularity. With a contemporary, web-based user interface and next-generation, python-based automation framework, ONE LabPro enables advanced traffic generation and analysis to troubleshoot and test the functionality and performance of ICs, pluggable interfaces, switching and routing devices, and networks. VIAVI continues to advance stateof-the-art technology for testing next-generation network components to not only enable products to be delivered to market faster, but also to ensure peak performance throughout the network lifecycle.www.semiconductorforu.com | 39BLOG BEAT
40 | www.semiconductorforu.com BLOG BEAT POWER ATTHE EDGE:THE RISE OF DECENTRALIZED GRIDS
www.semiconductorforu.com | 41BLOG BEATThe global energy landscape is transforming as power grids shift from monolithic, centralized systems to flexible, localized networks. Fueled by renewable technologies, energy storage, and smarter control, decentralization promises greater resilience, efficiency, and consumer empowerment. Yet, this shift brings new technical and regulatory challenges. Understanding this evolution is key to navigating the future of energy.
42 | www.semiconductorforu.com BLOG BEAT From Central to Local: A Paradigm ShiftTraditionally, electrical power has flowed in one direction: from large, centralized generation facilities (like coal, gas, or nuclear plants) out to consumers. This model, while proven and scalable, is vulnerable to a number of risks: long transmission lines, single points of failure, and slow responsiveness to shifting local demand.Decentralized power grids, by contrast, push generation closer to the point of use. Here, homes, businesses, and communities are not just consumers but can also be prosumers, producing energy through solar panels or small wind turbines, storing it in batteries, and even trading it among themselves. This shift leverages distributed energy resources (DERs)—small-scale power generation or storage systems spread across the grid. 1Electricity systems are undergoing a radical transformation. The once-dominant model—giant power plants feeding distant cities through sprawling transmission lines—is giving way to a more distributed, locally rooted paradigm. This transition, often called “decentralization,” reflects shifting priorities: cleaner energy, resilience in the face of disruptions, and greater participation from consumers themselves.What's Driving the Change?Several major trends are fueling the decentralization of power:Falling Costs of RenewablesSolar panels and wind turbines are no longer niche technologies. As their costs decline, they become viable even at small scales, enabling households and businesses to generate electricity locally. Advances in Power ElectronicsInnovations in power conversion—like silicon carbide (SiC) inverters—have made local generation more efficient, reducing losses and enabling smaller, more reliable DER deployments. Energy Storage BreakthroughsBattery systems, especially advanced de1.4.5.2.3.signs like lithium-iron-phosphate (LFP), allow communities to store surplus renewable energy, smoothing supply and demand. Smart Control and Digital IntelligenceArtificial intelligence, distributed control algorithms, and edge computing are enabling microgrids to operate autonomously, respond to changing demand, and maintain grid stability. Regulatory & Market InnovationConcepts like virtual power plants (VPPs), transactive energy, and peer-to-peer trading are reshaping how electricity is bought, sold, and shared. 2
www.semiconductorforu.com | 43BLOG BEATKey Building Blocks of Decentralized GridsMicrogridsMicrogrids are localized energy systems capable of operating either in connection with the main grid or independently (“island mode”). They typically combine renewable generation, storage, and smart load management. JPT Their ability to self-sustain makes them especially valuable during central-grid outages, natural disasters, or other emergencies. Virtual Power Plants (VPPs)VPPs aggregate multiple DERs across a regionand coordinate them as if they were a single power plant. This pooled intelligence boosts grid stability, enables demand-response services, and optimizes energy dispatch. Decentralized Autonomous Substations (DAS)Innovative concepts propose transforming substations into autonomous nodes capable of local decision-making. Using blockchain-inspired architectures, these “substations of the future” could regulate power flow, match supply with demand, and even trade energy. 3Challenges on the Road AheadGrid StabilityDERs like rooftop solar are intermittent. Managing voltage and frequency across a network with many small players is more challenging than coordinating a few big power plants. While decentralization brings many benefits, it also introduces complexity and risk.Control & CoordinationCoordinating distributed resources requires sophisticated control strategies. Traditional droop control (a technique used in microgrids) has limitations, especially when communication between nodes is limited. 5The Upside: Why Decentralization Matters44.5.Resilience and ReliabilityDecentralized grids are inherently more robust. If one microgrid fails, others can continue to function independently. In an extreme event, having local generation means communities are less reliant on a central utility to restore power.Reduced LossesWhen power is generated close to where it’s used, transmission and transformation losses drop significantly, improving overall energy efficiency. Faster DeploymentBuilding a rooftop solar panel or a small wind turbine takes a fraction of the time compared to building a large power plant. 1.2.3.According to some analyses, distributed renewable installations can be brought online much faster. Democratization of EnergyDecentralized grids empower individuals and communities. They can generate their own electricity, manage their energy use, and even trade surplus power. This opens up the energy market to a broader set of participants. Environmental GainsBy supporting renewable generation and reducing reliance on fossil-fuel plants, decentralized systems contribute to decarbonization. They also align with global sustainability goals.
44 | www.semiconductorforu.com BLOG BEAT CybersecurityDecentralized systems often rely on digital communication, IoT devices, and peer-to-peer trading protocols. Securing these networks from cyberattacks is vital. Regulation & MarketsEnergy markets, policies, and pricing models need to evolve. Zonal pricing, transactive energyframeworks, and fair access rules for VPPs are still emerging. Investment & InfrastructureDeploying microgrids, storage systems, and smart controls requires capital. Ensuring that investment flows into the right places—and that the business models are sustainable—is a critical hurdle.Emerging Technologies Powering the Future63.4.Edge AI:Artificial intelligence deployed at the edge (close to generation or storage units) can optimize energy flows, predict demand, and reduce reliance on cloud communication.Blockchain / DLT:Decentralized ledger technologies can enable secure, transparent energy trading among prosumers without a central intermediary.1.2.Intelligent Inverters:Modern inverters not only convert DC to AC, but also help with grid stabilization by providing reactive power, voltage support, and dynamic control.Autonomous Substations:The concept of decentralized autonomous substations (DAS) introduces a peer-to-peer structure to traditional grid nodes.Real-World Applications & Case Studies73.4.Rural and Remote Communities: In regions where centralized grid infrastructure is weak or absent, mini-grids provide a powerful solution. These systems can be deployed faster and more cost-effectively than extending long-distance transmission lines. Urban Microgrids:Buildings equipped with solar, batteries, and smart controls are acting as “energy hubs”—feeding the local grid, storing energy, or selling surplus power back during peak times. 1.2.Transactive Energy Markets:Communities are experimenting with peerto-peer energy trading, using blockchain to enable secure, automated energy exchanges between neighbors.Virtual Power Plants:Aggregated DERs, managed through digital platforms, are being used to provide grid services like frequency regulation, peak shaving, and demand response.
www.semiconductorforu.com | 45BLOG BEATThe Future of Energy: Collaborative, Flexible, & LocalConclusionThe decentralization of power grids is not just a technical evolution—it’s a social and economic revolution. Energy is becoming more democratic: communities are no longer passive consumers but active participants. Microgrids, VPPs, and autonomous substations form a tapestry of local resilience, while advanced controls and smart markets weave them into a coordinated whole.The growing decentralization of power grids marks a new chapter in our energy story—one defined by resilience, flexibility, and democratization. While it brings technical and regulatory challenges, the benefits are profound. Decentralized systems offer a resilient buffer against outages, reduce transmission losses, empower communities, and accelerate the transition to renewables.In this future, grid failures won’t always mean darkness. Neighbourhoods with their own local generation and energy storage can ride out storms or cyber disruptions independently. Surplus solar power from one rooftop might flow to another building during peak hours. And energy markets may no longer be dominated by a few large utilities, but a dynamic network of prosumers trading clean energy peer-to-peer.As we move forward, collaboration between engineers, policymakers, companies, and citizens will be crucial. Together, they can build an energy ecosystem that’s not just greener, but smarter, fairer, and more adaptable. The future of electricity is not just about generating more power—it’s about reshaping how we produce, distribute, and own it.9Policy & Strategic Imperatives84.5.Regulatory Reform:Policymakers need to craft rules that support microgrid interconnection, peer-to-peer trading, and fair compensation for prosumers.Incentivising Investment:Grants, tax incentives, or public-private partnerships can help scale up decentralized infrastructure.Standards & Interoperability:Open standards for communication proto1.2.3.cols, inverters, and grid-control systems are critical so that different DER units can work together reliably.Cybersecurity Frameworks: As the grid digitizes, robust cybersecurity strategies must be integrated into every layer—from edge devices to cloud platforms.Capacity Building: Training engineers, operators, and communities to understand and manage decentralized systems is as important as deploying the hardware.To realize the full potential of decentralized grids, several strategic moves are essential:
BLOG BEAT 46 | www.semiconductorforu.com Singapore’s Largest District Cooling System Begins OperationsInside ST’s AMK TechnoPark DCS — a landmark step to- ward carbon neutrality and sustainable manufacturing infrastructure.As promised in 2022, the District Cooling System at ST’s Ang Mo Kio (AMK) TechnoPark is now operational and on time (see our original article below). Ms. Low Yen Ling, Senior Minister of State, Ministry of Trade and Industry & Ministry of Culture, Community and Youth, who joined ST in announcing this project in 2022, now took part in the inauguration ceremony. This launch is a critical milestone in our goal to achieve carbon neutrality by 2027, and to work with local partners while also serving our communities as we move toward this sustainability objective.Accordingly, the launch of our DSC is only one piece of our environmental strategy. On the heels of this successful operation, ST will now upgrade the cooling infrastructure of its Singapore Toa Payoh site, deploy 2,400 smart electricity meters to optimize resource management, and promote renewable energies by installing solar panels and EV charging stations at our plants. The SP Group, a local partner that has worked closely with ST on the DSC project, has also installed smart water meters to track inflow at five of ST’s buildings, giving us an unprecedented view of our water usage to maximize efficiency.
BLOG BEATwww.semiconductorforu.com | 47Composition of a District Cooling SystemOriginal publication, June 1, 2022Why a District Cooling System?The ST Ang Mo Kio (AMK) TechnoPark in Singapore will receive the country’s largest district cooling system (DCS), with a cooling capacity of up to 36,000 refrigerant tons. Estimated to be operational in 2025, the system will help reduce annual carbon emissions by up to 120,000 tons, or the equivalent of 109,090 fewer cars off the road, thanks to the installation of new PFC abatement machines. Indeed, the cooling infrastructure will enable the removal of existing chillers, which will then open spaces for many environmentally positive initiatives. In a DCS, one plant cools water before sending it to a network of underground pipes that serve various buildings. The system thus pools resources to increase efficiency, reduce environmental impacts, and save Hence, the 120,000 tons metric is simply an estimate of the project’s most direct impact but the district cooling system will have far wider ramifications.ST is working with the SP Group, Singapore’s national grid operator, whose team will build and manage the installation. The project is also SP’s first industrial DCS as the company has only led residential and commercial installations until now. Similarly, the ST AMK TechnoPark is ST’s first facility to benefit from DCS, thus further cementing our commitment to carbon neutrality by 2027.space. Buildings no longer need chillers, saving power and maintenance costs thanks to the central plant. Moreover, a loop sends the water back to the plant to cool it again. The main plant also stores water.
BLOG BEAT 48 | www.semiconductorforu.com Why the ST Ang Mo Kio TechnoPark?The AMK TechnoPark is ST’s largest wafer-production fab by volume. Bringing DCS to that particular site will thus have significant ripple effects. Traditionally, projects of this size target urban developments. For instance, the Deep Lake Water Cooling infrastructure in Toronto, Canada, has a similar capacity (40,000 tons), but the distribution network covers a chunk of the downtown area.The ST and SP Group infrastructure is thus unique because it’s one of the first at such a scale to cool an industrial manufacturing plant. It is also a first in the semiconductor industry. Most projects from competing fabs retrofit new chillers. With this new DCS, ST can re-purpose the space in favor of something much more efficient.Cooling therefore can happen during off-peak periods to improve the efficiency. ST’s Ang Mo Kio TechnoPark in SingaporeAccording to the Encyclopedia of Energy1, the first significant DCS project dates back to 1962 and was installed in the United States. The technology garnered some interest in the 70s before subsiding.DCS became popular again in the 90s as regulators mandated chlorofluorocarbons (CFC) reduction. And now, district cooling systems gain new grounds as the world looks to reduce carbon emissions and recycle water. ST is thus surfing on this new wave to meet its sustainability objectives and work with a local partner to advance this promising technology further.Anatomy of a Unique ProjectThe upcoming District Cooling System at ST’s AMK TechnoPark
BLOG BEATwww.semiconductorforu.com | 49The project will cost an estimated USD 370 million, including the construction of the central cooling plant right next to the TechnoPark. Beyond energy savings, removing chillers within the ST plant will free up space for other environmental programs. For instance, the AMK site is looking at water conservation and solar panels, among other things.The SP Group should start construction of the central plant this year and is committed to managing the project for at least the next 20 years. Singapore also hopes that this project will inspire other companies. As Ms Low Yen Ling, Minister of State, Ministry of Culture, Community and Youth & Ministry of Trade and Industry stated,Signatories to the agreement at the table, from left: S. Harsha (SP Group) and Bertrand Stoltz (ST). Witnesses standing behind, from left: Stanley Huang, Group CEO (SP Group), Ms. Low Yen Ling, Minister of State, Ministry of Culture, Community and Youth & Ministry of Trade and Industry, Ms. Rajita D’Souza, President, HR and CSR (ST), Yoshihiro Mineno, Member of the Board & Senior Executive Officer (Daikin)“I hope this initiative will inspire many more innovative decarbonization solutions across other industrial developments, and spur more companies to seek opportunities in sustainability.”
BUSINESS UNBOXED 50 | www.semiconductorforu.com Consumer Electronics Dip vs.Data Center Surge:A New Investment FocusA global slowdown in consumer electronics is reshaping revenue patterns, forcing manufacturers and investors to rethink growth priorities. At the same time, data centers are experiencing a historic boom, driven by AI, cloud computing, and digital infrastructure demand. This divergence is accelerating a strategic pivot: reduced investment in cyclical devices and increased capital allocation to long-term, capacity-driven data infrastructure.The global technology landscape is undergoing one of its most significant realignments in a decade. On one side is the consumer electronics sector, grappling with saturation, inflation-sensitive buyers, weakened upgrade cycles, and shrinking margins. On the other is the data center ecosystem, thriving at a pace unmatched in recent years as enterprises, governments, and hyperscalers pour billions into AI infrastructure, cloud expansion, storage, and high-performance computing.This contrast has created a rare moment in technology markets—a split where one segment contracts while the other accelerates dramatically. Investment strategies, supply-chain decisions, capital expenditure priorities, and product roadmaps are being fundamentally reshaped as companies respond to these divergent growth curves.The result is a wholesale rethinking of what defines the next era of tech-driven economic expansion.