MCP3008

MCP3004/3008

2.7V 4-Channel/8-Channel 10-Bit A/D Converters
with SPI™ Serial Interface

Features Description

• 10-bit resolution The Microchip Technology Inc. MCP3004/3008
• ± 1 LSB max DNL devices are successive approximation 10-bit Analog-
• ± 1 LSB max INL to-Digital (A/D) converters with on-board sample and
• 4 (MCP3004) or 8 (MCP3008) input channels hold circuitry. The MCP3004 is programmable to pro-
• Analog inputs programmable as single-ended or vide two pseudo-differential input pairs or four single-
ended inputs. The MCP3008 is programmable to pro-
pseudo-differential pairs vide four pseudo-differential input pairs or eight single-
• On-chip sample and hold ended inputs. Differential Nonlinearity (DNL) and Inte-
• SPI serial interface (modes 0,0 and 1,1) gral Nonlinearity (INL) are specified at ±1 LSB. Com-
• Single supply operation: 2.7V - 5.5V munication with the devices is accomplished using a
• 200 ksps max. sampling rate at VDD = 5V simple serial interface compatible with the SPI protocol.
• 75 ksps max. sampling rate at VDD = 2.7V The devices are capable of conversion rates of up to
• Low power CMOS technology 200 ksps. The MCP3004/3008 devices operate over a
• 5 nA typical standby current, 2 µA max. broad voltage range (2.7V - 5.5V). Low current design
• 500 µA max. active current at 5V permits operation with typical standby currents of only
• Industrial temp range: -40°C to +85°C 5 nA and typical active currents of 320 µA. The
• Available in PDIP, SOIC and TSSOP packages MCP3004 is offered in 14-pin PDIP, 150 mil SOIC and
TSSOP packages, while the MCP3008 is offered in 16-
Applications pin PDIP and SOIC packages.

• Sensor Interface Functional Block Diagram
• Process Control
• Data Acquisition VDD VSS
• Battery Operated Systems
VREF

Package Types CH0 Input DAC
CH1 Channel
PDIP, SOIC, TSSOP Comparator
CH7* Max 10-Bit SAR
Sample
CH0 1 MCP3004 14 VDD
CH1 2 13 VREF and
CH2 3 12 AGND Hold
CH3 4
5 11 CLK Control Logic Shift
NC 6 Register
NC 7 10 DOUT
DGND 9 DIN
8 CS/SHDN

CS/SHDN DIN CLK DOUT

PDIP, SOIC * Note: Channels 4-7 available on MCP3008 Only

CH0 1 MCP3008 16 VDD
CH1 2 15 VREF
CH2 3 14 AGND
CH3 4
CH4 5 13 CLK
CH5 6
CH6 7 12 DOUT
CH7 8 11 DIN
10 CS/SHDN
9 DGND

© 2007 Microchip Technology Inc. DS21295C-page 1

MCP3004/3008

1.0 ELECTRICAL PIN FUNCTION TABLE
CHARACTERISTICS
Name Function
Absolute Maximum Ratings*
VDD +2.7V to 5.5V Power Supply
VDD ........................................................................ 7.0V DGND Digital Ground
All inputs and outputs w.r.t. VSS .....-0.6V to VDD +0.6V AGND Analog Ground
Storage temperature ..........................-65°C to +150°C CH0-CH7 Analog Inputs
Ambient temp. with power applied .....-65°C to +125°C CLK Serial Clock
Soldering temperature of leads (10 seconds) .. +300°C DIN Serial Data In
ESD protection on all pins .................................. > 4 kV DOUT Serial Data Out
CS/SHDN Chip Select/Shutdown Input
*Notice: Stresses above those listed under "Maximum VREF Reference Voltage Input
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.

ELECTRICAL SPECIFICATIONS

Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V,
TAMB = -40°C to +85°C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for
VDD = 5V, TAMB = 25°C.

Parameter Sym Min Typ Max Units Conditions

Conversion Rate

Conversion Time tCONV — — 10 clock
cycles

Analog Input Sample Time tSAMPLE 1.5 clock
cycles

Throughput Rate fSAMPLE — — 200 ksps VDD = VREF = 5V
DC Accuracy
75 ksps VDD = VREF = 2.7V

Resolution 10 bits

Integral Nonlinearity INL — ±0.5 ±1 LSB

Differential Nonlinearity DNL — ±0.25 ±1 LSB No missing codes over
temperature

Offset Error — — ±1.5 LSB

Gain Error — — ±1.0 LSB

Dynamic Performance

Total Harmonic Distortion — -76 dB VIN = 0.1V to 4.9V@1 kHz
— 61 dB VIN = 0.1V to 4.9V@1 kHz
Signal to Noise and Distortion
(SINAD)

Spurious Free Dynamic Range — 78 dB VIN = 0.1V to 4.9V@1 kHz
Reference Input

Voltage Range 0.25 — VDD V Note 2

Current Drain — 100 150 µA

0.001 3 µA CS = VDD = 5V

Note 1: This parameter is established by characterization and not 100% tested.

2: See graphs that relate linearity performance to VREF levels.
3: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures. See Section 6.2, “Maintaining Minimum Clock Speed”,

for more information.

DS21295C-page 2 © 2007 Microchip Technology Inc.

MCP3004/3008

ELECTRICAL SPECIFICATIONS (CONTINUED)

Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V,
TAMB = -40°C to +85°C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for
VDD = 5V, TAMB = 25°C.

Parameter Sym Min Typ Max Units Conditions

Analog Inputs

Input Voltage Range for CH0 or VSS — VREF V
CH1 in Single-Ended Mode

Input Voltage Range for IN+ in IN- — VREF+IN-
pseudo-differential mode

Input Voltage Range for IN- in VSS-100 — VSS+100 mV
pseudo-differential mode

Leakage Current — 0.001 ±1 µA

Switch Resistance — 1000 — Ω See Figure 4-1

Sample Capacitor — 20 — pF See Figure 4-1

Digital Input/Output

Data Coding Format Straight Binary

High Level Input Voltage VIH 0.7 VDD — — V
Low Level Input Voltage VIL — 0.3 VDD
High Level Output Voltage VOH 4.1 — V
Low Level Output Voltage VOL — — —
Input Leakage Current ILI -10 — 0.4 V IOH = -1 mA, VDD = 4.5V
Output Leakage Current ILO -10 — 10 V IOL = 1 mA, VDD = 4.5V
Pin Capacitance CIN, — — 10 µA VIN = VSS or VDD
(All Inputs/Outputs) COUT 10 µA VOUT = VSS or VDD
pF VDD = 5.0V (Note 1)
Timing Parameters
TAMB = 25°C, f = 1 MHz

Clock Frequency fCLK — — 3.6 MHz VDD = 5V (Note 3)

1.35 MHz VDD = 2.7V (Note 3)

Clock High Time tHI 125 — — ns
Clock Low Time tLO 125 —
CS Fall To First Rising CLK Edge tSUCS 100 — — ns
CS Fall To Falling CLK Edge tCSD — —
Data Input Setup Time tSU — — — ns
Data Input Hold Time tHD — —
CLK Fall To Output Data Valid tDO — — 0 ns

CLK Fall To Output Enable tEN — — 50 ns

CS Rise To Output Disable tDIS — — 50 ns
CS Disable Time tCSH 270 —
DOUT Rise Time — — 125 ns VDD = 5V, See Figure 1-2
tR 200 ns VDD = 2.7V, See Figure 1-2
125 ns VDD = 5V, See Figure 1-2
200 ns VDD = 2.7V, See Figure 1-2
100 ns See Test Circuits, Figure 1-2

— ns

100 ns See Test Circuits, Figure 1-2
(Note 1)

DOUT Fall Time tF — — 100 ns See Test Circuits, Figure 1-2
(Note 1)

Note 1: This parameter is established by characterization and not 100% tested.

2: See graphs that relate linearity performance to VREF levels.
3: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures. See Section 6.2, “Maintaining Minimum Clock Speed”,

for more information.

© 2007 Microchip Technology Inc. DS21295C-page 3

MCP3004/3008

ELECTRICAL SPECIFICATIONS (CONTINUED)

Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V,
TAMB = -40°C to +85°C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for
VDD = 5V, TAMB = 25°C.

Parameter Sym Min Typ Max Units Conditions

Power Requirements

Operating Voltage VDD 2.7 — 5.5 V
Operating Current
IDD — 425 550 µA VDD = VREF = 5V,
Standby Current 225 DOUT unloaded
Temperature Ranges VDD = VREF = 2.7V,
IDDS — 0.005 2 DOUT unloaded

µA CS = VDD = 5.0V

Specified Temperature Range TA -40 — +85 °C

Operating Temperature Range TA -40 — +85 °C

Storage Temperature Range TA -65 — +150 °C

Thermal Package Resistance

Thermal Resistance, 14L-PDIP θJA — 70 — °C/W

Thermal Resistance, 14L-SOIC θJA — 108 — °C/W

Thermal Resistance, 14L-TSSOP θJA — 100 — °C/W

Thermal Resistance, 16L-PDIP θJA — 70 — °C/W

Thermal Resistance, 16L-SOIC θJA — 90 — °C/W

Note 1: This parameter is established by characterization and not 100% tested.

2: See graphs that relate linearity performance to VREF levels.
3: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures. See Section 6.2, “Maintaining Minimum Clock Speed”,

for more information.

TCSH

CS TSUCS THI TLO
CLK
DIN TSU THD
DOUT MSB IN

TEN TDO TR TF TDIS
MSB OUT LSB
NULL BIT

FIGURE 1-1: Serial Interface Timing.

DS21295C-page 4 © 2007 Microchip Technology Inc.

MCP3004/3008

1.4V Test Point

VDD

3 kΩ Test Point 3 kΩ VDD/2 tDIS Waveform 2
tEN Waveform
DOUT DOUT
tDIS Waveform 1
CL = 100 pF 100 pF
VSS

Voltage Waveforms for tR, tF Voltage Waveforms for tEN

DOUT VOH
VOL

tR tF CS
CLK
DOUT 123 4

Voltage Waveforms for tDO

CLK B9
DOUT tEN

tDO

Voltage Waveforms for tDIS

CS VIH

FIGURE 1-2: Load Circuit for tR, tF, tDO. DOUT 90%
Waveform 1*

TDIS

DOUT 10%
Waveform 2†

* Waveform 1 is for an output with internal
conditions such that the output is high,
unless disabled by the output control.

† Waveform 2 is for an output with internal
conditions such that the output is low,
unless disabled by the output control.

FIGURE 1-3: Load circuit for tDIS and tEN.

© 2007 Microchip Technology Inc. DS21295C-page 5

MCP3004/3008

2.0 TYPICAL PERFORMANCE CHARACTERISTICS

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.

1.0 1.0
0.8 0.8 VDD = VREF = 2.7 V
0.6
0.4 0.6
0.2
INL (LSB) 0.0 Positive INL INL (LSB) 0.4
-0.2 Negative INL 0.2 Positive INL
-0.4
-0.6 25 50 75 100 125 150 175 200 225 250 0.0
-0.8
-1.0 Sample Rate (ksps) -0.2 Negative INL
-0.4
0
-0.6

-0.8

-1.0 25 50 75 100
0

Sample Rate (ksps)

FIGURE 2-1: Integral Nonlinearity (INL) vs. FIGURE 2-4: Integral Nonlinearity (INL) vs.
Sample Rate. Sample Rate (VDD = 2.7V).

INL(LSB) 1.0 1.0INL(LSB)
0.8 0.8 VDD = VREF = 2.7 V
0.6 0.6 fSAMPLE = 75 ksps
0.4 Positive INL 0.4 Positive INL
0.2 0.2
0.0 0.0
-0.2 -0.2
-0.4 Negative INL -0.4 Negative INL
-0.6 -0.6
-0.8 -0.8
-1.0 -1.0

0123456 0.0 0.5 1.0 1.5 2.0 2.5 3.0

VREF (V) VREF (V)

FIGURE 2-2: Integral Nonlinearity (INL) vs. FIGURE 2-5: Integral Nonlinearity (INL) vs.
VREF. VREF (VDD = 2.7V).

0.5 0.5
0.4 VDD = VREF = 5 V 0.4 VDD = VREF = 2.7 V

fSAMPLE = 200 ksps fSAMPLE = 75 ksps
0.3 0.3

0.2 0.2

INL (LSB) 0.1 INL (LSB) 0.1

0.0 0.0

-0.1 -0.1

-0.2 -0.2

-0.3 -0.3

-0.4 -0.4

-0.5 128 256 384 512 640 768 896 1024 -0.5 128 256 384 512 640 768 896 1024
0 0

Digital Code Digital Code

FIGURE 2-3: Integral Nonlinearity (INL) vs. FIGURE 2-6: Integral Nonlinearity (INL) vs.
Code (Representative Part). Code (Representative Part, VDD = 2.7V).

DS21295C-page 6 © 2007 Microchip Technology Inc.

MCP3004/3008

Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.

0.6 0.6
VDD = VREF = 2.7 V
0.4 Positive INL
0.4 fSAMPLE = 75 ksps
Positive INL INL (LSB)
0.2 0.2

INL (LSB) 0.0 0.0
-0.2 Negative INL
-0.2
Negative INL -0.4

-0.4

-0.6 -25 0 25 50 75 100 -0.6 -25 0 25 50 75 100
-50 -50
Temperature (°C) Temperature (°C)

FIGURE 2-7: Integral Nonlinearity (INL) vs. FIGURE 2-10: Integral Nonlinearity (INL) vs.
Temperature. Temperature (VDD = 2.7V).

0.6 0.6
VDD = VREF = 2.7 V
0.4
0.4

DNL (LSB) 0.2 DNL (LSB) 0.2 Positive DNL
Positive DNL 0.0
-0.2 Negative DNL
0.0

-0.2 Negative DNL

-0.4 -0.4

-0.6 25 50 75 100 125 150 175 200 225 250 -0.6 25 50 75 100
0 0
Sample Rate (ksps) Sample Rate (ksps)

FIGURE 2-8: Differential Nonlinearity (DNL) FIGURE 2-11: Differential Nonlinearity (DNL)
vs. Sample Rate. vs. Sample Rate (VDD = 2.7V).

1.0 0.8
0.8
0.6 0.6 VDD = VREF = 2.7 V
0.4 Positive DNL fSAMPLE = 75 ksps
0.2
DNL (LSB) 0.0 0.4 Positive DNL
-0.2
DNL (LSB) 0.2
Negative DNL
-0.4 0.0
-0.6
-0.8 -0.2 Negative DNL
-1.0 -0.4

012345 -0.6

VREF (V) -0.8

FIGURE 2-9: Differential Nonlinearity (DNL) -1.0
vs. VREF.
0.0 0.5 1.0 1.5 2.0 2.5 3.0

VREF(V)

FIGURE 2-12: Differential Nonlinearity (DNL)
vs. VREF (VDD = 2.7V).

© 2007 Microchip Technology Inc. DS21295C-page 7

MCP3004/3008

Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.

1.0 1.0

0.8 VDD = VREF = 5 V 0.8 VDD = VREF = 2.7 V
fSAMPLE = 200 ksps fSAMPLE = 75 ksps

0.6 0.6

DNL (LSB) 0.4 DNL (LSB) 0.4

0.2 0.2

0.0 0.0

-0.2 -0.2

-0.4 -0.4

-0.6 -0.6

-0.8 -0.8

-1.0 128 256 384 512 640 768 896 1024 -1.0 128 256 384 512 640 768 896 1024
0 0

Digital Code Digital Code

FIGURE 2-13: Differential Nonlinearity (DNL) FIGURE 2-16: Differential Nonlinearity (DNL)
vs. Code (Representative Part). vs. Code (Representative Part, VDD = 2.7V).

0.6 0.6
VDD = VREF = 2.7 V
0.4
Positive DNL 0.4 fSAMPLE = 75 ksps

DNL (LSB) 0.2 DNL (LSB) 0.2 Positive DNL

0.0 0.0
Negative DNL
-0.2
Negative DNL -0.2

-0.4 -0.4

-0.6 -25 0 25 50 75 100 -0.6 -25 0 25 50 75 100
-50 -50
Temperature (°C) Temperature (°C)

FIGURE 2-14: Differential Nonlinearity (DNL) FIGURE 2-17: Differential Nonlinearity (DNL)
vs. Temperature. vs. Temperature (VDD = 2.7V).

2.0 8
1.5
1.0 VDD = 2.7 V 7
0.5 fSAMPLE = 75 ksps
Gain Error (LSB) 0.0 Offset Error (LSB) 6
-0.5 VDD = 5 V
-1.0 fSAMPLE = 200 ksps 5 VDD = 5 V
-1.5 fSAMPLE = 200 ksps
-2.0 123
4
0 VREF(V)
3 VDD = 2.7 V
2 fSAMPLE = 75 ksps

1

4 5 0 5
01234

VREF (V)

FIGURE 2-15: Gain Error vs. VREF. FIGURE 2-18: Offset Error vs. VREF.

DS21295C-page 8 © 2007 Microchip Technology Inc.

MCP3004/3008

Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.

Gain Error (LSB) 0.0 Offset Error (LSB) 1.2
-0.1 VDD = VREF = 2.7 V VDD = VREF = 5 V

fSAMPLE = 75 ksps 1.0 fSAMPLE = 200 ksps
-0.2
0.8
-0.3
0.6 VDD = VREF = 2.7 V
-0.4 fSAMPLE = 75 ksps
VDD = VREF = 5 V
0.4
-0.5 fSAMPLE = 200 ksps
0.2

-0.6 -25 0 25 50 75 100 0.0 -25 0 25 50 75 100
-50 -50
Temperature (°C) Temperature (°C)

FIGURE 2-19: Gain Error vs. Temperature. FIGURE 2-22: Offset Error vs. Temperature.

SNR (dB) 80 VDD = VREF = 5 V SINAD (dB) 80 VDD = VREF = 5 V
70 fSAMPLE = 200 ksps 70 fSAMPLE = 200 ksps
60 60
50 VDD = VREF = 2.7 V 50 VDD = VREF = 2.7 V
40 fSAMPLE = 75 ksps 40 fSAMPLE = 75 ksps
30 30
20 10 100 20 10 100
10 10
Input Frequency (kHz) Input Frequency (kHz)
0 0
1 1

FIGURE 2-20: Signal to Noise (SNR) vs. Input FIGURE 2-23: Signal to Noise and Distortion
Frequency. (SINAD) vs. Input Frequency.

THD (dB) 0 VDD = VREF = 2.7 V SINAD (dB) 70
-10 fSAMPLE = 75 ksps
-20 60
-30 VDD = VREF = 5 V
-40 fSAMPLE = 200 ksps 50 VDD = VREF = 5 V
-50 fSAMPLE = 200 ksps
-60 10 100 -5 0
-70 40
-80 Input Frequency (kHz)
-90 30
-100
20 VDD = VREF = 2.7 V
1 fSAMPLE = 75 ksps

10

0
-40 -35 -30 -25 -20 -15 -10

Input Signal Level (dB)

FIGURE 2-21: Total Harmonic Distortion (THD) FIGURE 2-24: Signal to Noise and Distortion
vs. Input Frequency. (SINAD) vs. Input Signal Level.

© 2007 Microchip Technology Inc. DS21295C-page 9

MCP3004/3008

Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.

10.00 10.0
9.8
9.75 9.6 VDD = VREF = 5 V
9.50 9.4 fSAMPLE = 200 ksps
9.2
ENOB (rms) VDD = VREF = 2.7 V ENOB (rms) 9.0
fSAMPLE = 75 ksps 8.8
8.6
9.25 8.4 VDD = VREF = 2.7 V
8.2 fSAMPLE = 75 ksps
VDD = VREF = 5 V 8.0
fSAMPLE = 200 ksps 1 10

9.00 Input Frequency (kHz)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 100

VREF (V)

FIGURE 2-25: Effective Number of Bits (ENOB) FIGURE 2-28: Effective Number of Bits (ENOB)
vs. VREF. vs. Input Frequency.

100 VDD = VREF = 5 V Power Supply Rejection (dB) 0
90 fSAMPLE = 200 ksps VDD = VREF = 5 V
80
70 VDD = VREF = 2.7 V -10 fSAMPLE = 200 ksps
60 fSAMPLE = 75 ksps
50 -20
40
SFDR (dB) 30 -30
20
10 -40
0
1 -50

-60

10 100 -70 10 100 1000 10000
1
Input Frequency (kHz) Ripple Frequency (kHz)

FIGURE 2-26: Spurious Free Dynamic Range FIGURE 2-29: Power Supply Rejection (PSR)
(SFDR) vs. Input Frequency. vs. Ripple Frequency.

Amplitude (dB) 0 VDD = VREF = 5 V Amplitude (dB) 0 VDD = VREF = 2.7 V
-10 FSAMPLE = 200 ksps -10 fSAMPLE = 75 ksps
-20 FINPUT = 10.0097 kHz -20 fINPUT = 1.00708 kHz
-30 4096 points -30 4096 points
-40 -40
-50 20000 40000 60000 80000 100000 -50 5000 10000 15000 20000 25000 30000 35000
-60 -60
-70 -70 Frequency (Hz)
-80 -80
-90 -90
-100 -100
-110 -110
-120 -120
-130 -130

0 0

Frequency (Hz)

FIGURE 2-27: Frequency Spectrum of 10 kHz FIGURE 2-30: Frequency Spectrum of 1 kHz
Input (Representative Part). Input (Representative Part, VDD = 2.7V).

DS21295C-page 10 © 2007 Microchip Technology Inc.

MCP3004/3008

Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.

550IDD (µA) 550IDD (µA)
500 500
450 450
400 400
350 350
300 300
250 250
200 200
150 VREF = VDD 150 VREF = VDD
100 All points at fCLK = 3.6 MHz except 100 All points at fCLK = 3.6 MHz except

50 at VREF = VDD = 2.5 V, fCLK = 1.35 MHz 50 at VREF = VDD = 2.5 V, fCLK = 1.35 MHz
0 0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

VDD (V) VDD (V)

FIGURE 2-31: IDD vs. VDD. FIGURE 2-34: IREF vs. VDD.

IDD (µA) 500 VDD = VREF = 5 V IREF (µA) 120 VDD = VREF = 5 V
450 VDD = VREF = 2.7 V 110
400 10000 100 VDD = VREF = 2.7 V 10000
350 100 1000
300 90 100 1000
250 Clock Frequency (kHz) 80
200 70 Clock Frequency (kHz)
150 60
100 50
40
50 30
0 20
10 10

0
10

FIGURE 2-32: IDD vs. Clock Frequency. FIGURE 2-35: IREF vs. Clock Frequency.

550

500 VDD = VREF = 5 V 140 VDD = VREF = 5 V
450 fCLK = 3.6 MHz 120 fCLK = 3.6 MHz
100
400 VDD = VREF = 2.7 V
80 fCLK = 1.35 MHz
IDD (µA) 350 60
40 -25 0 25 50
300 IREF (µA) 20
Temperature (°C)
250 0
-50
200

150
100 VDD = VREF = 2.7 V

50 fCLK = 1.35 MHz

0 -25 0 25 50 75 100 75 100
-50

Temperature (°C)

FIGURE 2-33: IDD vs. Temperature. FIGURE 2-36: IREF vs. Temperature.

© 2007 Microchip Technology Inc. DS21295C-page 11

MCP3004/3008

Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.

70 Analog Input Leakage (nA) 2.0
VREF = CS = VDD 1.8 VDD = VREF = 5 V

60 1.6
50
40 1.4
30
20IDDS (pA) 1.2
10
1.0
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.8

VDD (V) 0.6

FIGURE 2-37: IDDS vs. VDD. 0.4

100.00 0.2
VDD = VREF = CS = 5 V
0.0 -25 0 25 50 75 100
10.00 -50
Temperature (°C)

FIGURE 2-39: Analog Input Leakage Current
vs. Temperature.

IDDS (nA) 1.00

0.10

0.01 -25 0 25 50 75 100
-50
Temperature (°C)

FIGURE 2-38: IDDS vs. Temperature.

DS21295C-page 12 © 2007 Microchip Technology Inc.

3.0 PIN DESCRIPTIONS MCP3004/3008

TABLE 3-1: PIN FUNCTION TABLE 4.0 DEVICE OPERATION
Function
Name The MCP3004/3008 A/D converters employ a conven-
+2.7V to 5.5V Power Supply tional SAR architecture. With this architecture, a sam-
VDD Digital Ground ple is acquired on an internal sample/hold capacitor for
DGND Analog Ground 1.5 clock cycles starting on the first rising edge of the
AGND Analog Inputs serial clock once CS has been pulled low. Following
CH0-CH7 Serial Clock this sample time, the device uses the collected charge
CLK Serial Data In on the internal sample and hold capacitor to produce a
DIN Serial Data Out serial 10-bit digital output code. Conversion rates of
DOUT Chip Select/Shutdown Input 100 ksps are possible on the MCP3004/3008. See
CS/SHDN Reference Voltage Input Section 6.2, “Maintaining Minimum Clock Speed”, for
VREF information on minimum clock rates. Communication
with the device is accomplished using a 4-wire SPI-
3.1 DGND compatible interface.

Digital ground connection to internal digital circuitry. 4.1 Analog Inputs

3.2 AGND The MCP3004/3008 devices offer the choice of using
the analog input channels configured as single-ended
Analog ground connection to internal analog circuitry. inputs or pseudo-differential pairs. The MCP3004 can
be configured to provide two pseudo-differential input
3.3 CH0 - CH7 pairs or four single-ended inputs. The MCP3008 can be
configured to provide four pseudo-differential input
Analog inputs for channels 0 - 7, respectively, for the pairs or eight single-ended inputs. Configuration is
multiplexed inputs. Each pair of channels can be pro- done as part of the serial command before each con-
grammed to be used as two independent channels in version begins. When used in the pseudo-differential
single-ended mode or as a single pseudo-differential mode, each channel pair (i.e., CH0 and CH1, CH2 and
input where one channel is IN+ and one channel is IN. CH3 etc.) are programmed as the IN+ and IN- inputs as
See Section 4.1, “Analog Inputs”, and Section 5.0, part of the command string transmitted to the device.
“Serial Communication”, for information on The IN+ input can range from IN- to (VREF + IN-). The
programming the channel configuration. IN- input is limited to ±100 mV from the VSS rail. The IN-
input can be used to cancel small signal common-
3.4 Serial Clock (CLK) mode noise, which is present on both the IN+ and IN-
inputs.
The SPI clock pin is used to initiate a conversion and
clock out each bit of the conversion as it takes place. When operating in the pseudo-differential mode, if the
See Section 6.2, “Maintaining Minimum Clock Speed”, voltage level of IN+ is equal to or less than IN-, the
for constraints on clock speed. resultant code will be 000h. If the voltage at IN+ is
equal to or greater than {[VREF + (IN-)] - 1 LSB}, then
3.5 Serial Data Input (DIN) the output code will be 3FFh. If the voltage level at IN-
is more than 1 LSB below VSS, the voltage level at the
The SPI port serial data input pin is used to load IN+ input will have to go below VSS to see the 000h
channel configuration data into the device. output code. Conversely, if IN- is more than 1 LSB
above VSS, the 3FFh code will not be seen unless the
3.6 Serial Data Output (DOUT) IN+ input level goes above VREF level.
For the A/D converter to meet specification, the charge
The SPI serial data output pin is used to shift out the holding capacitor (CSAMPLE) must be given enough
results of the A/D conversion. Data will always change time to acquire a 10-bit accurate voltage level during
on the falling edge of each clock as the conversion the 1.5 clock cycle sampling period. The analog input
takes place. model is shown in Figure 4-1.

3.7 Chip Select/Shutdown (CS/SHDN) This diagram illustrates that the source impedance (RS)
adds to the internal sampling switch (RSS) impedance,
The CS/SHDN pin is used to initiate communication directly affecting the time that is required to charge the
with the device when pulled low. When pulled high, it capacitor (CSAMPLE). Consequently, larger source
will end a conversion and put the device in low power impedances increase the offset, gain and integral lin-
standby. The CS/SHDN pin must be pulled high earity errors of the conversion (see Figure 4-2).
between conversions.
DS21295C-page 13
© 2007 Microchip Technology Inc.

MCP3004/3008

4.2 Reference Input EQUATION

For each device in the family, the reference input Digital Output Code = 1----0---2---4----×-----V----I--N-
(VREF) determines the analog input voltage range. As VREF
the reference input is reduced, the LSB size is reduced
accordingly. VIN = analog input voltage
VREF = reference voltage
EQUATION
When using an external voltage reference device, the
LSB Size = -V---R----E---F- system designer should always refer to the manufac-
1024 turer’s recommendations for circuit layout. Any instabil-
ity in the operation of the reference device will have a
The theoretical digital output code produced by the A/D direct effect on the operation of the A/D converter.
converter is a function of the analog input signal and the
reference input, as shown below.

RSS CHx VDD Sampling
VA VT = 0.6V Switch
SS RS = 1 kΩ
CPIN VT = 0.6V ILEAKAGE
7 pF ±1 nA CSAMPLE
= DAC capacitance
= 20 pF

VSS

Legend ILEAKAGE = Leakage Current At The Pin

VA = Signal Source Due To Various Junctions

RSS = Source Impedance SS = sampling switch
CHx = Input Channel Pad RS = sampling switch resistor
CPIN = Input Pin Capacitance CSAMPLE = sample/hold capacitance

VT = Threshold Voltage

FIGURE 4-1: Analog Input Model.

Clock Frequency (Mhz) 4
VDD = VREF = 5 V
fSAMPLE = 200 ksps

3

2

1 VDD = VREF = 2.7 V 10000
fSAMPLE = 75 ksps
0
100 1000

Input Resistance (Ohms)

FIGURE 4-2: Maximum Clock Frequency vs.

Input resistance (RS) to maintain less than a
0.1 LSB deviation in INL from nominal

conditions.

DS21295C-page 14 © 2007 Microchip Technology Inc.

MCP3004/3008

5.0 SERIAL COMMUNICATION TABLE 5-1: CONFIGURE BITS FOR THE
MCP3004
Communication with the MCP3004/3008 devices is
accomplished using a standard SPI-compatible serial Control Bit
interface. Initiating communication with either device is
done by bringing the CS line low (see Figure 5-1). If the Selections Input Channel
device was powered up with the CS pin low, it must be
brought high and back low to initiate communication. Single/ Configuration Selection
The first clock received with CS low and DIN high will Diff
constitute a start bit. The SGL/DIFF bit follows the start D2* D1 D0
bit and will determine if the conversion will be done
using single-ended or differential input mode. The next 1 X 0 0 single-ended CH0
three bits (D0, D1 and D2) are used to select the input
channel configuration. Table 5-1 and Table 5-2 show 1 X 0 1 single-ended CH1
the configuration bits for the MCP3004 and MCP3008,
respectively. The device will begin to sample the ana- 1 X 1 0 single-ended CH2
log input on the fourth rising edge of the clock after the
start bit has been received. The sample period will end 1 X 1 1 single-ended CH3
on the falling edge of the fifth clock following the start
bit. 0 X 0 0 differential CH0 = IN+
Once the D0 bit is input, one more clock is required to CH1 = IN-
complete the sample and hold period (DIN is a “don’t
care” for this clock). On the falling edge of the next 0 X 0 1 differential CH0 = IN-
clock, the device will output a low null bit. The next 10 CH1 = IN+
clocks will output the result of the conversion with MSB
first, as shown in Figure 5-1. Data is always output from 0 X 1 0 differential CH2 = IN+
the device on the falling edge of the clock. If all 10 data CH3 = IN-
bits have been transmitted and the device continues to
receive clocks while the CS is held low, the device will 0 X 1 1 differential CH2 = IN-
output the conversion result LSB first, as is shown in CH3 = IN+
Figure 5-2. If more clocks are provided to the device
while CS is still low (after the LSB first data has been * D2 is “don’t care” for MCP3004
transmitted), the device will clock out zeros indefinitely.
If necessary, it is possible to bring CS low and clock in TABLE 5-2: CONFIGURE BITS FOR THE
leading zeros on the DIN line before the start bit. This is MCP3008
often done when dealing with microcontroller-based
SPI ports that must send 8 bits at a time. Refer to Control Bit Input Channel
Section 6.1, “Using the MCP3004/3008 with Microcon- Selections Configuration Selection
troller (MCU) SPI Ports”, for more details on using the
MCP3004/3008 devices with hardware SPI ports. Single D2 D1 D0
/Diff
© 2007 Microchip Technology Inc.
1 0 0 0 single-ended CH0
1 0 0 1 single-ended CH1
1 0 1 0 single-ended CH2
1 0 1 1 single-ended CH3
1 1 0 0 single-ended CH4
1 1 0 1 single-ended CH5
1 1 1 0 single-ended CH6

1 1 1 1 single-ended CH7

0 0 0 0 differential CH0 = IN+
CH1 = IN-

0 0 0 1 differential CH0 = IN-
CH1 = IN+

0 0 1 0 differential CH2 = IN+
CH3 = IN-

0 0 1 1 differential CH2 = IN-
CH3 = IN+

0 1 0 0 differential CH4 = IN+
CH5 = IN-

0 1 0 1 differential CH4 = IN-
CH5 = IN+

0 1 1 0 differential CH6 = IN+
CH7 = IN-

0 1 1 1 differential CH6 = IN-
CH7 = IN+

DS21295C-page 15

MCP3004/3008

tCYC tCYC

tCSH

CS tSUCS
CLK

DIN Start D2 D1 D0 Don’t Care Start D2
DOUT
SGL/ SGL/
DIFF DIFF

HI-Z Null B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 * HI-Z
Bit

tSAMPLE tCONV tDATA **

* After completing the data transfer, if further clocks are applied with CS low, the A/D converter will output LSB
first data, then followed with zeros indefinitely. See Figure 5-2 below.

** tDATA: during this time, the bias current and the comparator powers down while the reference input becomes
a high impedance node.

FIGURE 5-1: Communication with the MCP3004 or MCP3008.

tCYC

CS tCSH
CLK
tSUCS Power Down

DIN Start Don’t Care
DOUT D2 D1 D0

SGL/
DIFF

HI-Z Null B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9* HI-Z
Bit

(MSB)

tSAMPLE tCONV tDATA **

* After completing the data transfer, if further clocks are applied with CS low, the A/D converter will output zeros
indefinitely.

** tDATA: During this time, the bias circuit and the comparator powers down while the reference input becomes
a high impedance node, leaving the CLK running to clock out LSB first data or zeroes.

FIGURE 5-2: Communication with MCP3004 or MCP3008 in LSB First Format.

DS21295C-page 16 © 2007 Microchip Technology Inc.

MCP3004/3008

6.0 APPLICATIONS INFORMATION

6.1 Using the MCP3004/3008 with
Microcontroller (MCU) SPI Ports

With most microcontroller SPI ports, it is required to
send groups of eight bits. It is also required that the
microcontroller SPI port be configured to clock out data
on the falling edge of clock and latch data in on the ris-
ing edge. Because communication with the MCP3004/
3008 devices may not need multiples of eight clocks, it
will be necessary to provide more clocks than are
required. This is usually done by sending ‘leading
zeros’ before the start bit. As an example, Figure 6-1
and Figure 6-2 shows how the MCP3004/3008 can be
interfaced to a MCU with a hardware SPI port.
Figure 6-1 depicts the operation shown in SPI Mode
0,0, which requires that the SCLK from the MCU idles
in the ‘low’ state, while Figure 6-2 shows the similar
case of SPI Mode 1,1, where the clock idles in the ‘high’
state.

As is shown in Figure 6-1, the first byte transmitted to
the A/D converter contains seven leading zeros before
the start bit. Arranging the leading zeros this way
induces the 10 data bits to fall in positions easily manip-
ulated by the MCU. The MSB is clocked out of the A/D
converter on the falling edge of clock number 14. Once
the second eight clocks have been sent to the device,
the MCU receive buffer will contain five unknown bits
(the output is at high impedance for the first two
clocks), the null bit and the highest order 2 bits of the
conversion. Once the third byte has been sent to the
device, the receive register will contain the lowest order
eight bits of the conversion results. Employing this
method ensures simpler manipulation of the converted
data.

Figure 6-2 shows the same thing in SPI Mode 1,1,
which requires that the clock idles in the high state. As
with mode 0,0, the A/D converter outputs data on the
falling edge of the clock and the MCU latches data from
the A/D converter in on the rising edge of the clock.

© 2007 Microchip Technology Inc. DS21295C-page 17

MCP3004/3008

CS MCU latches data from A/D 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
SCLK converter on rising edges of SCLK Don’t Care

DIN 1 234 56 7

Data is clocked out of
A/D converter on falling edges

Start SGL/ D2 D1 DO
DIFF

DOUT HI-Z NULL B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
BIT

MCU Transmitted Data Start
Bit
(Aligned with falling
edge of clock) 0 0 0 0 00 01 SGL/ D2 D1 DO X X XX XXXXX XXX
DIFF B7 B6 B5 B4 B3 B2 B1 B0

MCU Received Data

(Aligned with rising ? ? ? ? ? ? ? ? ? ? ? ? ? 0 B9 B8
edge of clock) (Null)

X = “Don’t Care” Bits Data stored into MCU receive Data stored into MCU receive Data stored into MCU receive
register after transmission of first register after transmission of register after transmission of last
8 bits second 8 bits 8 bits

FIGURE 6-1: SPI Communication with the MCP3004/3008 using 8-bit segments (Mode 0,0: SCLK idles low).

CS MCU latches data from A/D converter
SCLK on rising edges of SCLK

DIN 1234567 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Don’t Care
Data is clocked out of A/D
converter on falling edges

Start SGL/ D2 D1 DO
DIFF

DOUT HI-Z NULL B7 B6 B5 B4 B3 B2 B1 B0
BIT B9 B8
XXXXX XXX
MCU Transmitted Data Start
Bit B7 B6 B5 B4 B3 B2 B1 B0
(Aligned with falling
00 0 0 00 0 1 SGL/ D2 D1 DO X X X X Data stored into MCU receive
edge of clock) DIFF register after transmission of last
8 bits
MCU Received Data ? ? ? ? ? 0 B9 B8
(Aligned with rising ? ? ? ? ? ? ? ? (Null)
edge of clock)
Data stored into MCU receive
Data stored into MCU receive register after transmission of
register after transmission of first second 8 bits
X = “Don’t Care” Bits 8 bits

FIGURE 6-2: SPI Communication with the MCP3004/3008 using 8-bit segments (Mode 1,1: SCLK idles high).

DS21295C-page 18 © 2007 Microchip Technology Inc.

MCP3004/3008

6.2 Maintaining Minimum Clock 4.096V 1 µF VDD
Speed Reference 10 µF
0.1 µF
When the MCP3004/3008 initiates the sample period, 1 µF
charge is stored on the sample capacitor. When the MCP1541
sample period is complete, the device converts one bit
for each clock that is received. It is important for the R1 C1 MCP601 IN+ VREF
user to note that a slow clock rate will allow charge to VIN MCP3004
bleed off the sample capacitor while the conversion is +
taking place. At 85°C (worst case condition), the part R2 - IN-
will maintain proper charge on the sample capacitor for C2
at least 1.2 ms after the sample period has ended. This R3R4
means that the time between the end of the sample
period and the time that all 10 data bits have been FIGURE 6-3: The MCP601 Operational
clocked out must not exceed 1.2 ms (effective clock Amplifier is used to implement a second order
frequency of 10 kHz). Failure to meet this criterion may anti-aliasing filter for the signal being converted
introduce linearity errors into the conversion outside by the MCP3004.
the rated specifications. It should be noted that during
the entire conversion cycle, the A/D converter does not 6.4 Layout Considerations
require a constant clock speed or duty cycle, as long as
all timing specifications are met. When laying out a printed circuit board for use with
analog components, care should be taken to reduce
6.3 Buffering/Filtering the Analog noise wherever possible. A bypass capacitor should
Inputs always be used with this device and should be placed
as close as possible to the device pin. A bypass capac-
If the signal source for the A/D converter is not a low itor value of 1 µF is recommended.
impedance source, it will have to be buffered or inaccu-
rate conversion results may occur (see Figure 4-2). It is Digital and analog traces should be separated as much
also recommended that a filter be used to eliminate any as possible on the board, with no traces running under-
signals that may be aliased back in to the conversion neath the device or bypass capacitor. Extra precau-
results, as is illustrated in Figure 6-3, where an op amp tions should be taken to keep traces with high
is used to drive, filter and gain the analog input of the frequency signals (such as clock lines) as far as possi-
MCP3004/3008. This amplifier provides a low imped- ble from analog traces.
ance source for the converter input, plus a low pass
filter, which eliminates unwanted high frequency noise. Use of an analog ground plane is recommended in
order to keep the ground potential the same for all
Low pass (anti-aliasing) filters can be designed using devices on the board. Providing VDD connections to
Microchip’s free interactive FilterLab™ software. Filter- devices in a “star” configuration can also reduce noise
Lab will calculate capacitor and resistors values, as by eliminating return current paths and associated
well as determine the number of poles that are required errors (see Figure 6-4). For more information on layout
for the application. For more information on filtering sig- tips when using A/D converters, refer to AN688, “Lay-
nals, see AN699, “Anti-Aliasing Analog Filters for Data out Tips for 12-Bit A/D Converter Applications”.
Acquisition Systems”.
VDD
Connection

Device 1 Device 4

Device 3

Device 2

FIGURE 6-4: VDD traces arranged in a ‘Star’
configuration in order to reduce errors caused by

current return paths.

© 2007 Microchip Technology Inc. DS21295C-page 19

MCP3004/3008

6.5 Utilizing the Digital and Analog
Ground Pins

The MCP3004/3008 devices provide both digital and
analog ground connections to provide additional
means of noise reduction. As is shown in Figure 6-5,
the analog and digital circuitry is separated internal to
the device. This reduces noise from the digital portion
of the device being coupled into the analog portion of
the device. The two grounds are connected internally
through the substrate which has a resistance of 5 -10Ω.

If no ground plane is utilized, both grounds must be
connected to VSS on the board. If a ground plane is
available, both digital and analog ground pins should
be connected to the analog ground plane. If both an
analog and a digital ground plane are available, both
the digital and the analog ground pins should be con-
nected to the analog ground plane. Following these
steps will reduce the amount of digital noise from the
rest of the board being coupled into the A/D converter.

VDD

MCP3004/08

Digital Side Analog Side

-SPI Interface -Sample Cap
-Shift Register -Capacitor Array
-Control Logic -Comparator

Substrate

5 - 10Ω

DGND AGND

0.1 µF

Analog Ground Plane

FIGURE 6-5: Separation of Analog and Digital
Ground Pins.

DS21295C-page 20 © 2007 Microchip Technology Inc.

7.0 PACKAGING INFORMATION MCP3004/3008

7.1 Package Marking Information Example:
MCP3004-I/P e3
14-Lead PDIP (300 mil) 0712027
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX Example:
YYWWNNN MCP3004ISL e3

14-Lead SOIC (150 mil) XXXXXXXXXXX
0712027
XXXXXXXXXXX
XXXXXXXXXXX Example:
3004 e3
YYWWNNN 0712
027
14-Lead TSSOP (4.4mm) *

XXXXXXXX
YYWW
NNN

Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
e3 Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3)
* can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available characters
for customer-specific information.

© 2007 Microchip Technology Inc. DS21295C-page 21

MCP3004/3008 Example:
MCP3008-I/P e3
Package Marking Information (Continued) 0712030

16-Lead PDIP (300 mil) (MCP3308) Example:

XXXXXXXXXXXXXX MCP3008-I/SL e3
XXXXXXXXXXXXXX XXXXXXXXXX

YYWWNNN 0712030

16-Lead SOIC (150 mil) (MCP3308)

XXXXXXXXXXXXX
XXXXXXXXXXXXX

YYWWNNN

DS21295C-page 22 © 2007 Microchip Technology Inc.

MCP3004/3008

14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

N

NOTE 1 E1

123
D

E

A A2

L c
A1 eB

b1
be

Units INCHES

Dimension Limits MIN NOM MAX

Number of Pins N 14

Pitch e .100 BSC

Top to Seating Plane A– – .210

Molded Package Thickness A2 .115 .130 .195

Base to Seating Plane A1 .015 – –

Shoulder to Shoulder Width E .290 .310 .325

Molded Package Width E1 .240 .250 .280

Overall Length D .735 .750 .775

Tip to Seating Plane L .115 .130 .150

Lead Thickness c .008 .010 .015

Upper Lead Width b1 .045 .060 .070

Lower Lead Width b .014 .018 .022

Overall Row Spacing § eB – – .430

Notes:

1. Pin 1 visual index feature may vary, but must be located with the hatched area.

2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-005B

© 2007 Microchip Technology Inc. DS21295C-page 23

MCP3004/3008

14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D
N

E
E1

NOTE 1 123 e h
A b A2 φ
α
h c

A1 L
L1 β

Units MILLMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 14

Pitch e 1.27 BSC

Overall Height A– – 1.75

Molded Package Thickness A2 1.25 – –

Standoff § A1 0.10 – 0.25

Overall Width E 6.00 BSC

Molded Package Width E1 3.90 BSC

Overall Length D 8.65 BSC

Chamfer (optional) h 0.25 – 0.50

Foot Length L 0.40 – 1.27

Footprint L1 1.04 REF

Foot Angle φ 0° – 8°

Lead Thickness c 0.17 – 0.25

Lead Width b 0.31 – 0.51

Mold Draft Angle Top α 5° – 15°

Mold Draft Angle Bottom β 5° – 15°

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-065B

DS21295C-page 24 © 2007 Microchip Technology Inc.

MCP3004/3008

14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D
N

E
E1

NOTE 1 12 e
A b
c
A2 φ

A1 L1 L

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 14

Pitch e 0.65 BSC

Overall Height A– – 1.20

Molded Package Thickness A2 0.80 1.00 1.05

Standoff A1 0.05 – 0.15

Overall Width E 6.40 BSC

Molded Package Width E1 4.30 4.40 4.50

Molded Package Length D 4.90 5.00 5.10

Foot Length L 0.45 0.60 0.75

Footprint L1 1.00 REF

Foot Angle φ 0° – 8°

Lead Thickness c 0.09 – 0.20

Lead Width b 0.19 – 0.30

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-087B

© 2007 Microchip Technology Inc. DS21295C-page 25

MCP3004/3008

16-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

N E1
NOTE 1

12 3

D

E

A A2

Lc

A1 b1 e eB
b

Units INCHES

Dimension Limits MIN NOM MAX

Number of Pins N 16

Pitch e .100 BSC

Top to Seating Plane A– – .210

Molded Package Thickness A2 .115 .130 .195

Base to Seating Plane A1 .015 – –

Shoulder to Shoulder Width E .290 .310 .325

Molded Package Width E1 .240 .250 .280

Overall Length D .735 .755 .775

Tip to Seating Plane L .115 .130 .150

Lead Thickness c .008 .010 .015

Upper Lead Width b1 .045 .060 .070

Lower Lead Width b .014 .018 .022

Overall Row Spacing § eB – – .430

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-017B

DS21295C-page 26 © 2007 Microchip Technology Inc.

MCP3004/3008

16-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D
N

E
E1

NOTE 1

1 23 e
b

α h
A2 φ
h

c

A

A1 β L
L1

Units MILLMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 16

Pitch e 1.27 BSC

Overall Height A– – 1.75

Molded Package Thickness A2 1.25 – –

Standoff § A1 0.10 – 0.25

Overall Width E 6.00 BSC

Molded Package Width E1 3.90 BSC

Overall Length D 9.90 BSC

Chamfer (optional) h 0.25 – 0.50

Foot Length L 0.40 – 1.27

Footprint L1 1.04 REF

Foot Angle φ 0° – 8°

Lead Thickness c 0.17 – 0.25

Lead Width b 0.31 – 0.51

Mold Draft Angle Top α 5° – 15°

Mold Draft Angle Bottom β 5° – 15°

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-108B

© 2007 Microchip Technology Inc. DS21295C-page 27

MCP3004/3008

NOTES:

DS21295C-page 28 © 2007 Microchip Technology Inc.

MCP3004/3008

APPENDIX A: REVISION HISTORY

Revision C (January 2007)
This revision includes updates to the packaging
diagrams.

© 2007 Microchip Technology Inc. DS21295C-page 29

MCP3004/3008

NOTES:

DS21295C-page 30 © 2007 Microchip Technology Inc.

MCP3004/3008

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X /XX Examples:

Device Temperature Package a) MCP3004-I/P: Industrial Temperature, PDIP
Range package.

Device: MCP3004: 4-Channel 10-Bit Serial A/D Converter b) MCP3004-I/SL: Industrial Temperature,
MCP3004T: 4-Channel 10-Bit Serial A/D Converter SOIC package.
(Tape and Reel)
MCP3008: 8-Channel 10-Bit Serial A/D Converter c) MCP3004-I/ST: Industrial Temperature,
MCP3008T: 8-Channel 10-Bit Serial A/D Converter TSSOP package.
(Tape and Reel)
d) MCP3004T-I/ST: Industrial Temperature,
Temperature Range: I = -40°C to +85°C TSSOP package, Tape and Reel.

Package: P = Plastic DIP (300 mil Body), 14-lead, 16-lead a) MCP3008-I/P: Industrial Temperature, PDIP
SL = Plastic SOIC (150 mil Body), 14-lead, 16-lead package.
ST = Plastic TSSOP (4.4mm), 14-lead
b) MCP3008-I/SL: Industrial Temperature,
SOIC package.

© 2007 Microchip Technology Inc. DS21295C-page 31

MCP3004/3008

NOTES:

DS21295C-page 32 © 2007 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device Trademarks
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to The Microchip name and logo, the Microchip logo, Accuron,
ensure that your application meets with your specifications. dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
MICROCHIP MAKES NO REPRESENTATIONS OR PRO MATE, PowerSmart, rfPIC, and SmartShunt are
WARRANTIES OF ANY KIND WHETHER EXPRESS OR registered trademarks of Microchip Technology Incorporated
IMPLIED, WRITTEN OR ORAL, STATUTORY OR in the U.S.A. and other countries.
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION, AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
QUALITY, PERFORMANCE, MERCHANTABILITY OR SEEVAL, SmartSensor and The Embedded Control Solutions
FITNESS FOR PURPOSE. Microchip disclaims all liability Company are registered trademarks of Microchip Technology
arising from this information and its use. Use of Microchip Incorporated in the U.S.A.
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and Analog-for-the-Digital Age, Application Maestro, CodeGuard,
hold harmless Microchip from any and all damages, claims, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
suits, or expenses resulting from such use. No licenses are ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
conveyed, implicitly or otherwise, under any Microchip In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
intellectual property rights. Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.

SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
MCUs and dsPIC DSCs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.

© 2007 Microchip Technology Inc. DS21295C-page 33

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DS21295C-page 34 12/08/06
© 2007 Microchip Technology Inc.