IPC-A-610 Revision H – September 2020 Supersedes Revision G October 2017 Acceptability of Electronic Assemblies Developed by 29 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
The Principles of Standardization In May 1995 the IPC’s Technical Activities Executive Committee (TAEC) adopted Principles of Standardization as a guiding principle of IPC’s standardization efforts. Standards Should: • Show relationship to Design for Manufacturability (DFM) and Design for the Environment (DFE) • Minimize time to market • Contain simple (simplified) language • Just include spec information • Focus on end product performance • Include a feedback system on use and problems for future improvement Standards Should Not: • Inhibit innovation • Increase time-to-market • Keep people out • Increase cycle time • Tell you how to make something • Contain anything that cannot be defended with data Notice IPC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of IPC from manufacturing or selling products not conforming to such Standards and Publication, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than IPC members, whether the standard is to be used either domestically or internationally. Recommended Standards and Publications are adopted by IPC without regard to whether their adoption may involve patents on articles, materials, or processes. By such action, IPC does not assume any liability to any patent owner, nor do they assume any obligation whatever to parties adopting the Recommended Standard or Publication. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement. IPC Position Statement on Specification Revision Change It is the position of IPC’s Technical Activities Executive Committee that the use and implementation of IPC publications is voluntary and is part of a relationship entered into by customer and supplier. When an IPC publication is updated and a new revision is published, it is the opinion of the TAEC that the use of the new revision as part of an existing relationship is not automatic unless required by the contract. The TAEC recommends the use of the latest revision. Adopted October 6, 1998 Why is there a charge for this document? Your purchase of this document contributes to the ongoing development of new and updated industry standards and publications. Standards allow manufacturers, customers, and suppliers to understand one another better. Standards allow manufacturers greater efficiencies when they can set up their processes to meet industry standards, allowing them to offer their customers lower costs. IPC spends hundreds of thousands of dollars annually to support IPC’s volunteers in the standards and publications development process. There are many rounds of drafts sent out for review and the committees spend hundreds of hours in review and development. IPC’s staff attends and participates in committee activities, typesets and circulates document drafts, and follows all necessary procedures to qualify for ANSI approval. IPC’s membership dues have been kept low to allow as many companies as possible to participate. Therefore, the standards and publications revenue is necessary to complement dues revenue. The price schedule offers a 50% discount to IPC members. If your company buys IPC standards and publications, why not take advantage of this and the many other benefits of IPC membership as well? For more information on membership in IPC, please visit www.ipc.org or call 847/597-2809. Thank you for your continued support. ©Copyright 2020. IPC International, Bannockburn, Illinois, USA. All rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States. Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`
IPC-A-610H Acceptability of Electronic Assemblies Developed by the IPC-A-610 Task Group (7-31b), IPC-A-610 Task Group – Europe (7-31b-EU) and IPC-A-610 Task Group – China (7-31b-CN) of the Product Assurance Committee (7-30) of IPC Users of this publication are encouraged to participate in the development of future revisions. Contact: IPC 3000 Lakeside Drive, Suite 105N Bannockburn, Illinois 60015-1249 Tel 847 615.7100 Fax 847 615.7105 Supersedes: IPC-A-610G - October 2017 IPC-A-610F WAM1 - February 2016 IPC-A-610F - July 2014 IPC-A-610E - April 2010 IPC-A-610D - February 2005 IPC-A-610C - January 2000 IPC-A-610B - December 1994 IPC-A-610A - March 1990 IPC-A-610 - August 1983 If a conflict occurs between the English language and translated versions of this document, the English version will take precedence. ® Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
IPC-A610 ADOPTION NOTICE IPC-A610, "Acceptability of Electronic Assemblies", was adopted on 12-FEB-02 for use by the Department of Defense (DoD). Proposed changes by DoD activities must be submitted to the DoD Adopting Activity: Commander, US Army Tank-Automotive and Armaments Command, ATTN: AMSTA-TR-E/IE, Warren, MI 48397-5000. Copies of this document may be purchased from the The Institute for Interconnecting and Packaging Electronic Circuits, 2215 Sanders Rd, Suite 200 South, Northbrook, IL 60062. http://www.ipc.org/ ___________________ Custodians: Adopting Activity: Army - AT (Project SOLD-0060) Army - AT Navy - AS Air Force - 11 Reviewer Activities: Army - AV, MI AREA SOLD DISTRIBUTION STATEMENT A: Approved for public release; distribution is unlimited. Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Any document involving a complex technology draws material from a vast number of sources across many continents. While the principal members of the IPC-A-610 Task Group (7-31b), IPC-A-610 Task Group – Europe (7-31b-EU) and IPC-A-610 Task Group – China (7-31b-CN) of the Product Assurance Committee (7-30) are shown below, it is not possible to include all of those who assisted in the evolution of this Standard. To each of them, the members of IPC extend their gratitude. Product Assurance Committee Chair Robert Cooke NASA Johnson Space Center Vice Chair Debbie Wade Advanced Rework Technology Ltd. - A.R.T. Technical Liaison of the IPC Board of Directors Bob Neves Microtek (Changzhou) Laboratories IPC-A-610 Task Group (7-31b) Co-Chairs Robert P. Fornefeld STI Electronics, Inc. Symon Franklin Custom Interconnect Ltd. Tiberiu Baranyi Flextronics Romania SRL Vice Chairs Ekaterina Stees Lockheed Martin Missiles & Fire Control Melby Thelakkaden General Dynamics Mission Systems IPC-A-610 Task Group – Europe (7-31b-EU) Chair Debbie Wade Advanced Rework Technology – A.R.T. IPC-A-610 Task Group – China (7-31b-CN) Co-Chairs Charlie Zhao Shenzhen Megmeet Electrical Co., Ltd. Ming Geng Jiangsu Simand Elevctronic Co., Ltd. Vice Chair Yabing Zou The Fifth Electronics Research Institute of Ministry of Industry and Information Technology Contributing Members of IPC-A-610 Task Group Jianfeng Ai Qiang Cai Gianluca Esposito Xiao Gang Xiaofeng Geng Warren Harper Bruce Hughes Kathy Johnston Evan Levy Junfeng Li Zhenxin Liu Randy McNutt Mary Muller Erik Quam Allen Thai Colin Wang Xiyu Zhang Chen Zhichao Richard Zyz Arye Grushka, A. A. Training Consulting and Trade A.G. Ltd. Neil Wolford, AbelConn, LLC Ross Dillman, ACI Technologies, Inc. Constantino Gonzalez, ACME Training & Consulting Yue Sun,** ACTRI AVIC Tony Ma,** Adlink Technology Inc. Pietro Vergine,* Advanced Rework Technology – A.R.T. John Vickers, Advanced Rework Technology – A.R.T. Debbie Wade,* Advanced Rework Technology – A.R.T. Brandy Tharp, AeroTEC Inc. Yanzhao Zhu,** Airbus (Tianjin)Final Assembly Line Company LTD. Fernando Perez Gracia,* Airbus Defence & Space Bradley Smith, Allegro MicroSystems Inc. Claus Molgaard,* ALPHA-elektronik A/S Eric Cao, Amazon.com Jing Cao,** Amazon Peter Fernandez, Amazon Lab126 Christopher Sewell, AMETEK Acknowledgment IPC-A-610H September 2020 iii Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Leo Huang, APCB Electronics (Thailand) Co., Ltd Samuel Platt, Aptiv Shanli Wang,** Askey Technology (Jiangsu) Co. Ltd. Rob Mullane,* Atek Training Services Ltd. Arvind Karthikeyan, Auburn University Yangchun Zhang, Automated Precision Inc. Marino Verderio,* Automotive Lighting SpA Jinquan Wang,** Avic Leihua Electronic Technology Research Institute Liang Jia,** AVIC TaiYuan Aero-Instruments Co., Ltd. Kang Ren,** AVIC Xi’an Aeronautics Computing Technique Research Institute Bingjin Liu,** AVICA CTRI Caroline Harris, Axis Electronics Ltd. Chris Jukes,* Axis Electronics Ltd. Erik Bjerke, BAE Systems Ana Contreras, BAE Systems Tim Gallagher, BAE Systems Greg Hurst, BAE Systems Joseph Kane, BAE Systems Maan Kokash, BAE Systems Kelly Kovalovsky, BAE Systems Andrew Leslie, BAE Systems Agnieszka Ozarowski, BAE Systems Brian Parliman, BAE Systems Marie Parliman, BAE Systems Marissa Pati, BAE Systems Darrell Sensing, BAE Systems Thomas Carle, Ball Aerospace & Technologies Corp Jonathon Vermillion, Ball Aerospace & Technologies Corp. Henry Xiao,** Bannsan Technology (Huizhou) Co., Ltd. Gerald Bogert, Bechtel Plant Machinery, Inc. Yang Zhao, Beijing Hangxing Technology Development Co. Glory Yin,** Beijing Hangxing Technologies Co., Ltd. Rebecca Zhao,** Beijing Hangxing Technologies Co., Ltd. JoAnn Newell, Benchmark Electronics Inc. James Barnhart, BEST Inc. Jodi Johnson, BEST Inc. Norman Mier, BEST Inc. Kris Roberson, BEST Inc. Dorothy Cornell, Blackfox Training Institute Samuel Sorto, Blue Origin, LLC David Lee, BMK Professional Electronics GmbH Eric Harenburg, Boeing Company Karl Mueller, Boeing Company Jerry Wittmann, Boston Scientific Neuromodulation Ruby Lei,** BrainPower Pierre Roge, CapQua Sarl Dawn Cabales, Carlisle Interconnect Technologies Vesna Delic, Carlisle Interconnect Technologies Russell Steiner, Casco Products Jason Keeping, Celestica International L.P. Xi Luo,** Changan Ford Automobile Co., Ltd. Jie Chen,** Chengdu Yaguang Electronics Co., Ltd. Ming Zhao,** Chengdu Xinshenghe Electronics Co., Ltd. Changqing Feng,** China Household Electric Appliance Research Institute Mingcheng Ma, China Printed Circuit Association-CPCA Steven Perng, Cisco Systems Inc. Robert Priore, Cisco Systems Inc. Sean Keating, Clonfert Solutions Ltd Richard Smith, Cobham Mission Equipment David Adams, Collins Aerospace William Cardinal, Collins Aerospace Caroline Ehlinger, Collins Aerospace David Hillman, Collins Aerospace Scott Meyer, Collins Aerospace Bonnie Pape, Collins Aerospace Douglas Pauls, Collins Aerospace Timothy Pearson, Collins Aerospace David Rafson, Collins Aerospace Tammy Sargent, Collins Aerospace Debie Vorwald, Collins Aerospace Dan White, Collins Aerospace Alan Sun,** CommScope Telecommunications (China) Co., Ltd. Andreas Gregor,* Consultronica, S.L. Alain Le Grand, Continental Automotive France SAS Hans-Otto Fickenscher, Continental Automotive GmbH Xiaofeng Geng,** Continental Automotive Interior(Wuhu) Co., Ltd. Manuel Tabarez, Continental Automotive Nogales S.A. de C.V. Stanton Rak, Continental Automotive Systems Miguel Dominguez, Continental Temic SA de CV Jose Servin Olivares, Continental Temic SA de CV Michael Meigh, Copper and Optic Terminations Elaine Chan,** CPCA Kathleen Kouthong, Crane Aerospace & Electronics Danqing Wen,** CSIC Xi’an DongYi Science Technology & Industry Group Co., Ltd. Robin Bridge, Curtiss-Wright Defense Solutions Acknowledgment (cont.) iv September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Symon Franklin,* Custom Interconnect Ltd Jacqueline Topple, Custom Interconnect Ltd David Barastegui, DBMTech Michael Peng,** DEKRA iST Reliability Service Inc. Dreamer Liu,** DEKRA IST Reliability Services Limited. Wallace Ables, Dell Inc. Stuart Longgood, Delphi Technologies Michael Pepples, Delphi Technologies Anitha Sinkfield, Delphi Technologies Patricia Skelton, Delphi Technologies Nicholas Castro, Delta Group Electronics Inc. Tod Cummins, Delta Group Electronics Inc. Irene Romero, Delta Group Electronics Inc. Brent Wyatt, Delta Group Electronics Inc James Sinclair, Dexta Moors LTD Cengiz Oztunc, DNZ Ltd. Zhang Yangchun, Dongguan Aiden Electronics Co. Ltd. Rich Wu,** Dongguan Molex Interconnect Co., Ltd. Timothy McFadden, EEI Manufacturing Services Emma Hudson, Emma Hudson Technical Consultancy Ltd Colin Wang,** Eolane (China) Co., Ltd. Melissa Holland, EPTAC Corporation Leo Lambert, EPTAC Corporation Marcia McLaughlin, EPTAC Corporation Helena Pasquito, EPTAC Corporation Ramon Essers, ETECH-trainingen Ramon Koch, ETECH-trainingen Iain McMillan, Exmel Solutions Ltd Joachim Schuett, FED e.V. Kai Ou,** Fiber Home Telecommunication Technologies Co., Ltd. Cylin Zhang,** Flextronics Electronics Technology (Suzhou) Co. Ltd. Tiberiu Baranyi,* Flextronics Romania SRL Sasha Andreas, Flight Critical S. Shashika Fernando, Flintec Transducers (Pvt) Ltd. Harald Olsen,* FMC Technologies AS Nancy Deng,** Ford Motor Research Engineering Co., Ltd Eric Camden, Foresite, Inc. Francisco Fourcade,* Fourcad, Inc Henrik Jensen,* Gaasdal Bygningsindustri A/S Melby Thelakkaden, General Dynamics Mission Systems Francesco Di Maio,* GESTLABS S.r.l. Antonio Perna,* GESTLABS S.r.l. Alejandro Cruz Voost, GPV Americas S.A.P. I de C.V. Jesper Djurhuus,* GPV Electronics A/S Lalith Bandara, GPV Lanka (Pvt) Ltd. Torben Kruse,* Grundfos Holding A/S Zhaochen Xu,** Guangzhou C-Sem Electronics Technology Co., Ltd. Svein Olav Kolbu,* Hapro AS David Sommervold, Henkel US Operations Corp. Thomas Lauer,* HENSOLDT Sensors GmbH Phil Befus, Honeywell Aerospace John Mastorides, Honeywell Aerospace Christina Rutherford, Honeywell Aerospace Keith Walker, Honeywell Aerospace Richard Rumas, Honeywell Canada Milea Kammer, Honeywell International Jeremy Lakoskey, Honeywell International Elizabeth Benedetto, HP Inc. Kristen Troxel, HP Inc. Jennie Hwang, H-Technologies Group Joe Hughes, Hughes Circuits, Inc. Jens Andersen,* HYTEK Alex Christensen,* HYTEK Poul Juul, HYTEK Jennifer Bennett, IBM Corporation Jonathan Albrieux,* IFTEC Jean-Luc Umbdenstock, IFTEC Mirko Giannecchini,* IIS Progress SRL Luca Moliterni,* IIS Progress SRL Gianluca Parodi,* IIS Progress SRL Khurrum Dhanji, Imagineering Inc. Robert Bowden, Impact Centre for Training & Staffing Stephen Langdon, Impact Centre for Training & Staffing Ana Ferrari Felippi, Instituto de Pesquisas Eldorado Ife Hsu, Intel Corporation Jagadeesh Radhakrishnan, Intel Corporation Jonathan WeiPing, Jabil Circuit Sdn. Bhd. Yusaku Kono, Japan Unix Co., Ltd. Toshiyasu Takei, Japan Unix Co., Ltd. Reza Ghaffarian, Jet Propulsion Laboratory Ming Geng,** Jiangsu Simand Electronic Co., Ltd. James Toth, Jim Toth Solutions, LLC Xiaozheng Wang, Jing-Jin Electric Technologies Co., Ltd. Robert Kinyanjui, John Deere Electronic Solutions Sonam Nikam, John Deere India Private Limited Salil Shaikh, John Deere India Private Limited Thomas Keily, JPS Composite Materials Corp. Vicki Hagen, Justice Electronic Training Services Acknowledgment (cont.) IPC-A-610H September 2020 v Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Kevin Boblits, K&M Manufacturing Solutions, LLC Mei Ming Khaw, Keysight Technologies Sue Powers-Hartman, Killdeer Mountain Manufacturing, Inc. Nancy Bullock-Ludwig, Kimball Electronics Eileen Xiang,** Kimball Electronics (Nanjing) Co., Ltd. Grunde Gjertsen,* Kitron AS Yanqi Chen,** Kunshan NTEK Testing Technology Co., Ltd. Augustin Stan,* L&G Advice Serv SRL Shelley Holt, L3Harris Communications Frederick Beltran, L3Harris Communications Jared Spencer, L3Harris Communications Keld Maaloee,* LEGO Systems A/S Jacky Chien,** Lite-On Technology Corporation Rebekah Kovarik, Lockheed Martin Chris Newton, Lockheed Martin Corporation Javier Caraccioli, Lockheed Martin Missiles & Fire Control Grayson Cook, Lockheed Martin Missiles & Fire Control James Erickson, Lockheed Martin Missiles & Fire Control Julian Finlaw, Lockheed Martin Missiles & Fire Control William Fox, Lockheed Martin Missiles & Fire Control Josh Goolsby, Lockheed Martin Missiles & Fire Control Ben Gumpert, Lockheed Martin Missiles & Fire Control Alafio Hewitt, Lockheed Martin Missiles & Fire Control Joshua Hudson, Lockheed Martin Missiles & Fire Control Sharissa Johns, Lockheed Martin Missiles & Fire Control Kyle Johnson, Lockheed Martin Missiles & Fire Control Vijay Kumar, Lockheed Martin Missiles & Fire Control Brian Llewellyn, Lockheed Martin Missiles & Fire Control Owen Reid, Lockheed Martin Missiles & Fire Control Ekaterina Stees, Lockheed Martin Missiles & Fire Control Ann Marie Tully, Lockheed Martin Missiles & Fire Control Jarrod Webb, Lockheed Martin Missiles & Fire Control Pamela Petcosky, Lockheed Martin Mission Systems & Training Tom Rovere, Lockheed Martin Mission Systems & Training David Mitchell, Lockheed Martin Rotary & Mission Systems Kimberly Shields, Lockheed Martin Rotary and Mission Systems Linda Woody, LWC Consulting Traian Cucu, MacDermid Alpha Electronics Solutions Mitchell Holtzer, MacDermid Alpha Electronics Solutions Karen Tellefsen, MacDermid Alpha Electronics Solutions Ann Thompson, Madison College Zhaochen Xu, Mastering Fuji Electronics Technology Ltd. Michael Durkan, Mentor Graphics Corporation Matt Garrett, Microsemi Yorkin Liu,** Meixin Testing Technology Co., Ltd. Yaqin Tang,** Meixin Testing Technology Co., Ltd. William Pfingston, Miraco, Inc. Daniel Foster, Missile Defense Agency Bill Kasprzak, Moog Inc. Edward Rios, Motorola Solutions Jungu Zhang,** Nanjing Future Mobility New Energy Vehicle Technology Development Co., Ltd. Alvin Boutte, NASA Goddard Space Flight Center Chris Fitzgerald, NASA Goddard Space Flight Center Robert Cooke, NASA Johnson Space Center James Blanche, NASA Marshall Space Flight Center Charles Gamble, NASA Marshall Space Flight Center Adam Gowan, NASA Marshall Space Flight Center Garry McGuire, NASA Marshall Space Flight Center Martin Wickham, National Physical Laboratory Zackary Fava, NAVAIR Kim Mason, Naval Surface Warfare Ctr William May, Naval Surface Warfare Ctr Daniel McCormick, Naval Surface Warfare Ctr Joseph Sherfick, Naval Surface Warfare Ctr Nicholas Walton, Naval Surface Warfare Ctr Johnny Lee,** Ningbo PrehJoyson Automotive Electronics Co. Ltd Darrin Dodson, Nokia Russell Nowland, Nokia Torgrim Nordhus,* Norautron AS Randy Bremner, Northrop Grumman Steven Davis, Northrop Grumman Stephanie Stork, Northrop Grumman Robert Cass, Northrop Grumman Amherst Systems Laura Landseadal, Northrop Grumman Corporation Adi Lang, Northrop Grumman Corporation Doris McGee, Northrop Grumman Corporation Mike Morris, Northrop Grumman Corporation Kaitlyn Skillman, Northrop Grumman Corporation Ryan Staffen, Northrop Grumman Corporation Carlo Viola, Northrop Grumman Corporation LaKia Williams, Northrop Grumman Corporation Luke Bycroft, Northrop Grumman Innovation Systems Daniel Morin, Northrop Grumman Innovation Systems Patrick Phillips, Northrop Grumman Innovation Systems Ceferino Reyes, Northrop Grumman Innovation Systems Mark Shireman, Northrop Grumman Innovation Systems Mahendra Gandhi, Northrop Grumman Space Systems Rene Martinez, Northrop Grumman Space Systems Acknowledgment (cont.) vi September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Callie Olague, Northrop Grumman Systems Corporation Chen Yanqi, NTEK Kunshan Testing Co., Ltd. William Graver, NTS - Baltimore Angela Pennington, NuWaves Engineering Joshua Huang, Nvidia Corporation Hoa Nguyen, OK International Ken Moore, Omni Training Corp. Toshiyuki Sugiyama, Omron Corporation-Inspection Systems Business Division Tristan Campbell, Out of the Box Manufacturing Gustavo Arredondo, PARA TECH Parylene Services Jose de Jesus Montanez Ortiz, Phoenix Industrial Supply Wim Bodelier, PIEK International Education Centre (I.E.C.) BV Ron Fonsaer, PIEK International Education Centre (I.E.C.) BV Frank Huijsmans, PIEK International Education Centre (I.E.C.) BV Rob Walls, PIEK International Education Centre (I.E.C.) BV Gene Dunn, Plexus Corporation Taylor Koenig, Plexus Corporation Waldner Saint-Fort, Plexus Corporation See Thao, Plexus Corporation Toby Stecher, Pole Zero Corporation Catherine Hanlin, Precision Manufacturing Company, Inc. Mike Lehmicke, Printed Circuits LLC Denis Boulanger, Raytheon Company Steven Corkery, Raytheon Company James Daggett, Raytheon Company Michael Jawitz, Raytheon Company David Magee, Raytheon Company Anthony Martinelli, Raytheon Company James Saunders, Raytheon Company Nenad Opijac, Raytheon Company Fonda Wu, Raytheon Company Matthew Abbott, Raytheon Missile Systems Lance Brack, Raytheon Missile Systems Maria Colon, Raytheon Missile Systems George Millman, Raytheon Missile Systems Nichole C. Thilges, Raytheon Missile Systems Paula Jackson, Raytheon UK Martin Scionti, Raytheon Vision Systems Michael Carano, RBP Chemical Technology, Inc. Pascal Dumontet,* RENAULT Marcin Sudomir,* Renex Electronics Education Center Rama Murthy, PBV Research Centre Imarat, DRDO, Ministry of Defence Gunter Gera, Robert Bosch GmbH Norbert Holle, Robert Bosch GmbH Patrick Leidich, Robert Bosch GmbH Theresia Richter, Robert Bosch GmbH Udo Welzel, Robert Bosch GmbH Gary Latta, SAIC Xingquan Dong,** SAIC Rodney Doss, Samtec, Inc. Jon Roberts, Sanmina Corporation Richard Henrick, SCI Technology, Inc. Hongzhou Zhou,** SCUD Battery Co., Ltd. Larisa Vishkovetsky, Seagate Technology Robert Jackson, Semi-Kinetics Michael Schleicher, Semikron Elektronik GmbH Co. KG Jie Yuan,** Shanghai Quickturn Electronics Co., Ltd. Xiaoying Chen,** Shanghai Railway Communication Co., Ltd. Jing Hou,** Shanghai Railway Communication Co., Ltd. Chengyan Cui,** Shenyang Railway Signal Co., Ltd. Jiong Dai,** Shenyang Railway Signal Co., Ltd. Bin Deng,** Shenzhen ASM Micro Electronic Technology, Ltd. James Wang,** Shenzhen H&T Intelligent Control Co. Ltd. Liu Suzhong,** Shenzhen Hengzhiyuan Technology Corporation Ltd Morton Song,** Shenzhen Kaifa (Guilin) Technology Co., Ltd. Jianfeng Ai,** Shenzhen Megmeet Electrical Co., Ltd. Navy Chen,** Shenzhen Megmeet Electrical Co., Ltd. Chen Shuibing, Shenzhen Megmeet Electrical Co., Ltd Harry Zhang,** Shenzhen Megmeet Electrical Co., Ltd. Charlie Zhao,** Shenzhen Megmeet Electrical Co., Ltd. Lin Xu,** ShenZhen Mindray Bio-Medical Electronics Co., LTD. Jan Kolsters, Signify Luis Garcia de la Cruz, Sinectech Training SAPI de C.V. Yangchun Zhang,** Shintech Vern Solberg, Solberg Technical Consulting Gerard O’Brien, Solderability Testing & Solutions, Inc. Fatima Johnson, Solve Direct Electronics Neil Johnson, Solve Direct Electronics Hideo Goto, Sony Global Manufacturing & Operations Corp. Scott Vorhies, Space Exploration Technologies Paul Pidgeon, STEM Training Robert Fornefeld, STI Electronics, Inc. Patricia Scott, STI Electronics, Inc. Srinivas Chada, Stryker Instruments Rainer Taube, Taube Electronic GmbH Monica Tucker, Teledyne Electronic Manufacturing Services Angelica Joson-Eltanal, Teradyne Philippines Ltd Marian Johnson, Thales Defense & Security, Inc. Acknowledgment (cont.) IPC-A-610H September 2020 vii Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Arnaud Grivon, Thales Global Services Julien Vieilledent, Thales Global Services Yabing Zou,** The Fifth Electronics Research Institute of Ministry of Industry and Information Technology James Parke, The Aerospace Corporation John O’Neill,* The Electronics Group Ltd. Doug Wilson, The Electronics Group Ltd. Satoshi Kashiwabara, Toyota Motor Corporation Shota Mishima, Toyota Motor Corporation Kazunori Nishihara, Toyota Motor Corporation Ken Yamamoto, Toyota Motor Corporation Joaquin Cuevas, Toyota Motor North America Gaston Hidalgo, Toyota Motor North America Thomas Ahrens, Trainalytics GmbH Taylor Abrahamian, TTM Technologies, Inc. Daniel Koss, TTM Technologies, Inc. Ryan Mastriani, TTM Technologies, Inc. John Wood, TTM Technologies, Inc. Tapas Yagnik, TTM Technologies, Inc. Paul Zutter, U.S. Army Aviation & Missile Command Crystal Vanderpan, UL LLC Alan Christmas, Ultra Electronics Communication & Integrated Systems Rachel Grinvalds, UTC Aerospace Abner Chavez, UTC Aerospace Systems Stephen Chavez, UTC Aerospace Systems Russell Kaunas, UTC Aerospace Systems Jason Nipper, UTC Aerospace Systems Constantin Hudon, Varitron Technologies Inc. Qiang Cai,** Vayo (Shanghai) Technology Co., Ltd Jiuxuan Liu,** Vayo (Shanghai) Technology Co., Ltd. Daniel Yue,** Vayo (Shanghai) Technology Co., Ltd. Sonic Lu,** Veoneer China Co., Ltd Jack Zhu,** Veoneer China Co. Ltd. Stephen Meeks, ViaSat Dave Harrell, Viasat Inc. Morison Jiang,** Viasystems EMS (Shenzhen) Co., Ltd. Gerjan Diepstraten, Vitronics Soltec Jeffrey Black, Westinghouse Electric Co., LLC Jian Gao,** Xiamen Shangjin Electronic Technology Co., Ltd. Junfeng Li,** Yanfeng Viston Automotive Electronics Co., Ltd. Andrew Goddard, ZF Automotive UK Limited Zhichao Chen,** Zhuhai ARTON Electronic Technology Co., Ltd. Petrel Pang,** Zhuhai NMTEK Electronics Co., Ltd Zhiman Chen,** Zhuzhou CRRC Times Electric Co., Ltd. Aaron Gao,** Zhuzhou CRRC Times Electric Co., Ltd. Zhe (Jacky) Liu,** ZTE Corporation * Member of 7-31b and 7-31b-EU **Member of 7-31b and 7-31b-CN Figures 4-39, 4-40, 6-24, 6-56, 8-136, 9-32, and 10-75 are Image Credit: NASA, used by permission. Figures 5-51, 5-53, 6-37, 8-53, 8-60, 8-153, 8-154, 8-155, 8-156, 8-157, 8-158 are © Bob Willis, used by permission. Figures 4-13, 5-19, 5-22, 5-27, 5-42, 5-43, 6-21, 6-23, 6-26, 6-41, 6-60, 6-61, 6-65, 6-66, 6-67, 6-76, 6-77, 6-84, 6-89, 6-90, 6-91, 6-94, 6-95, 6-96, 6-97, 6-99, 6-100, 6-101, 6-102, 6-106, 6-108, 7-11, 7-16, 7-25, 7-29, 7-74, 7-82, 8-160, B-3, B-4 are © Omni Training, used by permission. Acknowledgment (cont.) viii September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
1 General ...................................................................... 1-1 1.1 Scope ...................................................................... 1-1 1.2 Purpose ................................................................... 1-1 1.3 Classification ......................................................... 1-2 1.4 Measurement Units and Applications ................. 1-2 1.4.1 Verification of Dimensions ...................................... 1-2 1.5 Definition of Requirements .................................. 1-2 1.5.1 Acceptance Criteria .......................................... 1-3 1.5.1.1 Acceptable Condition ....................................... 1-3 1.5.1.2 Defect Condition .............................................. 1-3 1.5.1.2.1 Disposition ....................................................... 1-3 1.5.1.3 Process Indicator Condition ............................. 1-3 1.5.1.4 Combined Conditions ...................................... 1-3 1.5.1.5 Conditions Not Specified ................................. 1-3 1.5.1.6 Specialized Designs ......................................... 1-3 1.5.1.7 Should ............................................................. 1-4 1.6 Process Control Methodologies ........................... 1-4 1.7 Order of Precedence ............................................. 1-4 1.7.1 Clause References ........................................... 1-4 1.7.2 Appendices ...................................................... 1-4 1.8 Terms and Definitions ........................................... 1-4 1.8.1 Board Orientation ............................................. 1-4 1.8.1.1 Primary Side .................................................... 1-4 1.8.1.2 Secondary Side ............................................... 1-4 1.8.1.3 Solder Source Side .......................................... 1-4 1.8.1.4 Solder Destination Side .................................... 1-4 1.8.2 Cold Solder Connection ................................... 1-4 1.8.3 Common Conductors ...................................... 1-4 1.8.4 Diameter .......................................................... 1-5 1.8.5 Electrical Clearance .......................................... 1-5 1.8.6 Engineering Documentation ............................. 1-5 1.8.7 FOD (Foreign Object Debris) ............................ 1-5 1.8.8 Form, Fit, Function (F/F/F) ................................ 1-5 1.8.9 High Voltage .................................................... 1-5 1.8.10 Intrusive Solder ................................................ 1-5 1.8.11 Kink ................................................................. 1-5 1.8.12 Locking Mechanism ......................................... 1-5 1.8.13 Manufacturer .................................................... 1-5 1.8.14 Meniscus (Component) .................................... 1-5 1.8.15 Noncommon Conductors ................................ 1-5 1.8.16 Nonfunctional Land .......................................... 1-5 1.8.17 Pin-in-Paste ..................................................... 1-5 1.8.18 Solder Balls ...................................................... 1-6 1.8.19 Standard Industry Practice (SIP) ...................... 1-6 1.8.20 Stress Relief ..................................................... 1-6 1.8.21 Supplier ............................................................ 1-6 1.8.22 Tempered Leads .............................................. 1-6 1.8.23 Wire Overlap .................................................... 1-6 1.8.24 Wire Overwrap ................................................. 1-6 1.8.25 User ................................................................. 1-6 1.9 Requirements Flowdown ...................................... 1-6 1.10 Personnel Proficiency ......................................... 1-6 1.11 Acceptance Requirements ................................. 1-6 1.11.1 Missing Parts and Components ....................... 1-6 1.12 Inspection Methodology ..................................... 1-6 1.12.1 Lighting ............................................................ 1-7 1.12.2 Magnification Aids ............................................ 1-7 2 Applicable Documents ............................................. 2-1 2.1 IPC Documents ...................................................... 2-1 2.2 Joint Industry Documents .................................... 2-1 2.3 Electrostatic Association Documents ................. 2-2 2.4 International Electrotechnical Commission Documents ............................................................. 2-2 2.5 ASTM ...................................................................... 2-2 2.6 Military Standards ................................................. 2-2 2.7 SAE International .................................................. 2-2 3 Handling Electronic Assemblies ............................. 3-1 4 Hardware ................................................................... 4-1 4.1 Hardware Installation ............................................ 4-2 4.1.1 Electrical Clearance ........................................... 4-2 4.1.2 Interference ....................................................... 4-3 4.1.3 Component Mounting – High Power ................. 4-4 4.1.4 Heatsinks .......................................................... 4-6 4.1.4.1 Insulators and Thermal Compounds ................. 4-6 4.1.4.2 Contact ............................................................. 4-7 4.1.5 Threaded Fasteners and Other Threaded Hardware .......................................... 4-8 4.1.5.1 Torque ............................................................ 4-10 4.1.5.2 Solid Wires ...................................................... 4-12 4.1.5.3 Stranded Wires ............................................... 4-14 4.2 Jackpost Mounting .............................................. 4-15 4.3 Connector Pins .................................................... 4-16 4.3.1 Edge Connector Pins ...................................... 4-16 4.3.2 Press Fit Pins .................................................. 4-16 4.3.2.1 Land/Annular Ring .......................................... 4-18 4.3.2.2 Soldering ......................................................... 4-19 4.4 Wire Bundle Securing ......................................... 4-20 4.5 Routing – Wires and Wire Bundles .................... 4-20 Table of Contents IPC-A-610H September 2020 ix Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
5 Soldering ................................................................... 5-1 5.1 Soldering Acceptability Requirements ................ 5-3 5.2 Soldering Anomalies ............................................. 5-4 5.2.1 Exposed Basis Metal ......................................... 5-4 5.2.2 Pin Holes/Blow Holes/Voids .............................. 5-6 5.2.3 Reflow of Solder Paste ...................................... 5-7 5.2.4 Nonwetting ........................................................ 5-8 5.2.5 Cold/Rosin Connection ..................................... 5-9 5.2.6 Dewetting .......................................................... 5-9 5.2.7 Excess Solder ................................................. 5-10 5.2.7.1 Solder Balls ..................................................... 5-11 5.2.7.2 Bridging ........................................................... 5-12 5.2.7.3 Solder Webbing/Splashes ............................... 5-13 5.2.8 Disturbed Solder ............................................. 5-14 5.2.9 Cooling Lines and Secondary Reflow .............. 5-15 5.2.10 Fractured Solder ............................................. 5-16 5.2.11 Solder Projections ........................................... 5-17 5.2.12 Pb-Free Fillet Lift ............................................. 5-18 5.2.13 Pb-Free Hot Tear/Shrink Hole ......................... 5-19 5.2.14 Probe Marks and Other Similar Surface Conditions in Solder Joints ............................. 5-20 5.2.15 Partially Visible or Hidden Solder Connections .................................................... 5-20 5.2.16 Heat Shrinkable Soldering Devices .................. 5-21 5.2.17 Inclusions ........................................................ 5-22 6 Terminal Connections .............................................. 6-1 6.1 Swaged Hardware ................................................. 6-3 6.1.1 Terminals ........................................................... 6-3 6.1.1.1 Terminal Base to Land Separation .................... 6-3 6.1.1.2 Turret ................................................................ 6-5 6.1.1.3 Bifurcated .......................................................... 6-6 6.1.2 Rolled Flange .................................................... 6-7 6.1.3 Flared Flange .................................................... 6-8 6.1.4 Controlled Split .................................................. 6-9 6.1.5 Solder ............................................................. 6-10 6.2 Insulation .............................................................. 6-12 6.2.1 Damage .......................................................... 6-12 6.2.1.1 Presolder ......................................................... 6-12 6.2.1.2 Post-Solder ..................................................... 6-14 6.2.2 Clearance ........................................................ 6-15 6.2.3 Insulation Sleeving ........................................... 6-17 6.2.3.1 Placement ....................................................... 6-17 6.2.3.2 Damage .......................................................... 6-19 6.3 Conductor ............................................................ 6-20 6.3.1 Deformation .................................................... 6-20 6.3.2 Damage .......................................................... 6-21 6.3.2.1 Stranded Wire ................................................. 6-21 6.3.2.2 Solid Wire ........................................................ 6-22 6.3.3 Strand Separation (Birdcaging) – Presolder ......................................................... 6-22 6.3.4 Strand Separation (Birdcaging) – Post-Solder ..................................................... 6-23 6.3.5 Tinning ............................................................ 6-24 6.4 Service Loops ...................................................... 6-26 6.5 Routing – Wires and Wire Bundles – Bend Radius ......................................................... 6-27 6.6 Stress Relief ........................................................ 6-28 6.6.1 Wire ................................................................ 6-28 6.7 Lead/Wire Placement – General Requirements ...................................................... 6-30 6.8 Solder – General Requirements ........................ 6-31 6.9 Turrets and Straight Pins ................................... 6-33 6.9.1 Lead/Wire Placement ...................................... 6-33 6.9.2 Solder ............................................................. 6-35 6.10 Bifurcated .......................................................... 6-36 6.10.1 Lead/Wire Placement – Side Route Attachments .................................................... 6-36 6.10.2 Lead/Wire Placement – Staked Wires ............. 6-38 6.10.3 Lead/Wire Placement – Bottom and Top Route Attachments ......................................... 6-39 6.10.4 Solder ............................................................. 6-40 6.11 Slotted ................................................................ 6-42 6.11.1 Lead/Wire Placement ...................................... 6-42 6.11.2 Solder ............................................................. 6-43 6.12 Pierced/Perforated ............................................ 6-44 6.12.1 Lead/Wire Placement ...................................... 6-44 6.12.2 Solder ............................................................. 6-46 6.13 Hook .................................................................... 6-47 6.13.1 Lead/Wire Placement ...................................... 6-47 6.13.2 Solder ............................................................. 6-49 6.14 Solder Cups ....................................................... 6-50 6.14.1 Lead/Wire Placement ...................................... 6-50 6.14.2 Solder ............................................................. 6-51 6.15 AWG 30 and Smaller Diameter Wires – Lead/Wire Placement ....................................... 6-53 6.16 Series Connected .............................................. 6-55 6.17 Edge Clip – Position .......................................... 6-56 Table of Contents (cont.) x September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
7 Through-Hole Technology ....................................... 7-1 7.1 Component Mounting ........................................... 7-2 7.1.1 Orientation ....................................................... 7-2 7.1.1.1 Orientation – Horizontal .................................... 7-3 7.1.1.2 Orientation – Vertical ........................................ 7-4 7.1.2 Lead Forming ................................................... 7-5 7.1.2.1 Bend Radius .................................................... 7-5 7.1.2.2 Space between Seal/Weld and Bend .............. 7-6 7.1.2.3 Stress Relief ..................................................... 7-7 7.1.2.4 Damage ........................................................... 7-9 7.1.3 Leads Crossing Conductors .......................... 7-10 7.1.4 Hole Obstruction ............................................ 7-11 7.1.5 DIP/SIP Devices and Sockets ........................ 7-12 7.1.6 Radial Leads – Vertical ................................... 7-14 7.1.6.1 Spacers ......................................................... 7-15 7.1.7 Radial Leads – Horizontal .............................. 7-16 7.1.8 Connectors .................................................... 7-17 7.1.8.1 Right Angle .................................................... 7-18 7.1.8.2 Vertical Shrouded Pin Headers and Vertical Receptacle Connectors ................................. 7-19 7.1.9 Conductive Cases .......................................... 7-20 7.2 Component Securing .......................................... 7-20 7.2.1 Mounting Clips ............................................... 7-20 7.2.2 Adhesive Bonding .......................................... 7-22 7.2.2.1 Adhesive Bonding – Nonelevated Components .................................................. 7-23 7.2.2.2 Adhesive Bonding – Elevated Components .................................................. 7-26 7.2.3 Other Devices ................................................ 7-29 7.3 Supported Holes .................................................. 7-30 7.3.1 Axial Leaded – Horizontal .............................. 7-30 7.3.2 Axial Leaded – Vertical ................................... 7-31 7.3.3 Wire/Lead Protrusion ..................................... 7-33 7.3.4 Wire/Lead Clinches ........................................ 7-34 7.3.5 Solder ............................................................ 7-36 7.3.5.1 Vertical Fill (A) ................................................. 7-39 7.3.5.2 Solder Destination Side – Lead to Barrel (B) ........................................................ 7-41 7.3.5.3 Solder Destination Side – Land Area Coverage (C) .................................................. 7-43 7.3.5.4 Solder Source Side – Lead to Barrel (D) ........ 7-44 7.3.5.5 Solder Source Side – Land Area Coverage (E) .................................................. 7-45 7.3.5.6 Solder Conditions – Solder in Lead Bend ...... 7-46 7.3.5.7 Solder Conditions – Touching Through-Hole Component Body .......................................... 7-47 7.3.5.8 Solder Conditions – Meniscus in Solder ........ 7-48 7.3.5.9 Lead Cutting after Soldering .......................... 7-50 7.3.5.10 Coated Wire Insulation in Solder .................... 7-51 7.3.5.11 Interfacial Connection without Lead – Vias .... 7-52 7.3.5.12 Board in Board .............................................. 7-53 7.4 Unsupported Holes .............................................. 7-56 7.4.1 Axial Leads – Horizontal ................................. 7-56 7.4.2 Axial Leads – Vertical ..................................... 7-57 7.4.3 Wire/Lead Protrusion ..................................... 7-58 7.4.4 Wire/Lead Clinches ........................................ 7-59 7.4.5 Solder ............................................................ 7-61 7.4.6 Lead Cutting after Soldering .......................... 7-63 8 Surface Mount Assemblies ...................................... 8-1 8.1 Staking Adhesive ................................................... 8-3 8.1.1 Component Bonding ......................................... 8-3 8.1.2 Mechanical Strength ......................................... 8-4 8.2 SMT Leads ................................................................. 8-6 8.2.1 Plastic Components .......................................... 8-6 8.2.2 Damage ............................................................ 8-6 8.2.3 Flattening .......................................................... 8-7 8.3 SMT Connections .................................................. 8-7 8.3.1 Chip Components – Bottom Only Terminations ....................................................... 8-8 8.3.1.1 Side Overhang (A) ............................................ 8-9 8.3.1.2 End Overhang (B) .......................................... 8-10 8.3.1.3 End Joint Width (C) ........................................ 8-11 8.3.1.4 Side Joint Length (D) ..................................... 8-12 8.3.1.5 Maximum Fillet Height (E) ............................... 8-13 8.3.1.6 Minimum Fillet Height (F) ................................ 8-13 8.3.1.7 Solder Thickness (G) ...................................... 8-14 8.3.1.8 End Overlap (J) .............................................. 8-14 8.3.2 Rectangular or Square End Chip Components – 1, 2, 3 or 5 Side Termination(s) ................................................... 8-15 8.3.2.1 Side Overhang (A) ....................................... 8-16 8.3.2.2 End Overhang (B) ........................................ 8-18 8.3.2.3 End Joint Width (C) ..................................... 8-19 8.3.2.4 Side Joint Length (D) ................................... 8-21 8.3.2.5 Maximum Fillet Height (E) ............................ 8-22 8.3.2.6 Minimum Fillet Height (F) ............................. 8-23 8.3.2.7 Solder Thickness (G) ................................... 8-24 8.3.2.8 End Overlap (J) ............................................ 8-25 8.3.2.9 Termination Variations ................................. 8-26 8.3.2.9.1 Mounting on Side (Billboarding) ................... 8-26 8.3.2.9.2 Mounting Upside Down ............................... 8-28 8.3.2.9.3 Stacking ...................................................... 8-29 8.3.2.9.4 Tombstoning ............................................... 8-30 8.3.2.10 Center Terminations .................................... 8-31 8.3.2.10.1 Solder Width of Side Termination ................ 8-31 8.3.2.10.2 Minimum Fillet Height of Side Termination ... 8-32 Table of Contents (cont.) IPC-A-610H September 2020 xi Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-
8.3.3 Cylindrical End Cap Terminations .................. 8-33 8.3.3.1 Side Overhang (A) ....................................... 8-34 8.3.3.2 End Overhang (B) ........................................ 8-35 8.3.3.3 End Joint Width (C) ..................................... 8-36 8.3.3.4 Side Joint Length (D) ................................... 8-37 8.3.3.5 Maximum Fillet Height (E) ............................ 8-38 8.3.3.6 Minimum Fillet Height (F) ............................. 8-39 8.3.3.7 Solder Thickness (G) ................................... 8-40 8.3.3.8 End Overlap (J) ............................................ 8-41 8.3.4 Castellated Terminations ................................ 8-42 8.3.4.1 Side Overhang (A) ....................................... 8-43 8.3.4.2 End Overhang (B) ........................................ 8-44 8.3.4.3 Minimum End Joint Width (C) ...................... 8-44 8.3.4.4 Minimum Side Joint Length (D) .................... 8-45 8.3.4.5 Maximum Fillet Height (E) ............................ 8-45 8.3.4.6 Minimum Fillet Height (F) ............................. 8-46 8.3.4.7 Solder Thickness (G) ................................... 8-46 8.3.5 Flat Gull Wing Leads ........................................ 8-47 8.3.5.1 Side Overhang (A) ....................................... 8-48 8.3.5.2 Toe Overhang (B) ........................................ 8-51 8.3.5.3 Minimum End Joint Width (C) ...................... 8-52 8.3.5.4 Minimum Side Joint Length (D) .................... 8-53 8.3.5.5 Maximum Heel Fillet Height (E) .................... 8-54 8.3.5.6 Minimum Heel Fillet Height (F) ..................... 8-55 8.3.5.7 Solder Thickness (G) ................................... 8-56 8.3.5.8 Coplanarity .................................................. 8-57 8.3.6 Round or Flattened (Coined) Gull Wing Leads ....................................................... 8-58 8.3.6.1 Side Overhang (A) ....................................... 8-59 8.3.6.2 Toe Overhang (B) ........................................ 8-60 8.3.6.3 Minimum End Joint Width (C) ...................... 8-60 8.3.6.4 Minimum Side Joint Length (D) .................... 8-61 8.3.6.5 Maximum Heel Fillet Height (E) .................... 8-62 8.3.6.6 Minimum Heel Fillet Height (F) ..................... 8-63 8.3.6.7 Solder Thickness (G) ................................... 8-64 8.3.6.8 Minimum Side Joint Height (Q) .................... 8-64 8.3.6.9 Coplanarity .................................................. 8-65 8.3.7 J Leads .............................................................. 8-66 8.3.7.1 Side Overhang (A) ....................................... 8-66 8.3.7.2 Toe Overhang (B) ........................................ 8-68 8.3.7.3 End Joint Width (C) ..................................... 8-69 8.3.7.4 Side Joint Length (D) ................................... 8-70 8.3.7.5 Maximum Heel Fillet Height (E) .................... 8-71 8.3.7.6 Minimum Heel Fillet Height (F) ..................... 8-72 8.3.7.7 Solder Thickness (G) ................................... 8-74 8.3.7.8 Coplanarity .................................................. 8-74 8.3.8 Butt/I Connections ........................................... 8-75 8.3.8.1 Modified Through-Hole Terminations ........... 8-75 8.3.8.1.1 Maximum Side Overhang (A) ....................... 8-76 8.3.8.1.2 Toe Overhang (B) ........................................ 8-76 8.3.8.1.3 Minimum End Joint Width (C) ...................... 8-77 8.3.8.1.4 Minimum Side Joint Length (D) .................... 8-77 8.3.8.1.5 Maximum Fillet Height (E) ............................ 8-77 8.3.8.1.6 Minimum Fillet Height (F) ............................. 8-78 8.3.8.1.7 Solder Thickness (G) ................................... 8-78 8.3.8.2 Solder Charged Terminations ...................... 8-79 8.3.8.2.1 Maximum Side Overhang (A) ....................... 8-80 8.3.8.2.2 Maximum Toe Overhang (B) ........................ 8-80 8.3.8.2.3 Minimum End Joint Width (C) ...................... 8-81 8.3.8.2.4 Minimum Fillet Height (F) ............................. 8-81 8.3.9 Flat Lug Leads .................................................. 8-82 8.3.10 Tall Profile Components Having Bottom Only Terminations .......................................... 8-83 8.3.11 Inward Formed L-Shaped Ribbon Leads ..... 8-84 8.3.12 Surface Mount Area Array ............................ 8-86 8.3.12.1 Alignment .................................................... 8-87 8.3.12.2 Solder Ball Spacing ..................................... 8-87 8.3.12.3 Solder Connections ..................................... 8-88 8.3.12.4 Voids ........................................................... 8-90 8.3.12.5 Underfill/Staking ........................................... 8-90 8.3.12.6 Package on Package .................................. 8-91 8.3.13 Bottom Termination Components (BTC) ................................................................ 8-93 8.3.14 Components with Bottom Thermal Plane Terminations (D-Pak) .......................... 8-95 8.3.15 Flattened Post Connections ......................... 8-97 8.3.15.1 Maximum Termination Overhang – Square Solder Land .................................... 8-97 8.3.15.2 Maximum Termination Overhang – Round Solder Land ..................................... 8-98 8.3.15.3 Maximum Fillet Height ................................. 8-98 8.3.16 P-Style Terminations ..................................... 8-99 8.3.16.1 Maximum Side Overhang (A) ..................... 8-100 8.3.16.2 Maximum Toe Overhang (B) ...................... 8-100 8.3.16.3 Minimum End Joint Width (C) .................... 8-101 8.3.16.4 Minimum Side Joint Length (D) .................. 8-101 8.3.16.5 Minimum Fillet Height (F) ........................... 8-102 8.3.17 Vertical Cylindrical Cans with Outward L-Shaped Lead Terminations ...................... 8-103 Table of Contents (cont.) xii September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
8.3.18 Flexible and Rigid Flex Printed Circuitry with Flat Unformed Leads ........................... 8-105 8.3.19 Wrapped Terminals ...................................... 8-106 8.3.19.1 Side Overhang (A) ........................................ 8-107 8.3.19.2 End Joint Width (C) ...................................... 8-107 8.3.19.3 Side Joint Length (D) ................................... 8-107 8.3.19.4 Maximum Heel Fillet Height (E) .................... 8-107 8.3.19.5 Minimum Heel Fillet Height (F) ...................... 8-108 8.3.19.6 Solder Thickness (G) .................................... 8-108 8.4 Specialized SMT Terminations ........................ 8-109 8.5 Surface Mount Connectors .............................. 8-110 8.5.1 Surface Mount Threaded Standoffs (SMTS) or Surface Mount Fasteners ............ 8-111 9 Component Damage ................................................ 9-1 9.1 Loss of Metallization ................................................ 9-2 9.2 Chip Resistor Element ............................................. 9-3 9.3 Leaded/Leadless Devices ....................................... 9-4 9.4 Ceramic Chip Capacitors ........................................ 9-8 9.5 Connectors .............................................................. 9-10 9.6 Relays ....................................................................... 9-13 9.7 Ferrite Core Components ..................................... 9-13 9.8 Connectors, Handles, Extractors, Latches ........ 9-14 9.9 Edge Connector Pins ............................................. 9-15 9.10 Press Fit Pins ........................................................ 9-16 9.11 Backplane Connector Pins ................................. 9-17 9.12 Heat Sink Hardware ............................................. 9-18 9.13 Threaded Items and Hardware .......................... 9-19 10 Printed Boards and Assemblies .......................... 10-1 10.1 Non-Soldered Contact Areas ........................... 10-2 10.1.1 Contamination ................................................ 10-2 10.1.2 Damage ......................................................... 10-4 10.2 Laminate Conditions ......................................... 10-4 10.2.1 Measling and Crazing .................................... 10-5 10.2.2 Blistering and Delamination ............................ 10-7 10.2.3 Weave Texture/Weave Exposure ................... 10-9 10.2.4 Haloing ........................................................ 10-10 10.2.5 Edge Delamination, Nicks and Crazing ........ 10-12 10.2.6 Burns ........................................................... 10-14 10.2.7 Bow and Twist ............................................. 10-15 10.2.8 Depanelization .............................................. 10-16 10.3 Conductors/Lands ........................................... 10-18 10.3.1 Reduction .................................................... 10-18 10.3.2 Lifted ............................................................ 10-19 10.3.3 Mechanical Damage .................................... 10-21 10.4 Flexible and Rigid-Flex Printed Boards ......... 10-22 10.4.1 Damage ....................................................... 10-22 10.4.2 Delamination/Blister ..................................... 10-24 10.4.2.1 Flex .............................................................. 10-24 10.4.2.2 Flex to Stiffener ............................................ 10-25 10.4.3 Solder Wicking ............................................. 10-26 10.4.4 Attachment .................................................. 10-27 10.5 Marking ............................................................ 10-28 10.5.1 Etched (Including Hand Printing) .................. 10-30 10.5.2 Screened ..................................................... 10-31 10.5.3 Stamped ...................................................... 10-32 10.5.4 Laser ............................................................ 10-33 10.5.5 Labels .......................................................... 10-33 10.5.5.1 Bar Coding/Data Matrix ............................... 10-33 10.5.5.2 Readability ................................................... 10-34 10.5.5.3 Labels – Adhesion and Damage .................. 10-35 10.5.5.4 Position ........................................................ 10-35 10.5.6 Radio Frequency Identification (RFID) Tags .................................................. 10-36 10.6 Cleanliness ...................................................... 10-37 10.6.1 Flux Residues .............................................. 10-37 10.6.1.1 Cleaning Required ........................................ 10-38 10.6.1.2 No Cleaning Process ................................... 10-39 10.6.2 Foreign Object Debris (FOD) ........................ 10-40 10.6.3 Chlorides, Carbonates and White Residues ...................................................... 10-41 10.6.4 Surface Appearance .................................... 10-43 10.7 Solder Mask Coating ....................................... 10-44 10.7.1 Wrinkling/Cracking ....................................... 10-45 10.7.2 Voids, Blisters, Scratches ............................ 10-47 10.7.3 Breakdown .................................................. 10-48 10.7.4 Discoloration ................................................ 10-49 10.8 Conformal Coating .......................................... 10-49 10.8.1 General ........................................................ 10-49 10.8.2 Coverage ..................................................... 10-50 10.8.3 Thickness ..................................................... 10-52 10.9 Electrical Insulation Coating ......................... 10-53 10.9.1 Coverage ..................................................... 10-53 10.9.2 Thickness ..................................................... 10-53 Table of Contents (cont.) IPC-A-610H September 2020 xiii Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
10.10 Encapsulation ................................................ 10-54 11 Discrete Wiring ..................................................... 11-1 11.1 Solderless Wrap ................................................ 11-1 12 High Voltage ......................................................... 12-1 13 Jumper Wires ...................................................... 13-1 13.1 Wire Routing ..................................................... 13-2 13.2 Wire Staking – Adhesive or Tape ................... 13-3 13.3 Terminations .................................................... 13-4 13.3.1 Lap ................................................................ 13-5 13.3.1.1 Component Lead ........................................... 13-5 13.3.1.2 Land .............................................................. 13-7 13.3.2 Wire in Hole ................................................... 13-8 13.3.3 Wrapped ........................................................ 13-9 13.3.4 SMT ............................................................. 13-10 13.3.4.1 Chip and Cylindrical End Cap Components ................................................ 13-10 13.3.4.2 Gull Wing ..................................................... 13-11 13.3.4.3 Castellations ................................................. 13-13 Appendix A Minimum Electrical Clearance ............. A-1 Appendix B Protecting the Assembly – ESD and Other Handling Considerations ............ B-1 Index ........................................................................ Index-1 Tables Table 1-1 Summary of Related Documents .............. 1-1 Table 1-2 Inspection Magnification (Land Width) ..... 1-7 Table 1-3 Magnification Aid Applications For Wires And Wire Connections .................... 1-8 Table 1-4 Magnification Aid Applications – Other .... 1-8 Table 6-1 Swaged Hardware Minimum Soldering Requirements .......................... 6-10 Table 6-2 Strand Damage ......................................... 6-21 Table 6-3 Minimum Bend Radius Requirements .... 6-27 Table 6-4 Turret or Straight Pin Terminal Lead/Wire Placement ............................... 6-33 Table 6-5 Bifurcated Terminal Lead/Wire Placement – Side Route ........................... 6-36 Table 6-6 Staking Requirements of Side Route Straight Through Connections – Bifurcated Terminals ................................ 6-38 Table 6-7 Bifurcated Terminal Lead/Wire Placement – Bottom Route ...................... 6-39 Table 6-8 Pierced or Perforated Terminal Lead/Wire Placement ............................... 6-44 Table 6-9 Hook Terminal Lead/Wire Placement ..... 6-47 Table 6-10 AWG 30 and Smaller Wire Wrap Requirements ......................................... 6-53 Table 7-1 Lead Bend Radius ...................................... 7-5 Table 7-2 Component to Land Clearance ............... 7-31 Table 7-3 Protrusion of Wires/Leads in Supported Holes ....................................... 7-33 Table 7-4 Plated Through-Holes with Component Leads – Minimum Acceptable Solder Conditions ................................................. 7-38 Table 7-5 Board in Board – Minimum Acceptable Solder Conditions ..................................... 7-53 Table 7-6 Protrusion of Leads in Unsupported Holes .......................................................... 7-58 Table 7-7 Unsupported Holes with Component Leads, Minimum Acceptable Conditions ................................................. 7-61 Table 8-1 Dimensional Criteria – Chip Component – Bottom Only Termination Features ................................. 8-8 Table 8-2 Dimensional Criteria – Rectangular or Square End Chip Components – 1, 2, 3 or 5 Side Termination(s) .............. 8-15 Table 8-3 Dimensional Criteria – Cylindrical End Cap Termination ............................... 8-33 Table 8-4 Dimensional Criteria – Castellated Terminations ........................ 8-42 Table 8-5 Dimensional Criteria – Flat Gull Wing Leads ................................ 8-47 Table 8-6 Dimensional Criteria – Round or Flattened (Coined) Gull Wing Lead Features ................................. 8-58 Table of Contents (cont.) xiv September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Table 8-7 Dimensional Criteria – J Leads ............... 8-66 Table 8-8 Dimensional Criteria – Butt/I Connections – Modified ThroughHole Leads ................................................ 8-75 Table 8-9 Dimensional Criteria – Butt/I Connections – Solder Charged Terminations ............................................. 8-79 Table 8-10 Dimensional Criteria – Flat Lug Leads ........................................ 8-82 Table 8-11 Dimensional Criteria – Tall Profile Components Having Bottom Only Terminations .................................. 8-83 Table 8-12 Dimensional Criteria – Inward Formed L-Shaped Ribbon Leads ........... 8-84 Table 8-13 Dimensional Criteria – Ball Grid Array Components with Collapsing Balls ....... 8-86 Table 8-14 Ball Grid Array Components with Noncollapsing Balls ................................ 8-86 Table 8-15 Column Grid Array .................................. 8-86 Table 8-16 Dimensional Criteria – BTC ................... 8-93 Table 8-17 Dimensional Criteria – Bottom Thermal Plane Terminations (D-Pak) .... 8-95 Table 8-18 Dimensional Criteria Flattened Post Connections ................................... 8-97 Table 8-19 Dimensional Criteria – P-Style Terminations .............................. 8-99 Table 8-20 Dimensional Criteria – Vertical Cylindrical Cans with Outward L-Shaped Lead Terminations .............. 8-104 Table 8-21 Dimensional Criteria – Flexible and Rigid-Flex Circuitry with Flat Unformed Leads ................................... 8-105 Table 8-22 Dimensional Criteria – Wrapped Terminals .............................. 8-106 Table 8-23 SMTS/Surface Mount Fasteners – Minimum Acceptable Solder Conditions ............................................. 8-111 Table 9-1 Chip-Out Criteria ........................................ 9-8 Table 10-1 Coating Thickness ................................ 10-52 Appendix A Table 6-1 Electrical Conductor Spacing ..................................................... A-2 Table B-1 Typical Static Charge Sources ................. B-3 Table B-2 Typical Static Voltage Generation ........... B-3 Table B-3 Recommended Practices for Handling Electronic Assemblies .............. B-6 Table of Contents (cont.) IPC-A-610H September 2020 xv Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
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IPC-AJ-820 is a supporting document that provides information regarding the intent of this specification content and explains or amplifies the technical rationale for transition of limits through Acceptable to Defect condition criteria. In addition, supporting information is provided to give a broader understanding of the process considerations that are related to performance but not commonly distinguishable through visual assessment methods. The explanations provided in IPC-AJ-820 should be useful in determining disposition of conditions identified as Defect, processes associated with Process Indicators, as well as answering questions regarding clarification in use and application for defined content of this specification. Contractual reference to IPC-A-610 does not additionally impose the content of IPC-AJ-820 unless specifically referenced in contractual documentation. 1.2 Purpose The visual standards in this document reflect the requirements of existing IPC and other applicable specifications. For the content of this document to apply, the assembly/product should comply with other existing IPC requirements, such as Document Purpose Spec.# Definition Design Standard IPC-2220-FAM IPC-7351 IPC-CM-770 Design requirements reflecting three levels of complexity (Levels A, B, and C) indicating finer geometries, greater densities, more process steps to produce the product. Component and Assembly Process Guidelines to assist in the design of the bare board and the assembly where the bare board processes concentrate on land patterns for surface mount and the assembly concentrates on surface mount and through-hole principles which are usually incorporated into the design process and the documentation. Printed Board – Requirements IPC-6010-FAM IPC-A-600 Requirements and acceptance documentation for rigid, rigid flex, flex and other types of substrates. End Item Documentation IPC-D-325 Documentation depicting bare board or assembly requirements. Details may or may not reference industry specifications or workmanship standards as well as the User’s own preferences or internal standard requirements. Process Requirement Standard J-STD-001 Requirements for soldered electrical and electronic assemblies depicting minimum end product acceptable characteristics as well as methods for evaluation (test methods), frequency of testing and applicable ability of process control requirements. Acceptability Standard IPC-A-610 Pictorial interpretive document indicating various characteristics of the board and/or assembly as appropriate relating to desirable conditions that exceed the minimum acceptable characteristics indicated by the end item performance standard and reflect various out-of-control (process indicator or defect) conditions to assist the shop process evaluators in judging need for corrective action. Training Programs (Optional) Documented training for process, procedures, techniques, and requirements. Rework and Repair IPC-7711/7721 Documentation providing the procedures to accomplish conformal coating and component removal and replacement, solder resist repair, and modification/repair of laminate material, conductors, and plated through-holes. 1 Acceptability of Electronic Assemblies 1 General 1.1 Scope This standard is a collection of visual quality acceptability requirements for electronic assemblies. This standard does not provide criteria for cross-section evaluation. This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically, electronic assembly standards contained a more comprehensive tutorial addressing principles and techniques. For a more complete understanding of this document’s recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-AJ-820 and J-STD-001. The criteria in this standard are not intended to define processes to accomplish assembly operations nor is it intended to authorize repair/modification or change of the product. For instance, the presence of criteria for adhesive bonding of components does not imply/authorize/require the use of adhesive bonding and the depiction of a lead wrapped clockwise around a terminal does not imply/authorize/require that all leads/wires be wrapped in the clockwise direction. Users of this standard should be knowledgeable of the applicable requirements of the document and how to apply them, see 1.3 Classification. IPC-A-610 has criteria outside the scope of J-STD-001 defining mechanical and other workmanship requirements. Table 1-1 is a summary of related documents. Table_1-1 Summary of Related Documents IPC-A-610H September 2020 1-1 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
IPC-7351, IPC-2220-FAM, IPC-6010-FAM and IPC-A-600. If the assembly does not comply with these or with equivalent requirements, the acceptance criteria shall be defined between the User and Supplier. The illustrations in this document portray specific points noted in the title of each page. A brief description follows each illustration. It is not the intent of this document to exclude any acceptable procedure, such as for component placement or for applying flux and solder used to make the electrical connection, however, the methods used shall produce completed solder connections conforming to the acceptability requirements described in this document. In the case of a discrepancy, the description or written criteria always takes precedence over the illustrations. Standards may be updated at any time, including with the use of amendments. The use of an amendment or newer revision is not automatically required. 1.3 Classification The User has the ultimate responsibility for identifying the class to which the assembly is evaluated. If the User does not establish and document the acceptance class, the Manufacturer may do so. Criteria defined in this document reflect three classes, which are as follows: Class 1 – General Electronic Products Includes products suitable for applications where the major requirement is function of the completed assembly. Class 2 – Dedicated Service Electronic Products Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. Class 3 – High Performance Electronic Products Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. 1.4 Measurement Units and Applications This standard uses International System of Units (SI) units per ASTM SI10, IEEE/ ASTM SI 10, Section 3 [Imperial English equivalent units are in brackets for convenience]. The SI units used in this standard are millimeters (mm) [in] for dimensions and dimensional tolerances, Celsius (°C) [°F] for temperature and temperature tolerances, grams (g) [oz] for weight, and lux (lx) [footcandles] for illuminance. Note: This standard uses other SI prefixes to eliminate leading zeroes (for example, 0.0012 mm becomes 1.2 µm) or as alternative to powers-of-ten (3.6 x 103 mm becomes 3.6 m). 1.4.1 Verification of Dimensions Actual measurement of specific part mounting and solder fillet dimensions and determination of percentages are not required except for referee purposes. For determining conformance to the specifications in this standard, round all observed or calculated values ‘‘to the nearest unit’’ in the last right-hand digit used in expressing the specification limit, in accordance with the rounding method of ASTM E29. For example, specifications of 2.5 mm max, 2.50 mm max, or 2.500 mm max, round the measured value to the nearest 0.1 mm, 0.01 mm, or 0.001 mm, respectively, and then compare to the specification number cited. 1.5 Definition of Requirements This document provides acceptance criteria for completed electronic assemblies. Where a requirement is presented that cannot be defined by the acceptable, process indicator, and defect conditions, the word ‘‘shall’’ is used to identify the requirement. Unless otherwise specified herein, the word ‘‘shall’’ in this document invokes a requirement for Manufacturers of all classes of product, and failure to comply with the requirement is a noncompliance to this standard. Many of the examples (illustrations) shown are grossly exaggerated in order to depict the reason for the acceptance criteria. It is necessary that users of this standard pay particular attention to the subject of each section to avoid misinterpretation. 1 Acceptability of Electronic Assemblies 1 General (cont.) 1-2 September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
1.5.1 Acceptance Criteria Criteria are given for each class in three conditions: Acceptable, Defect or Process Indicator. ‘‘Not Established’’ means that there are no specified criteria for that class and may need to be established between Manufacturer and User. 1.5.1.1 Acceptable Condition This characteristic indicates a condition that, while not necessarily perfect, will maintain the integrity and reliability of the assembly in its service environment. 1.5.1.2 Defect Condition A defect is a condition that may be insufficient to ensure the form, fit or function of the assembly in its end use environment. Defect conditions shall be dispositioned by the Manufacturer based on design, service, and User requirements. It is the responsibility of the User to define unique defect categories applicable to the product. A defect for Class 1 automatically implies a defect for Class 2 and 3. A defect for Class 2 implies a defect for Class 3. Note: This would not be the case where criteria for a particular class have not been established. 1.5.1.2.1 Disposition The determination of how defects should be treated. Dispositions include, but are not limited to, rework, use as is, scrap or repair. Repair or ‘‘use as is’’ may require User concurrence. 1.5.1.3 Process Indicator Condition A process indicator is a condition (not a defect) that identifies a characteristic that does not affect the form, fit or function of a product: • Such condition is a result of material, design and/or operator/machine related causes that create a condition that neither fully meets the acceptance criteria nor is a defect. • Process indicators should be monitored as part of the process control system. When the number of process indicators indicate abnormal variation in the process or identify an undesirable trend, then the process should be analyzed. This may result in action to reduce the variation and improve yields. • Disposition of individual process indicators is not required. 1.5.1.4 Combined Conditions Cumulative conditions shall be considered in addition to the individual characteristics for product acceptability even though they are not individually considered defective. The significant number of combinations that could occur does not allow full definition in the content and scope of this specification but Manufacturers should be vigilant for the possibility of combined and cumulative conditions and their impact upon product performance. Conditions of acceptability provided in this specification are individually defined and created with separate consideration for their impact upon reliable operation for the defined production classification. Where related conditions can be combined, the cumulative performance impact for the product may be significant, e.g., minimum solder fillet quantity when combined with maximum side overhang and minimum end overlap may cause a significant degradation of the mechanical attachment integrity. The Manufacturer is responsible for identification of such conditions. The User is responsible to identify combined conditions where there is significant concern based upon end use environment and product performance requirements. 1.5.1.5 Conditions Not Specified Conditions that are not specified as defective or as a process indicator may be considered acceptable unless it can be established that the condition affects user defined form, fit or function. 1.5.1.6 Specialized Designs IPC-A-610, as an industry consensus document, cannot address all of the possible components and product design combinations. Where uncommon or specialized technologies are used, it may be necessary to develop unique acceptance criteria. However, where similar characteristics exist, this document may provide guidance for product acceptance criteria. Often, unique definition is necessary to consider the specialized characteristics while considering product performance criteria. The development should include User involvement or consent. For Classes 2 and 3 the criteria shall include agreed definition of product acceptance. Whenever possible these criteria should be submitted to the IPC Technical Committee to be considered for inclusion in upcoming revisions of this standard. 1 Acceptability of Electronic Assemblies 1 General (cont.) IPC-A-610H September 2020 1-3 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
1.5.1.7 Should The word ‘‘should’’ reflects recommendations and is used to reflect general industry practices and procedures for guidance only. 1.6 Process Control Methodologies Process control methodologies should be used in the planning, implementation and evaluation of the manufacturing processes used to produce soldered electrical and electronic assemblies. The philosophy, implementation strategies, tools and techniques may be applied in different sequences depending on the specific company, operation, or variable under consideration to relate process control and capability to end product requirements. The Manufacturer should maintain objective evidence of a current process control/continuous improvement plan that is available for review. 1.7 Order of Precedence When IPC-A-610 is cited or required by contract as a stand-alone document for inspection and/or acceptance, the requirements of J-STD-001 do not apply unless separately and specifically required. In the event of conflict, the following order of precedence applies: 1. Procurement as agreed and documented between Manufacturer and User. 2. Master drawing or master assembly drawing reflecting the User’s detailed requirements. 3. When invoked by the User or per contractual agreement, IPC-A-610. When documents other than IPC-A-610 are cited, the order of precedence should be defined in the procurement documents. The User has the opportunity to specify alternate acceptance criteria. 1.7.1 Clause References When a clause in this document is referenced, its subordinate clauses also apply. 1.7.2 Appendices Appendices to this standard are not binding requirements unless separately and specifically required by the applicable contracts, engineering documentation or purchase orders. 1.8 Terms and Definitions 1.8.1 Board Orientation The following terms are used throughout this document to determine the board side. The source/ destination side shall be considered when applying some criteria, such as that in Tables 7-4, 7-5 and 7-7. 1.8.1.1 Primary Side The side of a packaging and interconnecting structure that is so defined on the master drawing. (It is usually the side that contains the most complex or the most number of components.) (This side is sometimes referred to as the component side or solder destination side in through-hole mounting technology.) 1.8.1.2 Secondary Side That side of a packaging and interconnecting structure that is opposite the primary side. (This side is sometimes referred to as the solder side or solder source side in through-hole mounting technology.) 1.8.1.3 Solder Source Side The solder source side is that side of the printed board to which solder is applied. The solder source side is normally the secondary side of the printed board when wave, dip, or drag soldering are used. The solder source side may be the primary side of the printed board when hand soldering operations are conducted. 1.8.1.4 Solder Destination Side The solder destination side is that side of the printed board that the solder flows toward in a through-hole application. The destination is normally the primary side of the printed board when wave, dip or drag soldering is used. The destination side may be the secondary side of the printed board when hand-soldering operations are conducted. 1.8.2 Cold Solder Connection A solder connection that exhibits poor wetting, and that is characterized by a grayish porous appearance. (This is due to excessive impurities in the solder, inadequate cleaning prior to soldering, and/or the insufficient application of heat during the soldering process.) 1.8.3 Common Conductors Electrical conductors, e.g., contacts, printed conductors / traces, surfaces, terminals, wires, etc., that, by design, carry an identical electrical current, frequency, polarity, and/or potential (voltage), or that by design have identical or redundant electrical functions, e.g., signal, status, etc. 1 Acceptability of Electronic Assemblies 1 General (cont.) 1-4 September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
1.8.4 Diameter • Conductor Diameter The conductor diameter is the outside diameter of wire, either stranded or solid, without the insulation. • Wire Diameter Wire diameter is the outside diameter of wire, either stranded or solid, including insulation if present. • Strand Diameter The strand diameter is the outside diameter of the individual metal filament used within a stranded wire. 1.8.5 Electrical Clearance Throughout this document the minimum spacing between noncommon uninsulated conductors, e.g., patterns, materials, hardware, or residue, is referred to as ‘‘minimum electrical clearance.’’ It is defined in the applicable design standard or on the approved or controlled documentation. In the absence of a known design standard use Appendix A (derived from IPC-2221). Any violation of minimum electrical clearance is a defect condition for all classes. 1.8.6 Engineering Documentation Drawings, specifications, technical illustrations, and other documents, prepared and released by the design activity in any form of media, that establish the design and design requirements. 1.8.7 FOD (Foreign Object Debris) A generic term for a substance, debris, particulate matter or article alien to the assembly or system. 1.8.8 Form, Fit, Function (F/F/F) An identifying characteristic, e.g., a part, solder connection, sub-assembly, or assembly, that, if not met, would adversely impact installation, reliability or operation of adjacent parts, a next level assembly, or an integrated assembly or system. 1.8.9 High Voltage The term ‘‘high voltage’’ will vary by design and application. The high voltage criteria in this document are only applicable when specifically required in the drawings/procurement documentation. 1.8.10 Intrusive Solder A process in which the solder paste for the through-hole components is applied using a stencil or syringe to accommodate through-hole components that are inserted and reflow-soldered together with the surface-mount components. 1.8.11 Kink A tight or abrupt bend in a wire or component lead that visibly reduces the diameter (or thickness) of the conductor, and cannot be removed by straightening. 1.8.12 Locking Mechanism A method of preventing loosening or disconnection of a mated part, e.g., a fastener or connector, either by use of a device integral to the part, e.g., a polymer insert, a design feature, e.g., a spring clip, latch, twist detent, or push-pull, or an additive material, e.g., threadlocking adhesive, safety wire. 1.8.13 Manufacturer The individual, organization, or company responsible for the assembly process and verification operations necessary to ensure full compliance of assemblies to this standard. 1.8.14 Meniscus (Component) Sealant or encapsulant on a lead, protruding from the seating plane of the component. This includes materials such as ceramic, epoxy or other composites, and flash from molded components. 1.8.15 Noncommon Conductors Electrical conductors, e.g., contacts, printed conductors / traces, surfaces, terminals, wires, etc., that, by design, carry different electrical currents, frequencies, polarities, and/or potentials (voltages), or that by design have different electrical functions, e.g., signal, status, etc. From a visual inspection standpoint, it is difficult for an inspector to determine if two or more adjacent conductors are electrically common unless either the start or end point (termination) of each conductor is visually accessible. For this reason, ALL adjacent conductors should be treated as noncommon until identified otherwise by engineering documentation. 1.8.16 Nonfunctional Land A land that is not connected electrically to the conductive pattern on its layer. 1.8.17 Pin-in-Paste See 1.8.10 Intrusive Solder 1 Acceptability of Electronic Assemblies 1 General (cont.) IPC-A-610H September 2020 1-5 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
1.8.18 Solder Balls Solder balls are spheres of solder that remain after the soldering process. This includes small balls of solder paste that have splattered around the connection during the reflow process. 1.8.19 Standard Industry Practice (SIP) A commonly-used engineering design solution, manufacturing process / procedure, or assembly technique that has been accepted by industry as superior to other alternative(s), because repeated use has been demonstrated to produce a repeatable and common end result. Also referred to as ‘‘Industry Standard Practice (ISP)’’. 1.8.20 Stress Relief Slack in a component lead or wire that is formed in such a way as to minimize mechanical stresses. 1.8.21 Supplier The individual, organization or company which provides the Manufacturer (assembler) components (electronic, electromechanical, mechanical, printed boards, etc.) and/or materials (solder, flux, cleaning agents, etc.). 1.8.22 Tempered Leads Component terminations or pins heat treated to increase hardness, or incorporating hard, brittle plating layers. 1.8.23 Wire Overlap A wire/lead that is wrapped more than 360° and crosses over itself, i.e., does not remain in contact with the terminal post, Figure 6-57B. 1.8.24 Wire Overwrap A wire/lead that is wrapped more than 360° and remains in contact with the terminal post, Figure 6-57A. 1.8.25 User The individual, organization, company, contractually designated authority, or agency responsible for the procurement or design of electrical/electronic hardware, and having the authority to define the class of equipment and any variation or restrictions to the requirements of this standard, i.e., the originator/custodian of the contract detailing these requirements. 1.9 Requirements Flowdown When this standard is contractually required, the applicable requirements of this standard (including Product Class, see 1.3 Classification) shall be imposed on all applicable subcontracts, assembly drawing(s), documentation and purchase orders. Unless otherwise specified the requirements of this standard are not imposed on the procurement of commercial- off-the-shelf (COTS or catalog) assemblies or subassemblies. When a part is adequately defined by a specification, then the requirements of this standard should be imposed on the Manufacturer of that part only when necessary to meet end-item requirements. When it is unclear where flowdown should stop, it is the responsibility of the Manufacturer to establish that determination with the User. When an assembly, e.g., daughterboard, is procured, that assembly should meet the requirements of this standard. The connections from the procured assembly to the manufactured assembly shall meet the requirements of this standard. If the assembly is manufactured by the same Manufacturer, the solder requirements are as stated in the contract for the entire assembly. The design and workmanship of COTS items should be evaluated and modified as required to ensure the end-item meets contract performance requirements. Modifications shall meet the applicable requirements of this standard. 1.10 Personnel Proficiency All instructors, operators, and inspection personnel shall be proficient in the tasks to be performed. Objective evidence of that proficiency shall be maintained and available for review. Objective evidence should include records of training to the applicable job functions being performed, work experience, testing to the requirements of this standard, and/or results of periodic reviews of proficiency. Supervised on-the-job training is acceptable until proficiency is demonstrated. 1.11 Acceptance Requirements All products shall meet the requirements of the contracts, engineering documentation, applicable standards, and the requirements for the applicable Product Class specified herein. 1.11.1 Missing Parts and Components Missing parts and components shall be a defect for all Product Classes. 1.12 Inspection Methodology Accept and/or reject decisions shall be based on applicable documentation such as contract, drawings, specifications and referenced documents. 1 Acceptability of Electronic Assemblies 1 General (cont.) 1-6 September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
The use of any non-visual inspection methods, other than those already detailed in 8.3.12 Surface Mount Assemblies – Surface Mount Area Array and 8.3.13 Surface Mount Assemblies – Bottom Termination Components (BTC) are not specifically covered by this standard and shall be used as agreed between Manufacturer and User. The inspector does not select the class for the assembly under inspection, see 1.3 Classification. Documentation that specifies the applicable class for the assembly under inspection shall be provided to the inspector. Automated Inspection, e.g., AOI, AXI, is a viable support to visual inspection and complements automated test equipment. Many characteristics in this document can be inspected with an automated system. If the customer desires the use of industry standard requirements for frequency of inspection and acceptance, J-STD-001 is recommended for further soldering requirement details. 1.12.1 Lighting Lighting shall be adequate for the feature being inspected. Illumination at the surface of workstations should be at least 1000 lux [approximately 93 foot-candles]. Light sources should be selected to prevent shadows. Note: In selecting a light source, the color temperature of the light is an important consideration. Light ranges from 3000-5000 K enable users to distinguish conditions and colors of various printed board features and contaminates with increased clarity. 1.12.2 Magnification Aids For visual inspection, some individual specifications may call for magnification aids for examining printed board assemblies. The tolerance for magnification aids is ± 15% of the selected magnification power. Magnification aids, if used for inspection, shall be appropriate with the item by the being inspected. Unless magnification requirements are otherwise specified by contractual documentation, the magnifications in Tables 1-2, 1-3, and 1-4 are determined by the feature being inspected. If the presence of a defect cannot be determined at the appropriate magnification power defined in Tables 1-2, 1-3, or 1-4, the item is acceptable. The referee magnification power is intended for use only after a defect has been determined but is not completely identifiable at the inspection power. For assemblies with mixed land sizes, the greater magnification power may be used for the entire assembly. For assemblies with mixed wire sizes, the greater magnification power may be used. Table 1-2 Inspection Magnification (Land Width) Land Widths or Land Diameters1 Magnification Power Inspection Range Maximum Referee > 1 mm [0.04 in] 1.5X to 3X 4X > 0.5 to ≤ 1 mm [0.02 to 0.04 in] 3X to 7.5X 10X ≥ 0.25 to ≤ 0.5 mm [0.01 to 0.02 in] 7.5X to 10X 20X < 0.25 mm [0.01 in] 20X 40X Note 1. A portion of a conductive pattern used for the connection and/or attachment of components. 1 Acceptability of Electronic Assemblies 1 General (cont.) IPC-A-610H September 2020 1-7 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Table 1-3 Magnification Aid Applications For Wires And Wire Connections Wire Size AWG Diameter mm [inch] Magnification Power Inspection Range Maximum Referee larger than 14 AWG >1.63 mm [0.064 in] N/A 1.75X 14 to 22 AWG 1.63 – 0.64 mm [0.064 to 0.025 in] 1.5X – 3X 4X < 22 to 28 AWG < 0.64 mm – 0.32 mm [< 0.025 – 0.013 in] 3X – 7.5X 10X Smaller than 28 AWG < 0.32 mm [< 0.013 in] 10X 20X Table 1-4 Magnification Aid Applications – Other Cleanliness (with or without cleaning processes) Magnification not required, see Note 1 Cleanliness (no-clean processes) Magnification not required, see Note 1 Conformal Coating/Encapsulation, Staking Magnification not required, see Note 2 Marking Magnification not required, see Note 2 Other (component and wire damage, etc.) Magnification not required, see Note 1 Note 1. Visual inspection may require the use of magnification, e.g., when fine pitch or high-density assemblies are present, magnification may be needed to determine if contamination affects form, fit or function. Note 2. If magnification is used it is limited to 4X maximum. 1 Acceptability of Electronic Assemblies 1 General (cont.) 1-8 September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
The following documents of the issue currently in effect form a part of this document to the extent specified herein. IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001 IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits IPC-CH-65 Guidelines for Cleaning of Printed Boards and Assemblies IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies IPC-D-325 Documentation Requirements for Printed Boards IPC-A-600 Acceptability of Printed Boards IPC/WHMA-A-620 Requirements & Acceptance for Cable & Wire Harness Assemblies IPC-A-640 Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies IPC-TM-650 Test Methods Manual IPC-CM-770 Component Mounting Guidelines for Printed Boards IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments IPC-AJ-820 Assembly & Joining Handbook IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Board Assemblies IPC-HDBK-830 Guidelines for Design, Selection and Application of Conformal Coatings IPC-SM-840 Qualification and Performance of Permanent Solder Mask IPC-1602 Standard for Printed Board Handling and Storage IPC-2220-FAM Design Standards for Printed Boards IPC-6010-FAM IPC-6010 Printed Board Performance Specifications IPC-7093 Design and Assembly Process Implementation for Bottom Termination Components IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard IPC-7711/7721 Rework, Repair and Modification of Electronic Assemblies IPC-9691 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies EIA/IPC/JEDEC J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires J-STD-004 Requirements for Soldering Fluxes IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices IPC/JEDEC J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture Sensitive Surface Mount Devices ECA/IPC/JEDEC J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes 1. www.ipc.org 2. www.ipc.org 2 Applicable Documents 2 Applicable Documents 2.1 IPC Documents1 IPC-A-610H September 2020 2-1 2.2 Joint Industry Documents2 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
ANSI/ESD-S-20.20 Protection of Electrical and Electronic Parts, Assemblies and Equipment IEC 61340-5-1 Electrostatics – Part 5-1: Protection of Electronic Devices From Electrostatic Phenomena – General Requirements IEC 61340-5-2 Electrostatics – Part 5-2: Protection of Electronic Devices From Electrostatic – User Guide IEC 61340-5-3 Electrostatics – Part 5-3: Protection of Electronic Devices from Electrostatic Phenomena – Properties and Requirements Classification for Packaging Intended for Electrostatic Discharge Sensitive Devices ASTM E29 Standard Practice for Using Significant Digits in Test Data to Determine Conformance with Specifications ASTM SI 10 American National Standard for Metric Practice MIL-STD-1130 Department of Defense Standards Practice: Connections, Electrical, Solderless, Wrapped MIL-STD-1686 Electrostatic Discharge Control Program For Protection Of Electrical And Electronic Parts, Assemblies And Equipment (Excluding Electrically Initiated Explosive Devices) MIL-STD-2073 Standard Practice for Military Packaging AS22759 Wire, Electrical, Fluoropolymer-Insulated, Copper or Copper Alloy AS9146 Foreign Object Damage (FOD) Prevention Program – Requirements for Aviation, Space, and Defense Organizations 3. www.esda.org 4. www.iec.ch 5. www.astm.org 6. www.sae.org 2 Applicable Documents 2.3 Electrostatic Association Documents3 2-2 September 2020 IPC-A-610H 2.5 ASTM5 2.6 Military Standards 2.7 SAE International6 2.4 International Electrotechnical Commission Documents4 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
See Appendix B for information on EOS/ESD and Other Handling Considerations. 3 Handling Electronic Assemblies 3 Handling Electronic Assemblies IPC-A-610H September 2020 3-1 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
This Page Intentionally Left Blank 3 Handling Electronic Assemblies 3-2 September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
This section illustrates several types of hardware used to mount electronic devices to an assembly or any other types of assemblies requiring the use of any of the following: screws, bolts, nuts, washers, fasteners, clips, component studs, tie downs, rivets, connector pins, etc. This section is primarily concerned with visual assessment of proper securing (tightness), and also with damage to the devices, hardware, and the mounting surface that can result from hardware mounting. Note: Criteria in this section do not apply to attachments with self-tapping screws. Visual inspection is performed in order to verify the following conditions: a. Correct parts and hardware. b. Correct sequence of assembly. c. Correct security and tightness of parts and hardware. d. No discernible damage. e. Correct orientation of parts and hardware. The following topics are addressed in this section. 4.1 Hardware Installation ............................................ 4-2 4.1.1 Electrical Clearance ........................................... 4-2 4.1.2 Interference ....................................................... 4-3 4.1.3 Component Mounting – High Power ................. 4-4 4.1.4 Heatsinks .......................................................... 4-6 4.1.4.1 Insulators and Thermal Compounds ................. 4-6 4.1.4.2 Contact ............................................................. 4-7 4.1.5 Threaded Fasteners and Other Threaded Hardware .......................................... 4-8 4.1.5.1 Torque ............................................................ 4-10 4.1.5.2 Solid Wires ...................................................... 4-12 4.1.5.3 Stranded Wires ............................................... 4-14 4.2 Jackpost Mounting .............................................. 4-15 4.3 Connector Pins .................................................... 4-16 4.3.1 Edge Connector Pins ...................................... 4-16 4.3.2 Press Fit Pins .................................................. 4-16 4.3.2.1 Land/Annular Ring .......................................... 4-18 4.3.2.2 Soldering ......................................................... 4-19 4.4 Wire Bundle Securing ......................................... 4-20 4.5 Routing – Wires and Wire Bundles .................... 4-20 4 Hardware 4 Hardware IPC-A-610H September 2020 4-1 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Also see 1.8.5 Electrical Clearance. Acceptable – Class 1,2,3 • Spacing between noncommon conductors does not violate specified minimum electrical clearance (3). This is shown in Figure 4-1 as the distances between (1) & (2) and (1) & (5). Defect – Class 1,2,3 • Hardware reduces spacing to less than specified minimum electrical clearance. 3 1 2 4 1 3 5 Figure 4-1 1. Metallic hardware 2. Conductive pattern 3. Specified minimum electrical clearance 4. Mounted component 5. Conductor 1 2 3 4 5 1 3 Figure 4-2 1. Metallic hardware 2. Conductive pattern 3. Spacing less than electrical clearance requirements 4. Mounted component 5. Conductor 4 Hardware 4.1 Hardware Installation 4-2 September 2020 IPC-A-610H 4.1.1 Hardware Installation – Electrical Clearance Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Acceptable – Class 1,2,3 • Mounting area clear of obstructions to assembly requirements. Defect – Class 1,2,3 • Excess solder (uneven) on mounting holes where mechanical assembly will be affected. • Anything that interferes with mounting of required hardware. Figure 4-3 4 Hardware 4.1.2 Hardware Installation – Interference IPC-A-610H September 2020 4-3 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Figures 4-4 and 4-5 show typical mounting parts. Acceptable – Class 1,2,3 • Hardware in proper sequence. • Leads on components attached by fastening devices are not clinched (not shown). • Insulating washer provides electrical isolation when required. • Thermal compound, if used, does not interfere with formation of required solder connections. Note: Where a thermal conductor is specified, it is placed between mating surfaces of the power device and the heat sink. Thermal conductors may consist of a thermally conductive washer or of an insulating washer with a thermally conductive compound. 1 2 3 4 5 6 7 1 Figure 4-4 1. Metal 2. Terminal lug 3. Component case 4. Nut 5. Lock washer 6. Screw 7. Nonmetal 1 2 3 2 4 5 6 Figure 4-5 1. High-power component 2. Insulating washer (when required) 3. Heat sink (may be metal or nonmetal) 4. Terminal lug 5. Lock washer 6. Insulator sleeve 4 Hardware 4.1.3 Hardware Installation – Component Mounting – High Power 4-4 September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Defect – Class 1,2,3 • Improper hardware sequence, see Figure 4-6. • Sharp edge of washer is against insulator, see Figure 4-7. • Hardware is not secure. • Thermal compound, if used, does not permit formation of required solder connections. 1 Figure 4-6 1. Lock washer between terminal lug and component case 1 2 3 Figure 4-7 1. Sharp edge of washer against insulator 2. Terminal lug 3. Metal heat sink 4 Hardware 4.1.3 Hardware Installation – Component Mounting – High Power (cont.) IPC-A-610H September 2020 4-5 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
This section illustrates various types of heatsink mounting. Visual inspection includes hardware security, component damage, and correct sequence of assembly. Acceptable – Class 1,2,3 • Not uniform but evidence of mica, plastic film or thermal compound showing around edges of component. Defect – Class 1,2,3 • No evidence of insulating materials, or thermal compound (if required). • Thermal compound precludes formation of required solder connection. Figure 4-8 Figure 4-9 4 Hardware 4.1.4 Hardware Installation – Heatsinks 4-6 September 2020 IPC-A-610H 4.1.4.1 Hardware Installation – Heatsinks – Insulators and Thermal Compounds Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Acceptable – Class 1,2,3 • Component not flush, see Figure 4-10-A. • Minimum 75% contact with mounting surface. Defect – Class 1,2,3 • Component has less than 75% contact with mounting surface, see Figure 4-11-A. • Hardware is loose. A Figure 4-10 A Figure 4-11 4 Hardware 4.1.4.2 Hardware Installation – Heatsinks – Contact IPC-A-610H September 2020 4-7 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Both the order and orientation of mounting hardware need to be considered during assembly. Devices such as ‘‘star’’ or ‘‘tooth’’ washers may have one side with sharp edges intended to cut into the mating surface to keep the hardware from coming loose in operation. Figure 4-13 is an example of this kind of lock washer. Unless otherwise specified the sharp edges of the lock washer should be against the flat washer. Acceptable – Class 1,2,3 • Proper hardware sequence and orientation, see Figures 4-12 and 4-13. • Slot or hole are covered with flat washer, see Figure 4-14. Acceptable – Class 1 Defect – Class 2,3 • Less than one and one-half threads extend beyond the threaded hardware, e.g., nut, unless otherwise specified by engineering drawing. 1 2 2 3 4 3 4 1 Figure 4-12 1. Lock washer, sharp edge showing towards flat washer 2. Flat washer 3. Nonconductive material (laminate, etc.) 4. Metal (not conductive pattern or foil) 1 2 3 Figure 4-13 1. Solder lug 2. Flat washer 3. Lock washer, sharp edge towards flat washer 4 Hardware 4.1.5 Hardware Installation – Threaded Fasteners and Other Threaded Hardware 4-8 September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Defect – Class 1,2,3 • Thread extension interferes with adjacent component. • Hardware material or sequence not in conformance with drawing. • Lock washer against nonmetal/laminate. • Flat washer missing, see Figures 4-15 and 4-16. • Hardware missing or improperly installed, see Figure 4-17. • Hardware is not seated, see Figure 4-20. 1 2 3 2 3 1 Figure 4-14 1. Slot or hole 2. Lock washer 3. Flat washer 2 3 1 2 1 3 Figure 4-15 1. Lock washer 2. Nonmetal 3. Metal (not conductive pattern or foil) 1 2 Figure 4-16 1. Slot or hole 2. Lock washer Figure 4-17 4 Hardware 4.1.5 Hardware Installation – Threaded Fasteners and Other Threaded Hardware (cont.) IPC-A-610H September 2020 4-9 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
In addition to threaded fasteners used for installation of an item onto an assembly, there are other types of threaded items that may be used on individual parts within an assembly. These may require tightening to a specified torque value, or standard industry practice, to preclude loosening or part damage. Such items include, but are not limited to, connector coupling nuts, connector strain relief clamps/potting/molding boots, etc., fuse holder mounting nuts, and any other similar threaded items. Where torque requirements are not specified, follow standard industry practices. However, some of these threaded items may be made of plastic or other material that can be damaged if excessive torque is applied during assembly, and for these items, it may be necessary to tighten the item to a specified torque value. Acceptable – Class 1,2,3 • Fasteners are tight and split-ring lock washers, when used, are fully compressed. • No evidence of damage resulting from over-tightening of the threaded item. • Torque stripe on fasteners (witness/anti-tampering stripe), when required, see Figure 4-19: – Is continuous between the fastener and the substrate. – Extends from the top of the fastener onto the adjacent substrate (at minimum). – Is aligned with the center line of the fastener. – Is undisturbed (indicating no movement of the fastener and stripe after torquing). Figure 4-18 Figure 4-19 4 Hardware 4.1.5.1 Hardware Installation – Threaded Fasteners and Other Threaded Hardware – Torque 4-10 September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Defect – Class 1,2,3 • Split ring lock washer, if used, is not compressed, see Figure 4-20. • Hardware is loose, see Figure 4-20. • Evidence of damage to the parts being secured. • Required torque stripe is not continuous between the fastener and the substrate. • Required torque stripe does not extend from the top of the fastener onto the adjacent substrate (at minimum). • Required torque stripe is not aligned with the center line of the fastener. • Required torque stripe is disturbed (indicating movement of the fastener and stripe after torquing). Figure 4-20 Figure 4-21 Figure 4-22 4 Hardware 4.1.5.1 Hardware Installation – Threaded Fasteners and Other Threaded Hardware – Torque (cont.) IPC-A-610H September 2020 4-11 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Acceptable – Class 1,2,3 • 1/3 or less of the conductor diameter protrudes from under the screw head. • Mechanical attachment of the conductor is in contact between the screw head and the contact surface for a minimum of 180° around the screw head. • Conductor is not wrapped more than 360°. • Conductor extending outside the screw head does not violate minimum electrical clearance. • Wire wrapped in the correct direction. • No insulation in the contact area. Figure 4-23 W A D Ø D Ø Figure 4-24 A. Less than or equal to 1/3 D 4 Hardware 4.1.5.2 Hardware Installation – Threaded Fasteners and Other Threaded Hardware – Solid Wires 4-12 September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Defect – Class 1,2,3 • More than 1/3 of the conductor diameter protrudes from under the screw head (see Figure 4-25). • Conductor not wrapped around screw body for at least 180° (see Figure 4-26-A). • Conductor is wrapped more than 360° (see Figure 4-27-A). • Conductor wrapped in wrong direction (see Figure 4-27-B). • Insulation in the contact area (see Figure 4-27-C). D Ø A Figure 4-25 A. Overhang greater than 1/3 D D Ø 0º <180º A A Figure 4-26 Figure 4-27 4 Hardware 4.1.5.2 Hardware Installation – Threaded Fasteners and Other Threaded Hardware – Solid Wires (cont.) IPC-A-610H September 2020 4-13 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Acceptable – Class 1,2,3 • Less than 1/3 of the conductor diameter protrudes from under the screw head. • Conductor extending outside the screw head does not violate minimum electrical clearance. • Mechanical attachment of the conductor is in contact between the screw head and the contact surface for a minimum of 180° around the screw head. • No insulation in the contact area. • Conductor is not wrapped more than 360°. Defect – Class 1,2,3 • Conductor not wrapped around screw body for at least 180° (not shown). • Stranded conductor was tinned (not shown). • More than 1/3 of the conductor diameter protrudes from under the screw head (see Figure 4-29). • Stranded conductor wrapped in wrong direction (tightening the screw unwinds the twisted conductor) (see Figure 4-30-B). • Insulation in the contact area (see Figure 4-30-C). D 270º A A Figure 4-28 D Figure 4-29 Figure 4-30 4 Hardware 4.1.5.3 Hardware Installation – Threaded Fasteners and Other Threaded Hardware – Stranded Wires 4-14 September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
This section covers the height relationship of the face of the jackpost to the associated connector face. This is critical to obtain maximum connector pin contact. Note: ‘‘C’’ style retaining clips will add the thickness of the clip to the jackpost height. Note: A trial mating may be required for final acceptance. Acceptable – Class 1,2,3 • The jackposts can be above or below the face of the connector, depending on the design, providing the connector and jackposts mate correctly. • Height is obtained by adding or removing washers in accordance with the connector manufacturer’s instructions. Defect – Class 1,2,3 • The jackposts are above or below the face of the connector, depending on the design, and the connector and jackposts do not mate correctly. (No figure showing the defect condition.) Figure 4-31 Figure 4-32 Figure 4-33 4 Hardware 4.2 Jackpost Mounting IPC-A-610H September 2020 4-15 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
This section covers two types of pin installations; edge connector pins and press fit connector pins. Installation of these devices is usually done with automated equipment. Visual inspection of this mechanical operation includes: correct pins, damaged pins, bent and broken pins, damaged spring contacts and damage to the substrate or conductive pattern. For connector mounting criteria, see 7.1.8 Component Mounting – Connectors. For connector damage criteria, see 9.5 Connectors. IPC-T-50 defines annular ring (annular width) as that portion of conductive material completely surrounding a hole. Acceptable – Class 1,2,3 • Contact is contained within the insulator, see Figure 4-34-A. • Gap is within specified tolerance, see Figure 4-34-B. Note: To provide allowance for an extraction tool, the gap between the contact shoulder and the land needs to be adequate for each manufacturer’s repair tooling. Defect – Class 1,2,3 • Contact is above insulator, see Figure 4-34-C. • Gap between contact shoulder and land is greater than specified, see Figure 4-34-B. Acceptable – Class 1,2,3 • Pins are bent off center by 50% pin thickness or less. • Pin height is within tolerance. Note: Nominal height tolerance is per pin connector or master drawing specification. The connector pins and mating connector must have a good electrical contact. B C A Figure 4-34 Figure 4-35 1. Pin height tolerance 2. Less than 50% pin thickness 4 Hardware 4.3 Connector Pins 4-16 September 2020 IPC-A-610H 4.3.2 Connector Pins – Press Fit Pins 4.3.1 Connector Pins – Edge Connector Pins Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Defect – Class 1,2,3 • Pin is bent out of alignment – bent off center greater than 50% pin thickness, see Figure 4-36. • Pin visibly twisted, see Figure 4-37. • Pin height is out of tolerance as to specification, see Figure 4-38. Figure 4-36 Figure 4-37 Figure 4-38 4 Hardware 4.3.2 Connector Pins – Press Fit Pins (cont.) IPC-A-610H September 2020 4-17 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Acceptable – Class 1,2 • Protrusion side annular ring lifted less than or equal to 75% of the width (W) of the annular ring, Figure 4-39. Acceptable – Class 2 • No visual evidence of lifted annular land on insertion side. Acceptable – Class 3 • No lifted or fractured annular rings. Defect – Class 1,2 • Any protrusion side functional annular ring lifted more than 75% of the width (W). Defect – Class 2 • Any evidence of lifted annular ring on the insertion side. Defect – Class 3 • Any lifted or fractured annular rings with press fit pins. Figure 4-39 1. Annular ring lifted 75% of the width (W) or less 2. Annular ring with conductor 3. Annular ring not fractured 4. Annular ring lifted, fractured but firmly attached annular ring without conductor (nonfunctional) Figure 4-40 1. Annular ring fractured 2. Functional annular ring lifted greater than 75% of annular ring width (W) 3. Annular ring lifted 4 Hardware 4.3.2.1 Connector Pins – Press Fit Pins – Land/Annular Ring 4-18 September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,
The term ‘‘press fit pins’’ is generic in nature and many types of pressure inserted pins, e.g., connector, staked, etc., are not intended to be soldered. If soldering is required the following criteria are applicable. Acceptable – Class 1,2 • Solder fillet or coverage (protrusion side) is present on two adjacent sides of the pin. Acceptable – Class 3 • A 330° solder fillet is evident on the protrusion side of the assembly. Note: Solder fillet or fill on insertion side is not required. Acceptable – Class 1 • Solder wicking is permitted above 2.5 mm [0.1 in] on sides of pins provided there is no solder buildup that interferes with subsequent attachments to the pin. Acceptable – Class 2,3 • Solder wicking on sides of pins is less than 2.5 mm [0.1 in], provided the solder does not interfere with subsequent attachments to the pin. 1 2 3 4 5 Figure 4-41 1. Bottom view 2. Side view 3. Land 4. Top view 5. Printed board 2.5 mm [0.1 in] Figure 4-42 4 Hardware 4.3.2.2 Connector Pins – Press Fit Pins – Soldering IPC-A-610H September 2020 4-19 Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---
Defect – Class 1,2 • Solder fillet or coverage is evident on less than two adjacent sides of the pin on the protrusion side. Defect – Class 3 • Less than 330° solder fillet on the protrusion side of the assembly. Defect – Class 1,2,3 • Solder build up interferes with subsequent attachments to the pin. Defect – Class 2,3 • Solder wicking exceeds 2.5 mm [0.1 in]. Criteria can be found in IPC/WHMA-A-620. Criteria can be found in IPC/WHMA-A-620. 1 2 3 4 5 Figure 4-43 1. Bottom view 2. Side view 3. Land 4. Top view 5. Printed board 4 Hardware 4.3.2.2 Connector Pins – Press Fit Pins – Soldering (cont.) 4.4 Wire Bundle Securing 4.5 Routing – Wires and Wire Bundles 4-20 September 2020 IPC-A-610H Copyright IPC Provided by IHS Markit under license with IPC, Copyright IPC International, Licensee=Flextronics/5971050001, User=liu, bennyle No reproduction or networking permitted without license from IHS Not for Resale, 12/07/2020 01:47:59 MST --````````,`,,,`,,,,,,,,`,`,`,,-`-`,,`,,`,`,,`---