TABLE OF CONTENTS: Thermally Conductive Sheet section A ...

DENKA Thermal Interface Materials 2007.1

Technical Information

TABLE OF CONTENTS:
Thermally Conductive Sheet .............. section A
Thermally Conductive Spacer ............ section B
Thermally Conductive Grease ............ section C
Phase Change Material ....................... section D
Elethermal Adhesive Tape .................. section E

Section A: DENKA Thermally Conductive Sheet

Technical Information 2007.1

DENKA Thermally Conductive Sheet is an insulating Thermally Conductive Sheet made from DENKA
boron nitride and silicone rubber. This material was created based on DENKA's boron nitride manufacturing
technologies and the technologies accumulated by DENKA as a maker of synthetic rubber over the course
of many years.
The excellent thermal conductivity and electrical insulation characteristics of this material make it an ideal
material for the insulating and heat dissipating sheets for semiconductors such as transistors and diodes.
This sheet is also reinforced by glass fiber, so it can be used confidently without fears regarding its strength.

■ General overview of DENKA Thermally Conductive Sheet

The BFG type is a highly thermally conductive type insulating sheet. It provides outstanding long-term
reliability and is utilized in various power supplies and automotive electrical equipment, etc.

The BS type maintains the excellent characteristics of the BFG type while providing greater flexibility and
strength to make it more difficult to tear during fastening.

The M type is a general purpose type insulating sheet. It is utilized widely in various fields where heat
dissipation is not so necessary.

The LD type , LR type and LF type are insulating sheets with thermal characteristics which are in the
middle between those of the BFG and M types.

■ Characteristics of DENKA Thermally Conductive Sheet 2

1) Since this material is flexible, it is easy for it to mate the surface of devices without the use of
thermally conductive grease. It is difficult for it to crack compared to mica or porcelain, etc. , and
can be used stably for long periods of time.

2) Thermal conductivity is excellent,so thermal resistance is extremely low.This contributes to product
size reduction.

3) Mechanical strength is greatly enhanced by the use of glass fiber.This reduces the risk of the sheet
tearing while it is being mounted.

4) Since thermally conductive grease is not required, the grease application process can be omitted
and there is no danger of contamination.

5) Stable heat dissipation characteristics can be obtained even with low tightening torques.

6) Its dielectric constant is approximately half of that of mica.

Section A: DENKA Thermally Conductive Sheet

Technical Information 2007.1

■ Major uses of DENKA Thermally Conductive Sheet

• electrically insulating and heat dissipating sheets for semiconductor elements such as power transistors,
diodes, thyristors, etc. (switching power supplies, UPSs, audio-visual equipment, computers, communication
equipment, switchboards, measuring instruments etc.).
• heat dissipating spacers for electronic parts such as thick-film Ics, DIPICs, etc., in substitution of for mica
sheets and silicone grease.
• electrically insulating and heat dissipating sheets used in conjunction with heat pipes.

■ BFG

BFG type is a thermally-conductive and electrically-insulating sheet made of silicone and reinforced with
fiberglass. Having excellent thermal conduction and electrical insulation properties, it can be said to be ideal
for heat dissipation material used with power semiconductors. Adhesive type is available (BFG-AD).

table: general properties of BFG type unit BFG20 BFG30 BFG45 BFG80
Item test method

Appearance - - green white white white
Color - mm 0.20 0.30 0.45 0.80
Thickness - g / cm3
Specific gravity - Shore A 25 1.7
Hardness JIS K6301 MPa 117 88
Tensile strength JIS K6301 KN / m 1.2 20 14 9
Tear strength - ø mm 0.8 88 59 39
Foldability - µg / mm2 1.2 3.1 > 5
Water absorption (1day) - - 1.5 1.6 1.6
Reinforcement layer UL94 - fiberglass
Flammability V-0 (file no. E49895)

Properties

TO-3 Rth thermal resistance Denka °C / W 0.18 0.20 0.25 0.36
TO-3 Rth (adhesive type) Denka °C / W 0.30 0.32 0.35 0.44
TO-3P Rth thermal resistance Denka °C / W 0.37 0.42 0.51 0.77

Thermal conductivity Denka W / (m·K) 4.1

Dielectric withstand voltage JEM 1021 KV AC 1.0 3.0 4.0 5.0

Dielectric breakdown voltage JIS C2110 KV AC 3.0 6.5 9.0 > 10

Volume resistivity JIS C2123 1015 Ω·cm 1.9 2.4 3.3 4.1

Dielectric constant @ 1 MHz - 3.6

(*) diameter of the smallest metal column around which the sheet has no crack when entwined around 3

Section A: DENKA Thermally Conductive Sheet

Technical Information 2007.1

■ Electrical and thermal properties selection chart

8
Dielectric breakdown voltage for a
0.3 mm thick interface [ KV AC ] 7- BFG LF

6- M
LD
BFG-A BS

5-

4

0 0.25 0.50 0.75 1.00 1.25

Thermal resistance (Rth ) for a TO3-P 0.3 mm thick interface [ °C / W ]

■ BFG-A

BFG-A type is a is a thermally-conductive and electrically-insulating sheet made of silicone; it is a new grade
by which the thermal performance was improved more than BFG. The other properties of BFG-A type are
almost the same ones of those of BFG type, the main differences are listed in the table below.

table: general properties of BFG-A type

Item test method unit BFG20A BFG30A BFG45A BFG80A

Appearance

Color -- white

Thickness - mm 0.20 0.30 0.45 0.80

Specific gravity - g / cm3 1.7

Hardness - Shore A 90 90 89 88

Tensile strength JIS K6301 MPa 9 8 5 4

Tear strength JIS K6301 KN / m 41 37 26 18

Foldability - ø mm 1.0 1.2 1.2 3.1

Water absorption (1day) - µg / mm2 0.18 0.6 0.1 0.12

Reinforcement layer - - fiberglass

Flammability UL94 - V-0 (file no. E49895)

Properties Denka °C / W 0.12 0.15 0.19 0.30
TO-3 Rth thermal resistance Denka °C / W 0.28 0.29 0.32 0.66
TO-3P Rth thermal resistance

Thermal conductivity Denka W / (m·K) 5.0

Dielectric withstand voltage JEM 1021 KV AC 1.0 3.0 4.0 5.0

Dielectric breakdown voltage JIS C2110 KV AC 3.0 6.0 9.0 > 10

Volume resistivity JIS C2123 1015 Ω·cm 1.7 7.9 9.2 8.9

Dielectric constant @ 1 MHz - 2.0

(*) diameter of the smallest metal column around which the sheet has no crack when entwined around 4

Section A: DENKA Thermally Conductive Sheet

Technical Information 2007.1

■ Thermal resistance measurement (JIS K6911)

TO-3 Heater block

Heater Thermocouple
T1
Thermal T1 - T2 (°C)
T2 resistance = Heat transfer amount (W)
(°C / W)

Specimen Cooling water

■ BS

BS type is a thermally conductive and electrically insulated sheet made of silicone. Respect to BFG types, it
has better foldability, tear strength and mechanical resistance.

table: general properties of BS type

Item test method unit BS20 BS30 BS45 BS80

Appearance

Color -- green

Thickness - mm 0.20 0.3 0 0.45 0.80

Specific gravity - g / cm3 1.7 1.6 1.6 1.6

Hardness - Shore A 88 89 89 88

Tensile strength JIS K6301 MPa 25 18 13 9

Tear strength JIS K6301 KN / m 117 88 59 39

Foldability (*) - ø mm / (**) / (**) / (**) 0.1

Water absorption (1day) - µg / mm2 0.7 1.5 2.2 3.1

Reinforcement layer - - fiberglass

Flammability UL94 - V-0 (file no. E49895)

Properties Denka °C / W 0.19 0.21 0.26 0.37
TO-3 Rth thermal resistance Denka °C / W 0.40 0.45 0.54 0.79
TO-3P Rth thermal resistance Denka W / (m·K)
Thermal conductivity 3.9

Dielectric withstand voltage JEM 1021 KV AC 1.0 3.0 4.0 5.0

Dielectric breakdown voltage JIS C2110 KV AC 3.0 5.1 7.8 > 10

Volume resistivity JIS C2123 1015 Ω·cm 1.8 2.6 2.5 1.8

Dielectric constant @ 1 MHz - 3.5

(*) diameter of the smallest metal column around which the sheet has no crack when entwined around

(**) completely foldable 5

Section A: DENKA Thermally Conductive Sheet

Technical Information 2007.1

■ Shapes of DENKA Thermally Conductive Sheet

DENKA Thermally Conductive Sheet is available as a standard part with a shape that matches the shapes
of various transistors (TO-66, TO-3, TO-30, standard TO-220, enlarged TO-220, TO-220 with enlarged
screwing hole, TO-3P, TO-126, standard TO-3PL, enlarged TO-3PL, TO-3PII, enlarged TO-3PII), though it is
also possible to make sheets in any desired shape. Contact your local sales representative for details.

■M

M type is a general purpose type insulating sheet. Adhesive type is available (M-AD).

table: general properties of M type

Item test method unit M20 M30 M45 M80

Appearance

Color -- yellow

Thickness - mm 0.20 0.3 0 0.45 0.80

Specific gravity - g / cm3 1.9 1.9 2.0 2.0

Hardness - Shore A 91 91 90 90

Tensile strength JIS K6301 MPa 28 24 26 20

Tear strength JIS K6301 KN / m 127 98 107 68

Foldability (*) - ø mm 0.8 1.2 2.5 1.5

Water absorption (1day) - µg / mm2 0.6 1.8 1.2 2.0

Reinforcement layer - - fiberglass

Flammability UL94 - V-0 (file no. E49895)

Properties

TO-3 Rth thermal resistance Denka °C / W 0.43 0.64 0.80 1.07
TO-3 Rth (adhesive type) Denka °C / W 0.56 0.77 0.91 1.10
TO-3P Rth thermal resistance Denka °C / W 0.86 1.27 1.59 2.10

Thermal conductivity Denka W / (m·K) 1.4

Dielectric withstand voltage JEM 1021 KV AC 1.0 3.0 4.0 5.0

Dielectric breakdown voltage JIS C2110 KV AC 2.4 5.5 8.5 > 10

Volume resistivity JIS C2123 1015 Ω·cm 1.7 1.7 2.8 2.6

Dielectric constant @ 1 MHz - 4.0

(*) diameter of the smallest metal column around which the sheet has no crack when entwined around

6

Section A: DENKA Thermally Conductive Sheet

Technical Information 2007.1

■ Special features of DENKA Thermally Conductive Sheet

• for its flexibility, the sheet can be stuck to the mating surface with no use of heat-dissipating grease.
Moreover, cracks are difficult to appear in comparison with mica, ceramics and the similar interfaces, giving
the final assembly long-term reliability characteristics.
• thanks to its excellent thermal conductivity, the thermal resistance is extremely low, thus contributing to
product miniaturisation.
• some types of Thermally Conductive Sheets are reinforced with fiberglass, in order to remarkably improve
the mechanical strength.
• with no use of heat-dissipation grease, the sheet can save the process of grease coating, this preventing
from contamination.
• stabilised thermal dissipation properties can be obtained with a lower clamping force.
• the dielectric constant is approximately one half of that of mica interfaces.

■ LD

LD type is a thermally-conductive and electrically-insulating sheet made of silicone. It has excellent thermal
conduction and electrical insulation properties, so that it can be said to be ideal for heat dissipation
materials used with semiconductors such as transistors, diodes, and so on.

table: general properties of LD type

Item test method unit LD20 LD30 LD45 LD85

Appearance

Color -- grey

Thickness - mm 0.20 0.30 0.45 0.85

Specific gravity - g / cm3 2.7

Hardness - Shore A 77 77 79 80

Tensile strength JIS K6301 MPa 3 3 3 3

Tear strength JIS K6301 KN / m 57 67 64 79

Foldability (*) - ø mm 1.2 1.2 1.5 3.1

Water absorption (1day) - µg / mm2 0.04 0.08 0.12 0.12

Reinforcement layer - - not reinforced

Properties Denka °C / W 0.29 0.36 0.48 0.74
TO-3 Rth thermal resistance Denka °C / W 0.75 1.02 1.22 1.56
TO-3P Rth thermal resistance Denka W / (m·K)
Thermal conductivity 2.1

Dielectric withstand voltage JEM 1021 KV AC - - - -

Dielectric breakdown voltage JIS C2110 KV AC 3.0 5.0 8.0 9.0

Volume resistivity JIS C2123 1013 Ω·cm 1.5 6.0 5.4 7.7

Dielectric constant @ 1 MHz - 3.0 3.0 4.0 4.0

Flammability UL94 - V-0 (file no. E49895)

(*) diameter of the smallest metal column around which the sheet has no crack when entwined around 7

Section A: DENKA Thermally Conductive Sheet

Technical Information 2007.1

■ LF and LR

LF type is a general purpose type insulating sheet with good thermal and electrical characteristics. Adhesive
type is available (LF-AD).
LR has excellent thermal conduction and electrical insulation properties, so that it can be said to be ideal for
heat dissipation material used with semiconductors such as transistors, diodes, and so on. The production
format of LR is roll and it is easy to handle.

table: general properties of LF and LR types

Item test method unit LF30 LF45 LR20

Appearance

Color - - grey grey yellow

Thickness - mm 0.30 0.45 0.20

Specific gravity - g / cm3 1.8 1.8 -

Hardness - Shore A 90 90 -

Tensile strength (X) , (O) MPa 18 (X) 16 (X) 18 (O)

Tear strength (X) , (OO) KN / m 78 (X) 69 (X) 52 (OO)

Foldability (*) - ø mm 1.2 1.5 -

Water absorption (1day) - µg / mm2 1.2 1.8 -

Reinforcement layer - - fiberglass

Properties Denka °C / W 0.40 0.50 0.38
TO-3 Rth thermal resistance Denka °C / W - - -
TO-3 Rth (adhesive type) Denka °C / W 0.80 0.90 -
TO-3P Rth thermal resistance Denka W / (m·K) 2.3 2.3 2.3
Thermal conductivity

Dielectric withstand voltage JEM 1021 KV AC 3.0 4.0 1.0
Dielectric breakdown voltage JIS C2110 KV AC 7.5 > 10 2.0
Volume resistivity ($) , (&) 1015 Ω·cm 3.4 3.2 2.0

Dielectric constant @ 1 MHz - 3.8 3.8 -

Flammability UL94 - V-0 (file no.E49895) V-0 level

(X) JIS K6301 test method (O) JIS K6251 test method (OO) JIS K6252 test method

(*) diameter of the smallest metal column around which the sheet has no crack when entwined around

($) JIS C2123 test method (&) JIS K6271 test method

8

Section B: DENKA Thermally Conductive Spacer

Technical Information 2007.1

DENKA Thermally Conductive Spacer is electrically insulating and heat dissipating spacer with excellent
thermal conductivity and extreme softness, prepared through the full use of technical expertise DENKA has
accumulated in the history of Thermally Conductive Sheet production. It effectively dissipates heat from
electronic parts.
As the performance of the latest electronics products has been raised to ever higher levels, the amount of
heat radiated by MPU, SRAM and other components has continued to increase, and although makers have
been searching for heat dissipating materials which have high thermal conductivity and flexibility, the
thermal conductivity of heat dissipation materials has so far been inadequate and the materials with a high
thermal conductivity have not been sufficiently flexible.
DENKA Thermally Conductive Spacers meet the needs for both thermal conductivity and flexibility, with the
ability to adhere tightly to the electronic parts with a minimal load and conduct the heat efficiently to the heat
sink fins and other parts.

■ Development of DENKA Thermally Conductive Spacer

1) Unlike the somewhat hard rubber based sheets that were used previously, flexible heat dissipating parts 9
with a gel base have recently been introduced for use mainly in notebook personal computers and game
devices. This Thermally Conductive Spacer conducts heat away from heat generating parts such as the
CPU and memory devices to the heat sink or the outer case while adapting the uneven surface of the
product.
DENKA has developed various grades of Thermally Conductive Spacer with a broad range of
characteristics from high thermal conductivity to high compressibility.

2) As a means of improving thermal conductivity, DENKA has utilized its own inorganic filler technology to
improve thermal conductivity, and by using various inorganic fillers such as BN powder, the goal of
reaching a maximum of 16 W /(m·K) , making the thermal conductivity higher than ever before, has been
reached.

3) If this type of spacer is used as a heat dissipating material for
BGA, heat dissipation would become possible while reducing the
load on the BGA and high connection reliability would be obtained.
In the midst of efforts to make equipment smaller in size while
increasing performance, it is expected that heat dissipation will
become a more and more important subject. DENKA will carry
on studies of heat dissipation systems overall while working to
utilize its own inorganic filler technologies to the maximum limit, in
order to develop products that meet the needs of our customers.

Section B: DENKA Thermally Conductive Spacer

Technical Information 2007.1

thermal conductivity [ W / (m·K) ] 16 - FSB-G

8-

6-

FSA-D

4-

FSL-B

2 - FSL-BH FSL-D FSL-BS
FSL-F3
FSL-G FSL-E
FSL-A

0 10 20 30 40

compressibility (%) at 9.8·10-2 Mpa = 14.3 psi

The FSB series is an outstanding heat dissipating material which has an excellent thermal conductivity of 16
[W / (m·K)] , as well as flexibility and insulation characteristics.

The FSA-D is still an excellent heat dissipating material, with a thermal conductivity of 5 [W / (m·K)].

The FSL series is an insulating and heat dissipating material which has good compressibility, thermal
conductivity (in the range between 1.1 and 3 W/ m·K), and outstanding handling characteristics,so that it
can be said to be ideal for heat dissipation material used in electric devices such as MPU, SRAM, and so on.

The very good compression characteristics of either FSL-BS and FSL-F3, make those materials ideal for a
thermal match of surfaces with some larger tolerances on roughness and surface planarity,

table: representative values of DENKA FSB-G , FSA-D, FSL-A , FSL-F3 Thermally Conductive Spacers

Item test method unit FSB-G FSA-D FSL-A FSL-F3

Properties

Inherent surface tack - # of sides 0 0 2 2

Thermal conductivity Denka W / (m·K) 16 5 1.5 1.1

Breakdown voltage JIS C2110 KV / mm - 10 10 10

Volume resistivity JIS C2123 1013 Ω·cm - 1 1 1

Dielectric constant @ 1 MHz - 4.2 - 4.2 -

Appearance

Color - - white grey blue grey

Thickness - 10-1 mm 3, 5, 10 (, 15, 20, 25, 30, 35, 40, 45, 50 FSL ONLY)

Specific gravity - g / cm3 1.7 2.4 2.5 1.7

Hardness - Asker C 36 43 45 -

Compressibility @9.8·10-2 MPa % 15 10 10 25

Flammability UL-94 - V-0 (file no.E49895) V-0 10

Section B: DENKA Thermally Conductive Spacer

Technical Information 2007.1

table: representative values of DENKA FSL-B, FSL-BH, FSL-BS and FSL-D Thermally Conductive Spacers

Item test method unit FSL-B FSL-BH FSL-BS FSL-D

Properties

Inherent surface tack - # of sides 2

Thermal conductivity Denka W / (m·K) 3 3 2.5 2.5

Breakdown voltage JIS C2110 KV / mm 10

Volume resistivity JIS C2123 1013 Ω·cm 1

Dielectric constant @ 1 MHz - 4.2 - - 5.5

Appearance

Color -- blue

Thickness - 10-1 mm 3, 5, 10, 15, 20, 25, 30 (, 50 FSL-BH ONLY)

Specific gravity - g / cm3 2.8 2.8 2.8 2.7

Hardness - Asker C 25 30 8 30

Compressibility @9.8·10-2 MPa % 15 10 30 15

Flammability UL-94 - V-0 (file no. E49895)

■ Compressibility to loading weight of the FSL-B type

table: compressibility to each loading weight (%) for the FSL-B type Thermally Conductive Spacer

0.01 MPa 0.1 MPa 0.2 MPa 0.3MPa 0.4 MPa 0.5 MPa

FSL050B 3.4 10.2 15.3 19.1 22.9 26.8

FSL100B 3.6 13.3 19.3 23.3 27.3 31.3

FSL200B 3.9 17.3 24.3 30.3 34.3 38.3

FSL300B 4.5 20.4 28.1 34.0 38.3 42.1

11

Section C: DENKA Thermally Conductive Grease

Technical Information 2007.1

■ GFC

GFC grades are silicone oil compounds that exhibit high thermal conductivity between devices and heat-
sinks. Providing excellent thermal conductivity, they are especially designed for high performance semi-
conductor elements such as MPU, SRAM, etc.

table: general properties of GFC grades

Item unit GFC-F1 GFC-G1 GFC-H4 GFC-H6 GFC-K4
grey
Color - light plum white grey grey
2.6
Shape - grease 190
-
Product format - 1 , 5 , 10 , 30 cc syringes - 2 Kg can -
-
Specific gravity g / cm3 2.3 2.4 2.2 2.2 8

Viscosity (X) Pa·s 300 50 250 35

Volume resistivity (XX) Ω · cm 1013 1013 1010 -

Thermal resistance (*) °C / W 0.06 0.05 0.04 0.04

Thermal resistance (**) °C / W 0.14 0.11 - -

Thermal conductivity W / (m·K) 5 5 6.5 6.5

(X) Denka standard test method (XX) JIS C2123 test method
(**) modified ASTM D5470 (at 20 psi, 1cm2)
(*) modified ASTM D5470 (at 60 psi, 1cm2)

■ Thermal resistance measurement (modified ASTM D5470)

Thermal TJ - TCOOL (°C)

resistance =
(°C / W)
Heat transfer amount (W)

12

Section C: DENKA Phase Change Materials 2007.1

Technical Information

In these days, especially as being represented by the CPUs for notebook personal computers, heat
radiation amount from electronic components has been increasing almost proportional to their functional
improvement. DENKA phase-change type materials are the products with the ceramic powder
manufactured by our firm. The ceramic powder is densely filled and finely dispersed in polymers, then,
processed into a shape of sheet for easy handling. As a result of utilizing the excellent heat conduction
characteristics of ceramic powder, our phase-change type materials are able to show the good heat
radiation and can be used for a variety of electronic components.

■ PCA

PCA grades are phase change materials with no silicone that exhibit high thermal property similar to GFC
compounds. PCA grades are especially designed for high-performance semi-conductor elements such as
MPU, SRAM, etc. It provides excellent thermal conductivity.
PCA-Y grades consist of a phase change film on one side of a conformable metal foil carrier (normally,
Aluminium). So, since one side is non-sticking, detaching the heat-sink is easy.

table: general properties of PCA and PCA-Y grades

Item unit PCA-A8A PCA-B6 PCA-E2 PCA-Y9 PCA-Y11

Color - light blue grey grey light purple

Thickness mm 0.15 , 0.25 0.15 0.15 , 0.25 0.15 + 0.03Al

Specific gravity g / cm3 2.4 2.8 2.7 2.2 2.7

Volume resistivity 1013 Ω·cm 1 11 11

Phase change temp. °C 50 50 45 50 50

Thermal resistance (*) °C / W 0.14 0.10 0.07 0.34 0.17

Thermal resistance (**) °C / W 0.09 0.09 0.04 0.20 0.14

Thermal conductivity (X) W / (m·K) 2.9 6.5 - 2.8 4.9

(*) thermal resistance: Modified ASTM D5470 (at 60 psi, 1cm2) (X) thermal conductivity: Modified ASTM D5470 (at 15 mm, 100 µ m)
(**) thermal resistance: Modified ASTM D5470 (at 100 psi, 1cm2)

figure: provision of PCA and PCA-Y grades

PCA GRADE PCA-Y GRADE

Cover film Cover film

Base film Phase Change Material Aluminium foil Phase Change Material 13

Section C: DENKA Phase Change Materials 2007.1

Technical Information

■ Usage of PCA series’ Phase Change Materials

Pressure
Fin

Heat
(about 60°C)

Chip Phase Change Material

■ Usage of PCA-Y series’ Phase Change Materials

Metal foil Fin Pressure

Heat
(about 60°C)

Chip

Phase Change Material

Rework is easy

14

Section C: DENKA Elethermal Adhesive Tape 2007.1

Technical Information

Elethermal DKN is a thermally conductive sheet made of acrylic-polymer; it is an excellent sticky sheet
with thermal conductivity like the double-coated adhesive tape. Elethermal DKN is a silicon free and halogen
free materials, and the flame resisting(UL-94) is VTM-0 level.

table: general properties of DKN grades

Item unit DKN-100P DKN-250P DKN300 DKN500

Characteristic - very sticky sticky

Color - white

Thickness mm 0.10 0.25 0.3 0 0.50

Dielectric breakdown voltage KV AC 1.5 - 5 7
Hardness shore A
35 35 60 60

Sticky strength to Aluminum plate N/10mm 5.5 5.5 0.7 0.7

Thermal conductivity W / (m·K) 1.0 1.0 1.0 1.3

Flammability - -- VTM-0 level

■ Application examples Elethermal Heat sink
IC Chip 15
LED
I.M.S.

Elethermal
Metal casing

DENKA Thermal Interface Materials 2007.1

Technical Information

■ Concept chart of Thermal Interface Materials

Grease , Adheshive Film , Pad Phase Change

Pressure Pressure Heat and Pressure
Distributor:

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